Adhesives technology for electronic applications: materials, processes, reliability
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Norwich, NY
Andrew
2005
|
| Schriftenreihe: | Materials and processes for electronic applications series
|
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | 1 Online-Ressource |
| ISBN: | 0815515138 9780815515135 9781591249429 |
Internformat
MARC
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| 245 | 1 | 0 | |a Adhesives technology for electronic applications |b materials, processes, reliability |c by James J. Licari and Dale W. Swanson |
| 264 | 1 | |a Norwich, NY |b Andrew |c 2005 | |
| 300 | |a 1 Online-Ressource | ||
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| 490 | 0 | |a Materials and processes for electronic applications series | |
| 500 | |a Includes bibliographical references and index | ||
| 650 | 4 | |a Electronics |x Materials | |
| 650 | 4 | |a Adhesives | |
| 650 | 4 | |a Electronic packaging | |
| 650 | 0 | 7 | |a Adhäsion |0 (DE-588)4000493-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektroniktechnologie |0 (DE-588)4402723-0 |2 gnd |9 rswk-swf |
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| 689 | 0 | 1 | |a Adhäsion |0 (DE-588)4000493-4 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Licari, James J. |e Sonstige |4 oth | |
| 700 | 1 | |a Swanson, Dale W. |e Sonstige |4 oth | |
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Datensatz im Suchindex
| _version_ | 1806054885095899136 |
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| callnumber-label | TK7871 |
| callnumber-raw | TK7871 |
| callnumber-search | TK7871 |
| callnumber-sort | TK 47871 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| collection | ZDB-10-ESC |
| ctrlnum | (OCoLC)845653781 (DE-599)BVBBV023030539 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV023030539 |
| illustrated | Not Illustrated |
| index_date | 2024-07-02T19:16:50Z |
| indexdate | 2024-07-31T01:09:17Z |
| institution | BVB |
| isbn | 0815515138 9780815515135 9781591249429 |
| language | English |
| lccn | 2005012647 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-016234433 |
| oclc_num | 845653781 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | 1 Online-Ressource |
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| publishDate | 2005 |
| publishDateSearch | 2005 |
| publishDateSort | 2005 |
| publisher | Andrew |
| record_format | marc |
| series2 | Materials and processes for electronic applications series |
| spelling | Adhesives technology for electronic applications materials, processes, reliability by James J. Licari and Dale W. Swanson Norwich, NY Andrew 2005 1 Online-Ressource txt rdacontent c rdamedia cr rdacarrier Materials and processes for electronic applications series Includes bibliographical references and index Electronics Materials Adhesives Electronic packaging Adhäsion (DE-588)4000493-4 gnd rswk-swf Elektroniktechnologie (DE-588)4402723-0 gnd rswk-swf Elektroniktechnologie (DE-588)4402723-0 s Adhäsion (DE-588)4000493-4 s DE-604 Licari, James J. Sonstige oth Swanson, Dale W. Sonstige oth http://www.knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=1279 Volltext |
| spellingShingle | Adhesives technology for electronic applications materials, processes, reliability Electronics Materials Adhesives Electronic packaging Adhäsion (DE-588)4000493-4 gnd Elektroniktechnologie (DE-588)4402723-0 gnd |
| subject_GND | (DE-588)4000493-4 (DE-588)4402723-0 |
| title | Adhesives technology for electronic applications materials, processes, reliability |
| title_auth | Adhesives technology for electronic applications materials, processes, reliability |
| title_exact_search | Adhesives technology for electronic applications materials, processes, reliability |
| title_exact_search_txtP | Adhesives technology for electronic applications materials, processes, reliability |
| title_full | Adhesives technology for electronic applications materials, processes, reliability by James J. Licari and Dale W. Swanson |
| title_fullStr | Adhesives technology for electronic applications materials, processes, reliability by James J. Licari and Dale W. Swanson |
| title_full_unstemmed | Adhesives technology for electronic applications materials, processes, reliability by James J. Licari and Dale W. Swanson |
| title_short | Adhesives technology for electronic applications |
| title_sort | adhesives technology for electronic applications materials processes reliability |
| title_sub | materials, processes, reliability |
| topic | Electronics Materials Adhesives Electronic packaging Adhäsion (DE-588)4000493-4 gnd Elektroniktechnologie (DE-588)4402723-0 gnd |
| topic_facet | Electronics Materials Adhesives Electronic packaging Adhäsion Elektroniktechnologie |
| url | http://www.knovel.com/web/portal/browse/display?_EXT_KNOVEL_DISPLAY_bookid=1279 |
| work_keys_str_mv | AT licarijamesj adhesivestechnologyforelectronicapplicationsmaterialsprocessesreliability AT swansondalew adhesivestechnologyforelectronicapplicationsmaterialsprocessesreliability |