Comprehensive microsystems: 1 Materials, fabrication and packaging, electronics and systems design
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Amsterdam [u.a.]
Elsevier
2008
|
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | XXI, 583 S. Ill., graph. Darst. |
| ISBN: | 9780444521910 |
Internformat
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Datensatz im Suchindex
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| adam_text | COMPREHENSIVE MICROSYSTEMS VOLUME 1 MATERIALS FABRICATION AND PACKAGING
ELECTRONICS AND SYSTEMS DESIGN EDITORS-IN-CHIEF YOGESH B. GIANCHANDANI
UNIVERSITY OF MICHIGAN, EECS DEPARTMENT, MICHIGAN, USA OSAMU TABATA
KYOTO UNIVERSITY, DEPARTMENT OF MICRO ENGINEERING KYOTO, JAPAN HANS
ZAPPE UNIVERSITY OF FREIBURG DEPARTMENT OF MICROSYSTEMS ENGINEERING
FREIBURG GERMANY ELSEVIER AMSTERDAM BOSTON HEIDELBERG LONDON NEW YORK
OXFORD PARIS SAN DIEGO SAN FRANCISCO SINGAPORE SYDNEY TOKYO CONTENTS
FOREWORD VII PREFACE IX EDITORS-IN-CHIEF XI ACKNOWLEDGMENTS XV
CONTRIBUTORS/TO VOLUME 1 XVII CONTENTS OF ALTVOLUMES XX MATERIALS 1.01
SILICON AND RELATED MATERIALS 1 TOSHIYUKI TSUCHIYA, KYOTO UNIVERSITY,
KYOTO, JAPAN 1.02 COMPOUND SEMICONDUCTORS 25 NETHAJI DHARMARASU AND
HARTMUT HILLMER, INSTITUTE OFNANOSTRUCTURE TECHNOLOGIES AND ANALYTICS
(INA) AND CENTER FOR INTERDISCIPLINARY NANOSTRUCTURE SCIENCE AND
TECHNOLOGY (CINSAT), UNIVERSITY OF KASSEL, GERMANY 1.03 METALS AND
ALLOYS 53 KAZUKI TAKASHIMA, KUMAMOTO UNIVERSITY, KUMAMOTO, JAPAN, AND
AKIRA ISHIDA, NATIONAL INSTITUTE FOR MATERIALS SCIENCE, IBARAKI, JAPAN
1.04 POLYMERS 75 PONNAMBALAM RAVI SELVAGANAPATHY, MCMASTER UNIVERSITY,
HAMILTON, ON, CANADA 1.05 BIOCOMPATIBILITY OF MICROSYSTEMS 107 JUERGEN
RUEHE AND MARKUS BIESALSKI, DEPARTMENT OF MICROSYSTEMS ENGINEERING-
IMTEK, UNIVERSITY OF FREIBURG, FREIBURG, GERMANY 1.06 HARSH ENVIRONMENT
MATERIALS 131 ERHARD KOHN, UNIVERSITY OFULM, ULM, GERMANY FABRICATION
AND PACKAGING 1.07 WETETCHING 183 KAZUO SATO AND MITSUHIRO SHIKIDA,
DEPARTMENT OF MICRO-NANO SYSTEMS ENGINEERING, NAGOYA UNIVERSITY, AICHI,
JAPAN 1.08 DRYETCHING 217 FRANZ LAERMER, CORPORATE SECTOR RESEARCH AND
ADVANCE ENGINEERING, ROBERT BOSCH GMBH, STUTTGART, GERMANY VI CONTENTS
1.09 WAFER BONDING 235 KHALIL NAJAFI, TIMOTHY J. HARPSTER, HANSEUP KIM,
JA Y S. MITCHELL, AND WARREN C. WELCH III, CENTER FOR WIRELESS
INTEGRATED MICROSYSTEMS (WIMS), UNIVERSITY OF MICHIGAN, ANN ARBOR, MI,
USA 1.10 ELECTRODEPOSITION 271 MATTHEW W. LOSEY, TOUCHDOWN TECHNOLOGIES,
BALDWIN PARK, CA, USA, AND JAMES J. KELLY, IBM/TJ WATSON RESEARCH
CENTER, YORKTOWN HEIGHTS, NY, USA 1.11 LIGA 293 ULRIKE WALLRABE AND JAN
KORVINK, DEPARTMENT OF MICROSYSTEMS ENGINEERING- IMTEK, UNIVERSITY OF
FREIBURG, FREIBURG, GERMANY JUERGEN MOHR, INSTITUTE FOR MICROSTRUCTURE
TECHNOLOGY, KARLSRUHE, GERMANY 1.12 LOW-COST MEMS TECHNOLOGIES 341 BRUCE
K. GALE, MARK A. EDDINGS, SCOTT O. SUNDBERG, ANDREW HATCHJUNGKYU KIM,
AND TAMMY HO, DEPARTMENT OF MECHANICAL ENGINEERING, SALT LAKE CITY, UT,
USA 1.13 MICROMACHINING 379 HOLGER REINECKE AND CLAAS MUELLER, DEPARTMENT
OF MICROSYSTEMS ENGINEERING * IMTEK, UNIVERSITY OF FREIBURG, FREIBURG,
GERMANY 1.14 SELF-ASSEMBLY 403 JIANDONG FANG AND KARL F BOEHRINGER,
UNIVERSITY OF WASHINGTON, SEATTLE, WA, USA 1.15 PACKAGING 431 O. BRAND,
GEORGIA INSTITUTE OF TECHNOLOGY, ATLANTA, GA, USA ELECTRONICS AND
SYSTEMS DESIGN 1.16 INTERFACE CIRCUITS 465 M. ORTMANNS, A. BUHMANN, AND
Y. MANOLI, DEPARTMENT OF MICROSYSTEMS ENGINEERING * IMTEK, UNIVERSITY OF
FREIBURG, FREIBURG, GERMANY 1.17 TESTING, CALIBRATION AND COMPENSATION
495 JUERGEN WILDE AND LEONHARD REINDL, DEPARTMENT OF MICROSYSTEMS
ENGINEERING - IMTEK, UNIVERSITY OF FREIBURG, FREIBURG, GERMANY CRAIG
STEWART, CANDIM CONSULTING LTD, BLOXHAM, UK 1.18 MULTIPHYSICS AND
MULTISCALE SIMULATION 539 J. G. KORVINK, A. GREINER, AND Z. LIU,
DEPARTMENT OF MICROSYSTEMS ENGINEERING- IMTEK, UNIVERSITY OF FREIBURG,
FREIBURG, GERMANY 1.19 SYSTEMATIC SYNTHESIS METHODS 559 G. K.
ANANTHASURESH, MECHANICAL ENGINEERING, INDIAN INSTITUTE OF SCIENCE,
BANGALORE, INDIA
|
| adam_txt |
COMPREHENSIVE MICROSYSTEMS VOLUME 1 MATERIALS FABRICATION AND PACKAGING
ELECTRONICS AND SYSTEMS DESIGN EDITORS-IN-CHIEF YOGESH B. GIANCHANDANI
UNIVERSITY OF MICHIGAN, EECS DEPARTMENT, MICHIGAN, USA OSAMU TABATA
KYOTO UNIVERSITY, DEPARTMENT OF MICRO ENGINEERING KYOTO, JAPAN HANS
ZAPPE UNIVERSITY OF FREIBURG DEPARTMENT OF MICROSYSTEMS ENGINEERING
FREIBURG GERMANY ELSEVIER AMSTERDAM BOSTON HEIDELBERG LONDON NEW YORK
OXFORD PARIS SAN DIEGO SAN FRANCISCO SINGAPORE SYDNEY TOKYO CONTENTS
FOREWORD VII PREFACE IX EDITORS-IN-CHIEF XI ACKNOWLEDGMENTS XV
CONTRIBUTORS/TO VOLUME 1 XVII CONTENTS OF ALTVOLUMES XX MATERIALS 1.01
SILICON AND RELATED MATERIALS 1 TOSHIYUKI TSUCHIYA, KYOTO UNIVERSITY,
KYOTO, JAPAN 1.02 COMPOUND SEMICONDUCTORS 25 NETHAJI DHARMARASU AND
HARTMUT HILLMER, INSTITUTE OFNANOSTRUCTURE TECHNOLOGIES AND ANALYTICS
(INA) AND CENTER FOR INTERDISCIPLINARY NANOSTRUCTURE SCIENCE AND
TECHNOLOGY (CINSAT), UNIVERSITY OF KASSEL, GERMANY 1.03 METALS AND
ALLOYS 53 KAZUKI TAKASHIMA, KUMAMOTO UNIVERSITY, KUMAMOTO, JAPAN, AND
AKIRA ISHIDA, NATIONAL INSTITUTE FOR MATERIALS SCIENCE, IBARAKI, JAPAN
1.04 POLYMERS 75 PONNAMBALAM RAVI SELVAGANAPATHY, MCMASTER UNIVERSITY,
HAMILTON, ON, CANADA 1.05 BIOCOMPATIBILITY OF MICROSYSTEMS 107 JUERGEN
RUEHE AND MARKUS BIESALSKI, DEPARTMENT OF MICROSYSTEMS ENGINEERING-
IMTEK, UNIVERSITY OF FREIBURG, FREIBURG, GERMANY 1.06 HARSH ENVIRONMENT
MATERIALS 131 ERHARD KOHN, UNIVERSITY OFULM, ULM, GERMANY FABRICATION
AND PACKAGING 1.07 WETETCHING 183 KAZUO SATO AND MITSUHIRO SHIKIDA,
DEPARTMENT OF MICRO-NANO SYSTEMS ENGINEERING, NAGOYA UNIVERSITY, AICHI,
JAPAN 1.08 DRYETCHING 217 FRANZ LAERMER, CORPORATE SECTOR RESEARCH AND
ADVANCE ENGINEERING, ROBERT BOSCH GMBH, STUTTGART, GERMANY VI CONTENTS
1.09 WAFER BONDING 235 KHALIL NAJAFI, TIMOTHY J. HARPSTER, HANSEUP KIM,
JA Y S. MITCHELL, AND WARREN C. WELCH III, CENTER FOR WIRELESS
INTEGRATED MICROSYSTEMS (WIMS), UNIVERSITY OF MICHIGAN, ANN ARBOR, MI,
USA 1.10 ELECTRODEPOSITION 271 MATTHEW W. LOSEY, TOUCHDOWN TECHNOLOGIES,
BALDWIN PARK, CA, USA, AND JAMES J. KELLY, IBM/TJ WATSON RESEARCH
CENTER, YORKTOWN HEIGHTS, NY, USA 1.11 LIGA 293 ULRIKE WALLRABE AND JAN
KORVINK, DEPARTMENT OF MICROSYSTEMS ENGINEERING- IMTEK, UNIVERSITY OF
FREIBURG, FREIBURG, GERMANY JUERGEN MOHR, INSTITUTE FOR MICROSTRUCTURE
TECHNOLOGY, KARLSRUHE, GERMANY 1.12 LOW-COST MEMS TECHNOLOGIES 341 BRUCE
K. GALE, MARK A. EDDINGS, SCOTT O. SUNDBERG, ANDREW HATCHJUNGKYU KIM,
AND TAMMY HO, DEPARTMENT OF MECHANICAL ENGINEERING, SALT LAKE CITY, UT,
USA 1.13 MICROMACHINING 379 HOLGER REINECKE AND CLAAS MUELLER, DEPARTMENT
OF MICROSYSTEMS ENGINEERING * IMTEK, UNIVERSITY OF FREIBURG, FREIBURG,
GERMANY 1.14 SELF-ASSEMBLY 403 JIANDONG FANG AND KARL F BOEHRINGER,
UNIVERSITY OF WASHINGTON, SEATTLE, WA, USA 1.15 PACKAGING 431 O. BRAND,
GEORGIA INSTITUTE OF TECHNOLOGY, ATLANTA, GA, USA ELECTRONICS AND
SYSTEMS DESIGN 1.16 INTERFACE CIRCUITS 465 M. ORTMANNS, A. BUHMANN, AND
Y. MANOLI, DEPARTMENT OF MICROSYSTEMS ENGINEERING * IMTEK, UNIVERSITY OF
FREIBURG, FREIBURG, GERMANY 1.17 TESTING, CALIBRATION AND COMPENSATION
495 JUERGEN WILDE AND LEONHARD REINDL, DEPARTMENT OF MICROSYSTEMS
ENGINEERING - IMTEK, UNIVERSITY OF FREIBURG, FREIBURG, GERMANY CRAIG
STEWART, CANDIM CONSULTING LTD, BLOXHAM, UK 1.18 MULTIPHYSICS AND
MULTISCALE SIMULATION 539 J. G. KORVINK, A. GREINER, AND Z. LIU,
DEPARTMENT OF MICROSYSTEMS ENGINEERING- IMTEK, UNIVERSITY OF FREIBURG,
FREIBURG, GERMANY 1.19 SYSTEMATIC SYNTHESIS METHODS 559 G. K.
ANANTHASURESH, MECHANICAL ENGINEERING, INDIAN INSTITUTE OF SCIENCE,
BANGALORE, INDIA |
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| spellingShingle | Comprehensive microsystems |
| title | Comprehensive microsystems |
| title_auth | Comprehensive microsystems |
| title_exact_search | Comprehensive microsystems |
| title_exact_search_txtP | Comprehensive microsystems |
| title_full | Comprehensive microsystems 1 Materials, fabrication and packaging, electronics and systems design ed.-in-chief Yogesh B. Gianchandani ... |
| title_fullStr | Comprehensive microsystems 1 Materials, fabrication and packaging, electronics and systems design ed.-in-chief Yogesh B. Gianchandani ... |
| title_full_unstemmed | Comprehensive microsystems 1 Materials, fabrication and packaging, electronics and systems design ed.-in-chief Yogesh B. Gianchandani ... |
| title_short | Comprehensive microsystems |
| title_sort | comprehensive microsystems materials fabrication and packaging electronics and systems design |
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