Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects:
Saved in:
| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2007
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| Subjects: | |
| Online Access: | Volltext Volltext |
| Item Description: | Auch als Internetausgabe |
| Physical Description: | VIII, 111 S. Ill., graph. Darst. 28 cm |
Staff View
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Record in the Search Index
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| spelling | Meyer, Moritz Andreas 1974- Verfasser (DE-588)133393062 aut Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects Moritz Andreas Meyer 2007 VIII, 111 S. Ill., graph. Darst. 28 cm txt rdacontent n rdamedia nc rdacarrier Auch als Internetausgabe Cottbus, Techn. Univ., Diss., 2007 Elektromigration (DE-588)4296761-2 gnd rswk-swf (DE-588)4113937-9 Hochschulschrift gnd-content Elektromigration (DE-588)4296761-2 s DE-604 Elektronische Reproduktion urn:nbn:de:kobv:co1-opus-3509 http://opus.kobv.de/btu/volltexte/2007/350/ Volltext https://nbn-resolving.org/urn:nbn:de:kobv:co1-opus-3509 Volltext |
| spellingShingle | Meyer, Moritz Andreas 1974- Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects Elektromigration (DE-588)4296761-2 gnd |
| subject_GND | (DE-588)4296761-2 (DE-588)4113937-9 |
| title | Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects |
| title_auth | Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects |
| title_exact_search | Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects |
| title_full | Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects Moritz Andreas Meyer |
| title_fullStr | Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects Moritz Andreas Meyer |
| title_full_unstemmed | Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects Moritz Andreas Meyer |
| title_short | Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects |
| title_sort | effects of advanced process approaches on electromigration degradation of cu on chip interconnects |
| topic | Elektromigration (DE-588)4296761-2 gnd |
| topic_facet | Elektromigration Hochschulschrift |
| url | http://opus.kobv.de/btu/volltexte/2007/350/ https://nbn-resolving.org/urn:nbn:de:kobv:co1-opus-3509 |
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