Bonding in microsystem technology:
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
[Berlin]
Springer
2006
|
| Schriftenreihe: | Springer series in advanced microelectronics
24 |
| Schlagworte: | |
| Online-Zugang: | BTU01 FHR01 Volltext |
| Beschreibung: | 1 Online-Ressource |
| ISBN: | 9781402045899 |
| DOI: | 10.1007/1-4020-4589-1 |
Internformat
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Datensatz im Suchindex
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| discipline_str_mv | Maschinenbau / Maschinenwesen Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/1-4020-4589-1 |
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| illustrated | Not Illustrated |
| index_date | 2024-07-02T19:42:34Z |
| indexdate | 2024-07-09T21:10:53Z |
| institution | BVB |
| isbn | 9781402045899 |
| language | English |
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| publishDate | 2006 |
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| publisher | Springer |
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| series | Springer series in advanced microelectronics |
| series2 | Springer series in advanced microelectronics |
| spelling | Bonding in microsystem technology J. A. Dziuban [Berlin] Springer 2006 1 Online-Ressource txt rdacontent c rdamedia cr rdacarrier Springer series in advanced microelectronics 24 Bonden (DE-588)4232594-8 gnd rswk-swf Mikrosystemtechnik (DE-588)4221617-5 gnd rswk-swf Bonden (DE-588)4232594-8 s Mikrosystemtechnik (DE-588)4221617-5 s DE-604 Dziuban, Jan A. Sonstige oth Erscheint auch als Druckausgabe 978-1-4020-4578-3 Springer series in advanced microelectronics 24 (DE-604)BV041461435 24 https://doi.org/10.1007/1-4020-4589-1 Verlag Volltext |
| spellingShingle | Bonding in microsystem technology Springer series in advanced microelectronics Bonden (DE-588)4232594-8 gnd Mikrosystemtechnik (DE-588)4221617-5 gnd |
| subject_GND | (DE-588)4232594-8 (DE-588)4221617-5 |
| title | Bonding in microsystem technology |
| title_auth | Bonding in microsystem technology |
| title_exact_search | Bonding in microsystem technology |
| title_exact_search_txtP | Bonding in microsystem technology |
| title_full | Bonding in microsystem technology J. A. Dziuban |
| title_fullStr | Bonding in microsystem technology J. A. Dziuban |
| title_full_unstemmed | Bonding in microsystem technology J. A. Dziuban |
| title_short | Bonding in microsystem technology |
| title_sort | bonding in microsystem technology |
| topic | Bonden (DE-588)4232594-8 gnd Mikrosystemtechnik (DE-588)4221617-5 gnd |
| topic_facet | Bonden Mikrosystemtechnik |
| url | https://doi.org/10.1007/1-4020-4589-1 |
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