Multilayered low temperature cofired ceramics (LTCC) technology:
Gespeichert in:
| 1. Verfasser: | |
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| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
New York, NY
Springer
2005
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| Schlagworte: | |
| Online-Zugang: | Inhaltstext Inhaltsverzeichnis |
| Beschreibung: | XXX, 229 S. Ill., graph. Darst. |
| ISBN: | 0387231307 |
Internformat
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Datensatz im Suchindex
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| adam_text | MULTILAYERED LOW TEMPERATURE COFIRED CERAMICS (LTCC) TECHNOLOGY
YOSHIHIKO IMANAKA FUJITSU LABORATORIES, LTD. JAPAN SPRINGE] CONTENTS
DEDICATION V LIST OF FIGURES XI LIST OF TABLES XXV PREFACE XXIX
ACKNOWLEDGMENTS XXXI 1. INTRODUCTION 1 1.1 BRIEF HISTORICAL REVIEW 2 1.2
TYPICAL MATERIAL 4 1.3 TYPICAL MANUFACTURING PROCESS 4 1.4 TYPICAL
PRODUCT TYPES 5 1.5 CHARACTERISTICS OF LTCC 6 1.5.1 HIGH FREQUENCY
CHARACTERISTICS 6 1.5.2 THERMAL STABILITY 9 (LOW THERMAL EXPANSION, GOOD
THERMAL RESISTANCE) 1.5.3 INTEGRATION OF PASSIVE COMPONENTS 10 1.6
TRENDS IN MATERIALS DEVELOPED BY RELEVANT COMPANIES 11 1.7 SUBJECT OF
THE BOOK 12 REFERENCES 16 PART 1 MATERIAL TECHNOLOGY 19 2. CERAMIC
MATERIAL 21 2.1 INTRODUCTION 21 2.2 LOW TEMPERATURE FIRING 23 2.2.1
FLUIDITY OF GLASS 24 2.2.2 CRYSTALLIZATION OF GLASS 26 2.2.3 FOAMINGOF
GLASS 33 2.2.4 REACTION BETWEEN GLASS AND CERAMIC 36 2.3 DIELECTRIC
CHARACTERISTICS 36 2.3.1 DIELECTRIC CONSTANT 36 2.3.2 DIELECTRIC LOSS 41
2.4 THERMAL EXPANSION 42 2.5 MECHANICAL STRENGTH 45 VIII MULTILAYERED
LTCC TECHNOLOGY 2.5.1 STRENGTHENING THE GLASS PHASE 47 2.5.2 THERMAL
SHOCK RESISTANCE 51 2.6 THERMAL CONDUCTIVITY 54 REFERENCES 55 3.
CONDUCTING MATERIAL 59 3.1 INTRODUCTION 59 3.2 CONDUCTIVE PASTE
MATERIALS 61 3.3 METALLIZATION METHODS FOR ALUMINA CERAMICS 62 3.3.1
THICK FILM METALLIZATION 62 3.3.1.1 HIGH TEMPERATURE PROCESS TYPE 62
(MO-MN METHOD) 3.3.1.2 LOW TEMPERATURE PROCESS TYPE 63 3.3.2 COFIRING
METALLIZATION 64 3.3.2.1 METALLIZATION FOR HTCC 66 3.4 CONDUCTIVITY 66
3.5 SUITABILITY FOR CO-SINTERING 68 3.6 ADHERENCE 72 3.7 MIGRATION
RESISTANCE 74 3.8 BONDABILITY 78 (SOLDER WETABILITY AND WIRE
BONDABILITY) REFERENCES 79 4. RESISTOR MATERIALS AND HIGH K DIELECTRIC
MATERIALS 83 4.1 INTRODUCTION 83 4.2 RESISTOR MATERIALS 84 4.2.1
RUTHENIUM OXIDE/GLASS MATERIAL 87 4.2.2 THE THERMAL STABILITY
OFRUTHENIUM OXIDE 89 4.3 HIGH K DIELECTRIC MATERIAL 92 4.3.1 ISSUES WITH
LOW OXYGEN PARTIAL PRESSURE 93 ATMOSPHERE FIRING (POINT DEFECTS AND
SEMICONDUCTOR FORMATION) REFERENCES 98 PART 2 PROCESS TECHNOLOGY 10 1 5.
POWDER PREPARATION AND MIXING 103 5.1 INTRODUCTION 103 5.2 INORGANIC
CERAMIC MATERIALS 104 5.3 ORGANIC MATERIALS 105 5.3.1 BINDER 106 5.3.2
PLASTICIZER 108 5.3.3 DISPERSING AGENT AND DISPERSIBILITY OF SLURRY 110
REFERENCES 114 CONTENTS IX 6. CASTING 115 6.1 INTRODUCTION 115 6.2
CASTING EQUIPMENT 115 6.3 SLURRY CHARACTERISTICS 117 6.4 GREEN SHEET 120
6.4.1 CHARACTERISTICS REQUIRED OF GREEN SHEETS 120 6.4.2 GREEN SHEET
EVALUATION METHODS 121 6.4.3 VARIOUS FACTORS AFFECTING THE
CHARACTERISTICS OF 126 GREEN SHEETS 6.4.4 GREEN SHEET MICROSTRUCTURE 136
6.4.5 GREEN SHEET DIMENSIONAL STABILITY 140 6.5 VIA HOLE PUNCHING 142
REFERENCES 143 7. PRINTING AND LAMINATING 145 7.1 PRINTING 145 7.1.1
SCREEN PRINTING SCREEN SPECIFICATIONS 147 7.1.2 PRINTING PROCESS
CONDITIONS 147 7.1.3 PASTE CHARACTERISTICS 149 7.1.4 GREEN SHEET
CHARACTERISTICS 152 7.2 VIA ALLING 152 7.3 LAMINATING 154 7.3.1
LAMINATING PROCESS TECHNOLOGIES 154 7.3.2 FAULTS ARISING IN THE
LAMINATING PROCESS 157 7.3.3 PREVENTING DELAMINATION 162 REFERENCES 165
8.COFIRING 167 8.1 SINTERING THE COPPER 169 8.2 CONTROLLING FIRING
SHRINKAGE 169 8.3 MISMATCHES OF FIRING BEHAVIOR AND FIRING SHRINKAGE 174
RATE 8.4 ACHIEVING BOTH ANTIOXIDATION OF THE COPPER AND 180 ELIMINATION
OF BINDER 8.5 NON-SHRINKAGE PROCESS 189 8.6 COFIRING PROCESS AND FUTURE
LTCCS 190 REFERENCES 191 9. RELIABILITY 193 9.1 THERMAL SHOCKOF LTCCS
195 9.2 THERMAL EXPANSION AND RESIDUAL STRESS OF LTCCS 196 9.3 THERMAL
CONDUCTIVITY OF LTCCS 200 REFERENCES 201 X MULTILAYERED LTCC TECHNOLOGY
10. FUTURE OF LTCCS 203 10.1 INTRODUCTION 204 10.2 TECHNOLOGY
DEVELOPMENT OF LTCCS FOR THE FUTURE 204 10.2.1 MATERIALS TECHNOLOGY
DEVELOPMENT 208 10.2.2 PROCESS TECHNOLOGIES 210 10.3 BACKGROUNDOF
POST-LTCC TECHNOLOGY 210 10.3.1 AD PROCESS AS A POST-LTCC TECHNOLOGY
10.3.2 CURRENT AND FUTURE STATE OF DEVELOPMENT 214 OF AD CERAMICFILM 217
ACKNOWLEDGEMENT 217 REFERENCES INDEX 219
|
| adam_txt |
MULTILAYERED LOW TEMPERATURE COFIRED CERAMICS (LTCC) TECHNOLOGY
YOSHIHIKO IMANAKA FUJITSU LABORATORIES, LTD. JAPAN SPRINGE] CONTENTS
DEDICATION V LIST OF FIGURES XI LIST OF TABLES XXV PREFACE XXIX
ACKNOWLEDGMENTS XXXI 1. INTRODUCTION 1 1.1 BRIEF HISTORICAL REVIEW 2 1.2
TYPICAL MATERIAL 4 1.3 TYPICAL MANUFACTURING PROCESS 4 1.4 TYPICAL
PRODUCT TYPES 5 1.5 CHARACTERISTICS OF LTCC 6 1.5.1 HIGH FREQUENCY
CHARACTERISTICS 6 1.5.2 THERMAL STABILITY 9 (LOW THERMAL EXPANSION, GOOD
THERMAL RESISTANCE) 1.5.3 INTEGRATION OF PASSIVE COMPONENTS 10 1.6
TRENDS IN MATERIALS DEVELOPED BY RELEVANT COMPANIES 11 1.7 SUBJECT OF
THE BOOK 12 REFERENCES 16 PART 1 MATERIAL TECHNOLOGY 19 2. CERAMIC
MATERIAL 21 2.1 INTRODUCTION 21 2.2 LOW TEMPERATURE FIRING 23 2.2.1
FLUIDITY OF GLASS 24 2.2.2 CRYSTALLIZATION OF GLASS 26 2.2.3 FOAMINGOF
GLASS 33 2.2.4 REACTION BETWEEN GLASS AND CERAMIC 36 2.3 DIELECTRIC
CHARACTERISTICS 36 2.3.1 DIELECTRIC CONSTANT 36 2.3.2 DIELECTRIC LOSS 41
2.4 THERMAL EXPANSION 42 2.5 MECHANICAL STRENGTH 45 VIII MULTILAYERED
LTCC TECHNOLOGY 2.5.1 STRENGTHENING THE GLASS PHASE 47 2.5.2 THERMAL
SHOCK RESISTANCE 51 2.6 THERMAL CONDUCTIVITY 54 REFERENCES 55 3.
CONDUCTING MATERIAL 59 3.1 INTRODUCTION 59 3.2 CONDUCTIVE PASTE
MATERIALS 61 3.3 METALLIZATION METHODS FOR ALUMINA CERAMICS 62 3.3.1
THICK FILM METALLIZATION 62 3.3.1.1 HIGH TEMPERATURE PROCESS TYPE 62
(MO-MN METHOD) 3.3.1.2 LOW TEMPERATURE PROCESS TYPE 63 3.3.2 COFIRING
METALLIZATION 64 3.3.2.1 METALLIZATION FOR HTCC 66 3.4 CONDUCTIVITY 66
3.5 SUITABILITY FOR CO-SINTERING 68 3.6 ADHERENCE 72 3.7 MIGRATION
RESISTANCE 74 3.8 BONDABILITY 78 (SOLDER WETABILITY AND WIRE
BONDABILITY) REFERENCES 79 4. RESISTOR MATERIALS AND HIGH K DIELECTRIC
MATERIALS 83 4.1 INTRODUCTION 83 4.2 RESISTOR MATERIALS 84 4.2.1
RUTHENIUM OXIDE/GLASS MATERIAL 87 4.2.2 THE THERMAL STABILITY
OFRUTHENIUM OXIDE 89 4.3 HIGH K DIELECTRIC MATERIAL 92 4.3.1 ISSUES WITH
LOW OXYGEN PARTIAL PRESSURE 93 ATMOSPHERE FIRING (POINT DEFECTS AND
SEMICONDUCTOR FORMATION) REFERENCES 98 PART 2 PROCESS TECHNOLOGY 10 1 5.
POWDER PREPARATION AND MIXING 103 5.1 INTRODUCTION 103 5.2 INORGANIC
CERAMIC MATERIALS 104 5.3 ORGANIC MATERIALS 105 5.3.1 BINDER 106 5.3.2
PLASTICIZER 108 5.3.3 DISPERSING AGENT AND DISPERSIBILITY OF SLURRY 110
REFERENCES 114 CONTENTS IX 6. CASTING 115 6.1 INTRODUCTION 115 6.2
CASTING EQUIPMENT 115 6.3 SLURRY CHARACTERISTICS 117 6.4 GREEN SHEET 120
6.4.1 CHARACTERISTICS REQUIRED OF GREEN SHEETS 120 6.4.2 GREEN SHEET
EVALUATION METHODS 121 6.4.3 VARIOUS FACTORS AFFECTING THE
CHARACTERISTICS OF 126 GREEN SHEETS 6.4.4 GREEN SHEET MICROSTRUCTURE 136
6.4.5 GREEN SHEET DIMENSIONAL STABILITY 140 6.5 VIA HOLE PUNCHING 142
REFERENCES 143 7. PRINTING AND LAMINATING 145 7.1 PRINTING 145 7.1.1
SCREEN PRINTING SCREEN SPECIFICATIONS 147 7.1.2 PRINTING PROCESS
CONDITIONS 147 7.1.3 PASTE CHARACTERISTICS 149 7.1.4 GREEN SHEET
CHARACTERISTICS 152 7.2 VIA ALLING 152 7.3 LAMINATING 154 7.3.1
LAMINATING PROCESS TECHNOLOGIES 154 7.3.2 FAULTS ARISING IN THE
LAMINATING PROCESS 157 7.3.3 PREVENTING DELAMINATION 162 REFERENCES 165
8.COFIRING 167 8.1 SINTERING THE COPPER 169 8.2 CONTROLLING FIRING
SHRINKAGE 169 8.3 MISMATCHES OF FIRING BEHAVIOR AND FIRING SHRINKAGE 174
RATE 8.4 ACHIEVING BOTH ANTIOXIDATION OF THE COPPER AND 180 ELIMINATION
OF BINDER 8.5 NON-SHRINKAGE PROCESS 189 8.6 COFIRING PROCESS AND FUTURE
LTCCS 190 REFERENCES 191 9. RELIABILITY 193 9.1 THERMAL SHOCKOF LTCCS
195 9.2 THERMAL EXPANSION AND RESIDUAL STRESS OF LTCCS 196 9.3 THERMAL
CONDUCTIVITY OF LTCCS 200 REFERENCES 201 X MULTILAYERED LTCC TECHNOLOGY
10. FUTURE OF LTCCS 203 10.1 INTRODUCTION 204 10.2 TECHNOLOGY
DEVELOPMENT OF LTCCS FOR THE FUTURE 204 10.2.1 MATERIALS TECHNOLOGY
DEVELOPMENT 208 10.2.2 PROCESS TECHNOLOGIES 210 10.3 BACKGROUNDOF
POST-LTCC TECHNOLOGY 210 10.3.1 AD PROCESS AS A POST-LTCC TECHNOLOGY
10.3.2 CURRENT AND FUTURE STATE OF DEVELOPMENT 214 OF AD CERAMICFILM 217
ACKNOWLEDGEMENT 217 REFERENCES INDEX 219 |
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| spelling | Imanaka, Yoshihiko Verfasser aut Multilayered low temperature cofired ceramics (LTCC) technology Yoshihiko Imanaka New York, NY Springer 2005 XXX, 229 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electronic ceramics Dickschichttechnik (DE-588)4012133-1 gnd rswk-swf Elektrokeramik (DE-588)4151820-2 gnd rswk-swf LTCC (DE-588)4737870-0 gnd rswk-swf Elektrokeramik (DE-588)4151820-2 s LTCC (DE-588)4737870-0 s Dickschichttechnik (DE-588)4012133-1 s DE-604 Erscheint auch als Online-Ausgabe 0-387-23314-8 text/html http://deposit.dnb.de/cgi-bin/dokserv?id=2737934&prov=M&dok_var=1&dok_ext=htm Inhaltstext GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=016027087&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Imanaka, Yoshihiko Multilayered low temperature cofired ceramics (LTCC) technology Electronic ceramics Dickschichttechnik (DE-588)4012133-1 gnd Elektrokeramik (DE-588)4151820-2 gnd LTCC (DE-588)4737870-0 gnd |
| subject_GND | (DE-588)4012133-1 (DE-588)4151820-2 (DE-588)4737870-0 |
| title | Multilayered low temperature cofired ceramics (LTCC) technology |
| title_auth | Multilayered low temperature cofired ceramics (LTCC) technology |
| title_exact_search | Multilayered low temperature cofired ceramics (LTCC) technology |
| title_exact_search_txtP | Multilayered low temperature cofired ceramics (LTCC) technology |
| title_full | Multilayered low temperature cofired ceramics (LTCC) technology Yoshihiko Imanaka |
| title_fullStr | Multilayered low temperature cofired ceramics (LTCC) technology Yoshihiko Imanaka |
| title_full_unstemmed | Multilayered low temperature cofired ceramics (LTCC) technology Yoshihiko Imanaka |
| title_short | Multilayered low temperature cofired ceramics (LTCC) technology |
| title_sort | multilayered low temperature cofired ceramics ltcc technology |
| topic | Electronic ceramics Dickschichttechnik (DE-588)4012133-1 gnd Elektrokeramik (DE-588)4151820-2 gnd LTCC (DE-588)4737870-0 gnd |
| topic_facet | Electronic ceramics Dickschichttechnik Elektrokeramik LTCC |
| url | http://deposit.dnb.de/cgi-bin/dokserv?id=2737934&prov=M&dok_var=1&dok_ext=htm http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=016027087&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT imanakayoshihiko multilayeredlowtemperaturecofiredceramicsltcctechnology |