Integrated circuit packaging, assembly and interconnections:
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Bibliographic Details
Main Author: Greig, William J. (Author)
Format: Electronic eBook
Language:English
Published: New York Springer 2007
Subjects:
Online Access:UBT01
Volltext
Physical Description:1 Online-Ressource (XXIV, 296 Seiten) Illustrationen
ISBN:9780387339139
DOI:10.1007/0-387-33913-2

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