Meyer, M. A. (2007). Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects.
Chicago Style (17th ed.) CitationMeyer, Moritz Andreas. Effects of Advanced Process Approaches on Electromigration Degradation of Cu On-chip Interconnects. 2007.
MLA (9th ed.) CitationMeyer, Moritz Andreas. Effects of Advanced Process Approaches on Electromigration Degradation of Cu On-chip Interconnects. 2007.
Warning: These citations may not always be 100% accurate.