Integrated circuit, hybrid, and multichip module package design guidelines: a focus on reliability
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
New York, NY [u.a.]
Wiley
1993
|
| Schlagworte: | |
| Beschreibung: | XXXI, 426 S. graph. Darst. |
| ISBN: | 0471594466 |
Internformat
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| 100 | 1 | |a Pecht, Michael |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Integrated circuit, hybrid, and multichip module package design guidelines |b a focus on reliability |c Michael Pecht |
| 264 | 1 | |a New York, NY [u.a.] |b Wiley |c 1993 | |
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Datensatz im Suchindex
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| author | Pecht, Michael |
| author_facet | Pecht, Michael |
| author_role | aut |
| author_sort | Pecht, Michael |
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| building | Verbundindex |
| bvnumber | BV023807702 |
| ctrlnum | (OCoLC)246913731 (DE-599)BVBBV023807702 |
| format | Book |
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| id | DE-604.BV023807702 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T21:37:15Z |
| institution | BVB |
| isbn | 0471594466 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-017449872 |
| oclc_num | 246913731 |
| open_access_boolean | |
| owner | DE-634 |
| owner_facet | DE-634 |
| physical | XXXI, 426 S. graph. Darst. |
| publishDate | 1993 |
| publishDateSearch | 1993 |
| publishDateSort | 1993 |
| publisher | Wiley |
| record_format | marc |
| spelling | Pecht, Michael Verfasser aut Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Michael Pecht New York, NY [u.a.] Wiley 1993 XXXI, 426 S. graph. Darst. txt rdacontent n rdamedia nc rdacarrier Bonden (DE-588)4232594-8 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 s Verbindungstechnik (DE-588)4129183-9 s 1\p DE-604 Bonden (DE-588)4232594-8 s 2\p DE-604 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Pecht, Michael Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Bonden (DE-588)4232594-8 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Verbindungstechnik (DE-588)4129183-9 gnd |
| subject_GND | (DE-588)4232594-8 (DE-588)4027242-4 (DE-588)4129183-9 |
| title | Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability |
| title_auth | Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability |
| title_exact_search | Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability |
| title_full | Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Michael Pecht |
| title_fullStr | Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Michael Pecht |
| title_full_unstemmed | Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Michael Pecht |
| title_short | Integrated circuit, hybrid, and multichip module package design guidelines |
| title_sort | integrated circuit hybrid and multichip module package design guidelines a focus on reliability |
| title_sub | a focus on reliability |
| topic | Bonden (DE-588)4232594-8 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Verbindungstechnik (DE-588)4129183-9 gnd |
| topic_facet | Bonden Integrierte Schaltung Verbindungstechnik |
| work_keys_str_mv | AT pechtmichael integratedcircuithybridandmultichipmodulepackagedesignguidelinesafocusonreliability |