Introduction to electromagnetic compatibility:
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| Format: | Buch |
| Sprache: | English |
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Hoboken, NJ
Wiley Interscience
2006
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| Ausgabe: | 2. ed. |
| Schriftenreihe: | Wiley series in microwave and optical engineering
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| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | XXI, 983 S. Ill., zahlr. graph. Darst. 1 CD-ROM(12 cm) |
| ISBN: | 0471755001 |
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| 100 | 1 | |a Paul, Clayton R. |d 1941- |e Verfasser |0 (DE-588)139330674 |4 aut | |
| 245 | 1 | 0 | |a Introduction to electromagnetic compatibility |c Clayton R. Paul |
| 250 | |a 2. ed. | ||
| 264 | 1 | |a Hoboken, NJ |b Wiley Interscience |c 2006 | |
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| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a Wiley series in microwave and optical engineering | |
| 650 | 4 | |a Blindage (Électricité) | |
| 650 | 7 | |a Blindage (électricité) |2 ram | |
| 650 | 7 | |a Circuits transistorisés - Bruit thermique |2 ram | |
| 650 | 4 | |a Circuits électroniques - Bruit | |
| 650 | 4 | |a Compatibilité électromagnétique | |
| 650 | 4 | |a Compatibilité électromagnétique - Problèmes et exercices | |
| 650 | 7 | |a Compatibilité électromagnétique - Problèmes et exercices |2 ram | |
| 650 | 7 | |a Compatibilité électromagnétique |2 ram | |
| 650 | 4 | |a Électronique numérique | |
| 650 | 7 | |a Électronique numérique |2 ram | |
| 650 | 4 | |a Electromagnetic compatibility | |
| 650 | 4 | |a Electronic circuits |x Noise | |
| 650 | 4 | |a Digital electronics | |
| 650 | 4 | |a Shielding (Electricity) | |
| 650 | 0 | 7 | |a Elektromagnetische Verträglichkeit |0 (DE-588)4138552-4 |2 gnd |9 rswk-swf |
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| _version_ | 1804136437347516416 |
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| adam_text | INTRODUCTION TO ELECTROMAGNETIC COMPATIBILITY SECOND EDITION CLAYTON R.
PAUL DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING, SCHOOL OF
ENGINEERING, MERCER UNIVERSITY, MACON, GEORGIA AND EMERITUS PROFESSOR OF
ELECTRICAL ENGINEERING, UNIVERSITY OF KENTUCKY, LEXINGTON, KENTUCKY
IWILEY- INTERSCIENCE A JOHN WILEY & SONS, INC. PUBLICATION CONTENTS
PREFACE XVII 1 INTRODUCTION TO ELECTROMAGNETIC COMPATIBILITY (EMC) 1 1.1
ASPECTS OF EMC 3 1.2 HISTORY OF EMC 10 1.3 EXAMPLES 12 1.4 ELECTRICAL
DIMENSIONS AND WAVES 14 1.5 DECIBELS AND COMMON EMC UNITS 23 1.5.1 POWER
LOSS IN CABLES 32 1.5.2 SIGNAL SOURCE SPECIFICATION 37 PROBLEMS 43
REFERENCES 48 2 EMC REQUIREMENTS FOR ELECTRONIC SYSTEMS 49 2.1
GOVERNMENTAL REQUIREMENTS 50 2.1.1 REQUIREMENTS FOR COMMERCIAL PRODUCTS
MARKETED IN THE UNITED STATES 50 2.1.2 REQUIREMENTS FOR COMMERCIAL
PRODUCTS MARKETED OUTSIDE THE UNITED STATES 55 2.1.3 REQUIREMENTS FOR
MILITARY PRODUCTS MARKETED IN THE UNITED STATES 60 2.1.4 MEASUREMENT OF
EMISSIONS FOR VERIFICATION OF COMPLIANCE 62 2.1.4.1 RADIATED EMISSIONS
64 2.1.4.2 CONDUCTED EMISSIONS 61 2.1.5 TYPICAL PRODUCT EMISSIONS 72
2.1.6 A SIMPLE EXAMPLE TO ILLUSTRATE THE DIFFICULTY IN MEETING THE
REGULATORY LIMITS 78 VIII CONTENTS 2.2 ADDITIONAL PRODUCT REQUIREMENTS
79 2.2.1 RADIATED SUSCEPTIBILITY (IMMUNITY) 81 2.2.2 CONDUCTED
SUSCEPTIBILITY (IMMUNITY) 81 2.2.3 ELECTROSTATIC DISCHARGE (ESD) 81
2.2.4 REQUIREMENTS FOR COMMERCIAL AIRCRAFT 82 2.2.5 REQUIREMENTS FOR
COMMERCIAL VEHICLES 82 2.3 DESIGN CONSTRAINTS FOR PRODUCTS 82 2.4
ADVANTAGES ?OF EMC DESIGN 84 PROBLEMS 86 REFERENCES 89 3 SIGNAL
SPECTRA*THE RELATIONSHIP BETWEEN THE TIME DOMAIN AND THE FREQUENCY
DOMAIN 91 3.1 PERIODIC SIGNALS 91 3.1.1 THE FOURIER SERIES
REPRESENTATION OF PERIODIC SIGNALS 94 3.1.2 RESPONSE OF LINEAR SYSTEMS
TO PERIODIC INPUT SIGNALS 104 3.1.3 IMPORTANT COMPUTATIONAL TECHNIQUES
111 3.2 SPECTRA OF DIGITAL WAVEFORMS 118 3.2.1 THE SPECTRUM OF
TRAPEZOIDAL (CLOCK) WAVEFORMS 118 3.2.2 SPECTRAL BOUNDS FOR TRAPEZOIDAL
WAVEFORMS 122 3.2.2.1 EFFECT OF RISE/FALLTIME ON SPECTRAL CONTENT 123
3.2.2.2 BANDWIDTH OF DIGITAL WAVEFORMS 132 3.2.2.3 EFFECT OF REPETITION
RATE AND DUTY CYCLE 136 3.2.2.4 EFFECT OF RINGING (UNDERSHOOT/OVERSHOOT)
137 3.2.3 USE OF SPECTRAL BOUNDS IN COMPUTING BOUNDS ON THE OUTPUT
SPECTRUM OF A LINEAR SYSTEM 140 3.3 SPECTRUM ANALYZERS 142 3.3.1 BASIC
PRINCIPLES 142 3.3.2 PEAK VERSUS QUASI-PEAK VERSUS AVERAGE 146 3.4
REPRESENTATION OF NONPERIODIC WAVEFORMS 148 3.4.1 THE FOURIER TRANSFORM
148 3.4.2 RESPONSE OF LINEAR SYSTEMS TO NONPERIODIC INPUTS 151 3.5
REPRESENTATION OF RANDOM (DATA) SIGNALS 151 3.6 USE OF SPICE (PSPICE) IN
FOURIER ANALYSIS 155 PROBLEMS 167 REFERENCES 175 4 TRANSMISSION LINES
AND SIGNAL INTEGRITY 1 77 4.1 THE TRANSMISSION-LINE EQUATIONS 181 4.2
THE PER-UNIT-LENGTH PARAMETERS 184 4.2.1 WIRE-TYPE STRUCTURES 186
CONTENTS IX 4.2.2 PRINTED CIRCUIT BOARD (PCB) STRUCTURES 199 4.3 THE
TIME-DOMAIN SOLUTION 204 4.3.1 GRAPHICAL SOLUTIONS 204 4.3.2 THE SPICE
MODEL 218 4.4 HIGH-SPEED DIGITAL INTERCONNECTS AND SIGNAL INTEGRITY 225
4.4.1 EFFECT OF TERMINATIONS ON THE LINE WAVEFORMS 230 4.4.1.1 EFFECT OF
CAPACITIVE TERMINATIONS 233 4.4.1.2 EFFECT OF INDUCTIVE TERMINATIONS 236
4.4.2 MATCHING SCHEMES FOR SIGNAL INTEGRITY 238 4.4.3 WHEN DOES THE LINE
NOT MATTER, I.E., WHEN IS MATCHING NOT REQUIRED? 244 4.4.4 EFFECTS OF
LINE DISCONTINUITIES 247 4.5 SINUSOIDAL EXCITATION OF THE LINE AND THE
PHASOR SOLUTION 260 4.5.1 VOLTAGE AND CURRENT AS FUNCTIONS OF POSITION
261 4.5.2 POWER FLOW 269 4.5.3 INCLUSION OF LOSSES 270 4.5.4 EFFECT OF
LOSSES ON SIGNAL INTEGRITY 273 4.6 LUMPED-CIRCUIT APPROXIMATE MODELS 283
PROBLEMS 287 REFERENCES 297 5 NONIDEAL BEHAVIOR OF COMPONENTS 299 5.1
WIRES 300 5.1.1 RESISTANCE AND INTERNAL INDUCTANCE OF WIRES 304 5.1.2
EXTERNAL INDUCTANCE AND CAPACITANCE OF PARALLEL WIRES 308 5.1.3 LUMPED
EQUIVALENT CIRCUITS OF PARALLEL WIRES 309 5.2 PRINTED CIRCUIT BOARD
(PCB) LANDS 312 5.3 EFFECT OF COMPONENT LEADS 315 5.4 RESISTORS 317 5.5
CAPACITORS 325 5.6 INDUCTORS 336 5.7 FERROMAGNETIC MATERIALS*SATURATION
AND FREQUENCY RESPONSE 340 5.8 FERRITE BEADS 343 5.9 COMMON-MODE CHOKES
346 5.10 ELECTROMECHANICAL DEVICES 352 5.10.1 DC MOTORS 352 5.10.2
STEPPER MOTORS 355 5.10.3 AC MOTORS 355 5.10.4 SOLENOIDS 356 5.11
DIGITAL CIRCUIT DEVICES 357 5.12 EFFECT OF COMPONENT VARIABILITY 358
5.13 MECHANICAL SWITCHES 359 5.13.1 ARCING AT SWITCH CONTACTS 360 X
CONTENTS 5.13.2 THE SHOWERING ARC 363 5.13.3 ARC SUPPRESSION 364
PROBLEMS 369 REFERENCES 375 6 CONDUCTED EMISSIONS AND SUSCEPTIBILITY 377
6.1 MEASUREMENT OF CONDUCTED EMISSIONS 378 6.1.1 THE LINE IMPEDANCE
STABILIZATION NETWORK (LISN) 379 6.1.2 COMMON- AND DIFFERENTIAL-MODE
CURRENTS AGAIN 381 6.2 POWER SUPPLY FILTERS 385 6.2.1 BASIC PROPERTIES
OF FILTERS 385 6.2.2 A GENERIC POWER SUPPLY FILTER TOPOLOGY 388 6.2.3
EFFECT OF FILTER ELEMENTS ON COMMON- AND DIFFERENTIAL-MODE CURRENTS 390
6.2.4 SEPARATION OF CONDUCTED EMISSIONS INTO COMMON- AND
DIFFERENTIAL-MODE COMPONENTS FOR DIAGNOSTIC PURPOSES 396 6.3 POWER
SUPPLIES 401 6.3.1 LINEAR POWER SUPPLIES 405 6.3.2 SWITCHED-MODE POWER
SUPPLIES (SMPS) 406 6.3.3 EFFECT OF POWER SUPPLY COMPONENTS ON CONDUCTED
EMISSIONS 409 6.4 POWER SUPPLY AND FILTER PLACEMENT 414 6.5 CONDUCTED
SUSCEPTIBILITY 416 PROBLEMS 416 REFERENCES 419 7 ANTENNAS 421 7.1
ELEMENTAL DIPOLE ANTENNAS 421 7.1.1 THE ELECTRIC (HERTZIAN) DIPOLE 422
7.1.2 THE MAGNETIC DIPOLE (LOOP) 426 7.2 THE HALF-WAVE DIPOLE AND
QUARTER-WAVE MONOPOLE ANTENNAS 429 7.3 ANTENNA ARRAYS 440 7.4
CHARACTERIZATION OF ANTENNAS 448 7.4.1 DIRECTIVITY AND GAIN 448 7.4.2
EFFECTIVE APERTURE 454 7.4.3 ANTENNA FACTOR 456 7.4.4 EFFECTS OF
BALANCING AND BALUNS 460 7.4.5 IMPEDANCE MATCHING AND THE USE OF PADS
463 7.5 THE FRIIS TRANSMISSION EQUATION 466 7.6 EFFECTS OF REFLECTIONS
470 7.6.1 THE METHOD OF IMAGES 470 CONTENTS XI 7.6.2 NORMAL INCIDENCE OF
UNIFORM PLANE WAVES ON PLANE, MATERIAL BOUNDARIES 470 7.6.3 MULTIPATH
EFFECTS 479 7.7 BROADBAND MEASURMENT ANTENNAS 486 7.7.1 THE BICONICAL
ANTENNA 487 7.7.2 THE LOG-PERIODIC ANTENNA 490 PROBLEMS 494 REFERENCES
501 8 RADIATED EMISSIONS AND SUSCEPTIBILITY 503 8.1 SIMPLE EMISSION
MODELS FOR WIRES AND PCB LANDS 504 8.1.1 DIFFERENTIAL-MODE VERSUS
COMMON-MODE CURRENTS 504 8.1.2 DIFFERENTIAL-MODE CURRENT EMISSION MODEL
509 8.1.3 COMMON-MODE CURRENT EMISSION MODEL 514 8.1.4 CURRENT PROBES
518 8.1.5 EXPERIMENTAL RESULTS 523 8.2 SIMPLE SUSCEPTIBILITY MODELS FOR
WIRES AND PCB LANDS 533 8.2.1 EXPERIMENTAL RESULTS 544 8.2.2 SHIELDED
CABLES AND SURFACE TRANSFER IMPEDANCE 546 PROBLEMS 550 REFERENCES 556 9
CROSSTALK 559 9.1 THREE-CONDUCTOR TRANSMISSION LINES AND CROSSTALK 560
9.2 THE TRANSMISSION-LINE EQUATIONS FOR LOSSLESS LINES 564 9.3 THE
PER-UNIT-LENGTH PARAMETERS 567 9.3.1 HOMOGENEOUS VERSUS INHOMOGENEOUS
MEDIA 568 9.3.2 WIDE-SEPARATION APPROXIMATIONS FOR WIRES 570 9.3.3
NUMERICAL METHODS FOR OTHER STRUCTURES 580 9.3.3.1 WIRES WITH DIELECTRIC
INSULATIONS (RIBBON CABLES) 586 9.3.3.2 RECTANGULAR CROSS-SECTION
CONDUCTORS (PCB LANDS) 590 9.4 THE INDUCTIVE-CAPACITIVE COUPLING
APPROXIMATE MODEL 595 9.4.1 FREQUENCY-DOMAIN INDUCTIVE-CAPACITIVE
COUPLING MODEL 599 9.4.1.1 INCLUSION OF LOSSES: COMMON-IMPEDANCE
COUPLING 601 9.4.1.2 EXPERIMENTAL RESULTS 604 9.4.2 TIME-DOMAIN
INDUCTIVE-CAPACITIVE COUPLING MODEL 612 9.4.2.1 INCLUSION OF LOSSES:
COMMON-IMPEDANCE COUPLING 616 9.4.2.2 EXPERIMENTAL RESULTS 61 7 XII
CONTENTS 9.5 LUMPED-CIRCUIT APPROXIMATE MODELS 624 9.6 AN EXACT SPICE
(PSPICE) MODEL FOR LOSSLESS, COUPLED LINES 624 9.6.1 COMPUTED VERSUS
EXPERIMENTAL RESULTS FOR WIRES 633 9.6.2 COMPUTED VERSUS EXPERIMENTAL
RESULTS FOR PCBS 640 9.7 SHIELDED WIRES 647 9.7.1 PER-UNIT-LENGTH
PARAMETERS 648 9.7.2 INDUCTIVE AND CAPACITIVE COUPLING 651 9.7.3 EFFECT
OF SHIELD GROUNDING 658 9.7.4 EFFECT OF PIGTAILS 667 9.7.5 EFFECTS OF
MULTIPLE SHIELDS 669 9.7.6 MTL MODEL PREDICTIONS 675 9.8 TWISTED WIRES
677 9.8.1 PER-UNIT-LENGTH PARAMETERS 681 9.8.2 INDUCTIVE AND CAPACITIVE
COUPLING 685 9.8.3 EFFECTS OF TWIST 689 9.8.4 EFFECTS OF BALANCING 698
PROBLEMS 701 REFERENCES 710 10 SHIELDING 713 10.1 SHIELDING
EFFECTIVENESS 718 10.2 SHIELDING EFFECTIVENESS: FAR-FIELD SOURCES 721
10.2.1 EXACT SOLUTION 721 10.2.2 APPROXIMATE SOLUTION 725 10.2.2.1
REFLECTION LOSS 725 10.2.2.2 ABSORPTION LOSS 728 10.2.2.3
MULTIPLE-REFLECTION LOSS 729 70.2.2.4 TOTAL LOSS 731 10.3 SHIELDING
EFFECTIVENESS: NEAR-FIELD SOURCES 735 10.3.1 NEAR FIELD VERSUS FAR FIELD
736 10.3.2 ELECTRIC SOURCES 740 10.3.3 MAGNETIC SOURCES 740 10.4
LOW-FREQUENCY, MAGNETIC FIELD SHIELDING 742 10.5 EFFECT OF APERTURES 745
PROBLEMS 750 REFERENCES 751 11 SYSTEM DESIGN FOR EMC 753 11.1 CHANGING
THE WAY WE THINK ABOUT ELECTRICAL PHENOMENA 758 11.1.1 NONIDEAL BEHAVIOR
OF COMPONENTS AND THE HIDDEN SCHEMATIC 758 11.1.2 ELECTRONS DO NOT READ
SCHEMATICS 763 CONTENTS ? XIII 766 768 771 774 775 781 786 11.1.3 WHAT
DO WE MEAN BY THE TERM SHIELDING ? 11.2 WHAT DO WE MEAN BY THE TERM
GROUND ? 11.2.1 SAFETY GROUND 11.2.2 SIGNAL GROUND 11.2.3 GROUND BOUNCE
AND PARTIAL INDUCTANCE 11.2.3.1 PARTIAL INDUCTANCE OF WIRES 11.2.3.2
PARTIAL INDUCTANCE OF PCB LANDS 11.2.4 CURRENTS RETURN TO THEIR SOURCE
ON THE PATHS OF LOWEST IMPEDANCE 787 11.2.5 UTILIZING MUTUAL INDUCTANCE
AND IMAGE PLANES TO FORCE CURRENTS TO RETURN ON A DESIRED PATH 793
11.2.6 SINGLE-POINT GROUNDING, MULTIPOINT GROUNDING, AND HYBRID
GROUNDING 796 11.2.7 GROUND LOOPS AND SUBSYSTEM DECOUPLING 802 11.3
PRINTED CIRCUIT BOARD (PCB) DESIGN 805 11.3.1 COMPONENT SELECTION 805
11.3.2 COMPONENT SPEED AND PLACEMENT 806 11.3.3 CABLE I/O PLACEMENT AND
FILTERING 808 11.3.4 THE IMPORTANT GROUND GRID 810 11.3.5 POWER
DISTRIBUTION AND DECOUPLING CAPACITORS 812 11.3.6 REDUCTION OF LOOP
AREAS 822 11.3.7 MIXED-SIGNAL PCB PARTITIONING 823 11.4 SYSTEM
CONFIGURATION AND DESIGN 827 11.4.1 SYSTEM ENCLOSURES 827 11.4.2 POWER
LINE FILTER PLACEMENT 828 11.4.3 INTERCONNECTION AND NUMBER OF PRINTED
CIRCUIT BOARDS 829 11.4.4 INTERNAL CABLE ROUTING AND CONNECTOR PLACEMENT
831 11.4.5 PCB AND SUBSYSTEM PLACEMENT 832 11.4.6 PCB AND SUBSYSTEM
DECOUPLING 832 11.4.7 MOTOR NOISE SUPPRESSION 832 11.4.8 ELECTROSTATIC
DISCHARGE (ESD) 834 11.5 DIAGNOSTIC TOOLS 847 11.5.1 THE CONCEPT OF
DOMINANT EFFECT IN THE DIAGNOSIS OF EMC PROBLEMS 850 PROBLEM 856
REFERENCES 857 APPENDIX A THE PHASOR SOLUTION METHOD 859 A. 1 SOLVING
DIFFERENTIAL EQUATIONS FOR THEIR SINUSOIDAL, H 1 - 1 STEADY-STATE
SOLUTION 859 XIV CONTENTS A.2 SOLVING ELECTRIC CIRCUITS FOR THEIR
SINUSOIDAL, STEADY-STATE RESPONSE PROBLEMS REFERENCES 863 867 869
APPENDIX B THE ELECTROMAGNETIC FIELD EQUATIONS AND WAVES 871 B.I B.2 B.3
B.4 B.5 B.6 B.7 PROBLEMS REFERENCES VECTOR ANALYSIS MAXWELL S EQUATIONS
B.2.1 FARADAY S LAW B.2.2 AMPERE S LAW B.2.3 GAUSS LAWS B.2.4
CONSERVATION OF CHARGE B.2.5 CONSTITUTIVE PARAMETERS OF THE MEDIUM
BOUNDARY CONDITIONS SINUSOIDAL STEADY STATE POWER FLOW UNIFORM PLANE
WAVES B.6.1 LOSSLESS MEDIA B.6.2 LOSSY MEDIA B.6.3 POWER FLOW B.6.4
CONDUCTORS VERSUS DIELECTRICS B.6.5 SKIN DEPTH STATIC (DC)
ELECTROMAGNETIC FIELD RELATIONS* A SPECIAL CASE B.7.1 MAXWELL S
EQUATIONS FOR STATIC (DC) FIELDS B.7.1.1 RANGE OF APPLICABILITY FOR
LOW-FREQUENCY FIELDS B.7.2 TWO-DIMENSIONAL FIELDS AND LAPLACE S EQUATION
872 881 881 892 898 900 900 902 907 909 909 912 918 922 923 925 927 927
928 928 930 939 APPENDIX C COMPUTER CODES FOR CALCULATING THE
PER-UNIT-LENGTH (PUL) PARAMETERS AND CROSSTALK OF MULTICONDUCTOR
TRANSMISSION LINES 941 C. 1 WIDESEP.FOR FOR COMPUTING THE PUL PARAMETER
MATRICES OF WIDELY SPACED WIRES 942 C.2 RIBBON.FOR FOR COMPUTING THE PUL
PARAMETER MATRICES OF RIBBON CABLES 947 C.3 PCB.FOR FOR COMPUTING THE
PUL PARAMETER MATRICES OF PRINTED CIRCUIT BOARDS 949 CONTENTS XV C.4
MSTRP.FOR FOR COMPUTING THE PUL PARAMETER MATRICES OF COUPLED MICROSTRIP
LINES 951 C.5 STRPLINE.FOR FOR COMPUTING THE PUL PARAMETER MATRICES OF
COUPLED STRIPLINES 952 C.6 SPICEMTL.FOR FOR COMPUTING A SPICE (PSPICE)
SUBCIRCUIT MODEL OF A LOSSLESS, MULTICONDUCTOR TRANSMISSION LINE 954 C.7
SPICELPI.FOR FOR COMPUTING A SPICE (PSPICE) SUBCIRCUIT OF A LUMPED-PI
MODEL OF A LOSSLESS, MULTICONDUCTOR TRANSMISSION LINE 956 APPENDIX D A
SPICE (PSPICE) TUTORIAL 959 D. 1 CREATING THE SPICE OR PSPICE PROGRAM
D.2 CIRCUIT DESCRIPTION D.3 EXECUTION STATEMENTS D.4 OUTPUT STATEMENTS
D.5 EXAMPLES REFERENCES 960 961 966 968 970 974 INDEX 975
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| adam_txt |
INTRODUCTION TO ELECTROMAGNETIC COMPATIBILITY SECOND EDITION CLAYTON R.
PAUL DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING, SCHOOL OF
ENGINEERING, MERCER UNIVERSITY, MACON, GEORGIA AND EMERITUS PROFESSOR OF
ELECTRICAL ENGINEERING, UNIVERSITY OF KENTUCKY, LEXINGTON, KENTUCKY
IWILEY- INTERSCIENCE A JOHN WILEY & SONS, INC. PUBLICATION CONTENTS
PREFACE XVII 1 INTRODUCTION TO ELECTROMAGNETIC COMPATIBILITY (EMC) 1 1.1
ASPECTS OF EMC 3 1.2 HISTORY OF EMC 10 1.3 EXAMPLES 12 1.4 ELECTRICAL
DIMENSIONS AND WAVES 14 1.5 DECIBELS AND COMMON EMC UNITS 23 1.5.1 POWER
LOSS IN CABLES 32 1.5.2 SIGNAL SOURCE SPECIFICATION 37 PROBLEMS 43
REFERENCES 48 2 EMC REQUIREMENTS FOR ELECTRONIC SYSTEMS 49 2.1
GOVERNMENTAL REQUIREMENTS 50 2.1.1 REQUIREMENTS FOR COMMERCIAL PRODUCTS
MARKETED IN THE UNITED STATES 50 2.1.2 REQUIREMENTS FOR COMMERCIAL
PRODUCTS MARKETED OUTSIDE THE UNITED STATES 55 2.1.3 REQUIREMENTS FOR
MILITARY PRODUCTS MARKETED IN THE UNITED STATES 60 2.1.4 MEASUREMENT OF
EMISSIONS FOR VERIFICATION OF COMPLIANCE 62 2.1.4.1 RADIATED EMISSIONS
64 2.1.4.2 CONDUCTED EMISSIONS 61 2.1.5 TYPICAL PRODUCT EMISSIONS 72
2.1.6 A SIMPLE EXAMPLE TO ILLUSTRATE THE DIFFICULTY IN MEETING THE
REGULATORY LIMITS 78 VIII CONTENTS 2.2 ADDITIONAL PRODUCT REQUIREMENTS
79 2.2.1 RADIATED SUSCEPTIBILITY (IMMUNITY) 81 2.2.2 CONDUCTED
SUSCEPTIBILITY (IMMUNITY) 81 2.2.3 ELECTROSTATIC DISCHARGE (ESD) 81
2.2.4 REQUIREMENTS FOR COMMERCIAL AIRCRAFT 82 2.2.5 REQUIREMENTS FOR
COMMERCIAL VEHICLES 82 2.3 DESIGN CONSTRAINTS FOR PRODUCTS 82 2.4
ADVANTAGES ?OF EMC DESIGN 84 PROBLEMS 86 REFERENCES 89 3 SIGNAL
SPECTRA*THE RELATIONSHIP BETWEEN THE TIME DOMAIN AND THE FREQUENCY
DOMAIN 91 3.1 PERIODIC SIGNALS 91 3.1.1 THE FOURIER SERIES
REPRESENTATION OF PERIODIC SIGNALS 94 3.1.2 RESPONSE OF LINEAR SYSTEMS
TO PERIODIC INPUT SIGNALS 104 3.1.3 IMPORTANT COMPUTATIONAL TECHNIQUES
111 3.2 SPECTRA OF DIGITAL WAVEFORMS 118 3.2.1 THE SPECTRUM OF
TRAPEZOIDAL (CLOCK) WAVEFORMS 118 3.2.2 SPECTRAL BOUNDS FOR TRAPEZOIDAL
WAVEFORMS 122 3.2.2.1 EFFECT OF RISE/FALLTIME ON SPECTRAL CONTENT 123
3.2.2.2 BANDWIDTH OF DIGITAL WAVEFORMS 132 3.2.2.3 EFFECT OF REPETITION
RATE AND DUTY CYCLE 136 3.2.2.4 EFFECT OF RINGING (UNDERSHOOT/OVERSHOOT)
137 3.2.3 USE OF SPECTRAL BOUNDS IN COMPUTING BOUNDS ON THE OUTPUT
SPECTRUM OF A LINEAR SYSTEM 140 3.3 SPECTRUM ANALYZERS 142 3.3.1 BASIC
PRINCIPLES 142 3.3.2 PEAK VERSUS QUASI-PEAK VERSUS AVERAGE 146 3.4
REPRESENTATION OF NONPERIODIC WAVEFORMS 148 3.4.1 THE FOURIER TRANSFORM
148 3.4.2 RESPONSE OF LINEAR SYSTEMS TO NONPERIODIC INPUTS 151 3.5
REPRESENTATION OF RANDOM (DATA) SIGNALS 151 3.6 USE OF SPICE (PSPICE) IN
FOURIER ANALYSIS 155 PROBLEMS 167 REFERENCES 175 4 TRANSMISSION LINES
AND SIGNAL INTEGRITY 1 77 4.1 THE TRANSMISSION-LINE EQUATIONS 181 4.2
THE PER-UNIT-LENGTH PARAMETERS 184 4.2.1 WIRE-TYPE STRUCTURES 186
CONTENTS IX 4.2.2 PRINTED CIRCUIT BOARD (PCB) STRUCTURES 199 4.3 THE
TIME-DOMAIN SOLUTION 204 4.3.1 GRAPHICAL SOLUTIONS 204 4.3.2 THE SPICE
MODEL 218 4.4 HIGH-SPEED DIGITAL INTERCONNECTS AND SIGNAL INTEGRITY 225
4.4.1 EFFECT OF TERMINATIONS ON THE LINE WAVEFORMS 230 4.4.1.1 EFFECT OF
CAPACITIVE TERMINATIONS 233 4.4.1.2 EFFECT OF INDUCTIVE TERMINATIONS 236
4.4.2 MATCHING SCHEMES FOR SIGNAL INTEGRITY 238 4.4.3 WHEN DOES THE LINE
NOT MATTER, I.E., WHEN IS MATCHING NOT REQUIRED? 244 4.4.4 EFFECTS OF
LINE DISCONTINUITIES 247 4.5 SINUSOIDAL EXCITATION OF THE LINE AND THE
PHASOR SOLUTION 260 4.5.1 VOLTAGE AND CURRENT AS FUNCTIONS OF POSITION
261 4.5.2 POWER FLOW 269 4.5.3 INCLUSION OF LOSSES 270 4.5.4 EFFECT OF
LOSSES ON SIGNAL INTEGRITY 273 4.6 LUMPED-CIRCUIT APPROXIMATE MODELS 283
PROBLEMS 287 REFERENCES 297 5 NONIDEAL BEHAVIOR OF COMPONENTS 299 5.1
WIRES 300 5.1.1 RESISTANCE AND INTERNAL INDUCTANCE OF WIRES 304 5.1.2
EXTERNAL INDUCTANCE AND CAPACITANCE OF PARALLEL WIRES 308 5.1.3 LUMPED
EQUIVALENT CIRCUITS OF PARALLEL WIRES 309 5.2 PRINTED CIRCUIT BOARD
(PCB) LANDS 312 5.3 EFFECT OF COMPONENT LEADS 315 5.4 RESISTORS 317 5.5
CAPACITORS 325 5.6 INDUCTORS 336 5.7 FERROMAGNETIC MATERIALS*SATURATION
AND FREQUENCY RESPONSE 340 5.8 FERRITE BEADS 343 5.9 COMMON-MODE CHOKES
346 5.10 ELECTROMECHANICAL DEVICES 352 5.10.1 DC MOTORS 352 5.10.2
STEPPER MOTORS 355 5.10.3 AC MOTORS 355 5.10.4 SOLENOIDS 356 5.11
DIGITAL CIRCUIT DEVICES 357 5.12 EFFECT OF COMPONENT VARIABILITY 358
5.13 MECHANICAL SWITCHES 359 5.13.1 ARCING AT SWITCH CONTACTS 360 X
CONTENTS 5.13.2 THE SHOWERING ARC 363 5.13.3 ARC SUPPRESSION 364
PROBLEMS 369 REFERENCES 375 6 CONDUCTED EMISSIONS AND SUSCEPTIBILITY 377
6.1 MEASUREMENT OF CONDUCTED EMISSIONS 378 6.1.1 THE LINE IMPEDANCE
STABILIZATION NETWORK (LISN) 379 6.1.2 COMMON- AND DIFFERENTIAL-MODE
CURRENTS AGAIN 381 6.2 POWER SUPPLY FILTERS 385 6.2.1 BASIC PROPERTIES
OF FILTERS 385 6.2.2 A GENERIC POWER SUPPLY FILTER TOPOLOGY 388 6.2.3
EFFECT OF FILTER ELEMENTS ON COMMON- AND DIFFERENTIAL-MODE CURRENTS 390
6.2.4 SEPARATION OF CONDUCTED EMISSIONS INTO COMMON- AND
DIFFERENTIAL-MODE COMPONENTS FOR DIAGNOSTIC PURPOSES 396 6.3 POWER
SUPPLIES 401 6.3.1 LINEAR POWER SUPPLIES 405 6.3.2 SWITCHED-MODE POWER
SUPPLIES (SMPS) 406 6.3.3 EFFECT OF POWER SUPPLY COMPONENTS ON CONDUCTED
EMISSIONS 409 6.4 POWER SUPPLY AND FILTER PLACEMENT 414 6.5 CONDUCTED
SUSCEPTIBILITY 416 PROBLEMS 416 REFERENCES 419 7 ANTENNAS 421 7.1
ELEMENTAL DIPOLE ANTENNAS 421 7.1.1 THE ELECTRIC (HERTZIAN) DIPOLE 422
7.1.2 THE MAGNETIC DIPOLE (LOOP) 426 7.2 THE HALF-WAVE DIPOLE AND
QUARTER-WAVE MONOPOLE ANTENNAS 429 7.3 ANTENNA ARRAYS 440 7.4
CHARACTERIZATION OF ANTENNAS 448 7.4.1 DIRECTIVITY AND GAIN 448 7.4.2
EFFECTIVE APERTURE 454 7.4.3 ANTENNA FACTOR 456 7.4.4 EFFECTS OF
BALANCING AND BALUNS 460 7.4.5 IMPEDANCE MATCHING AND THE USE OF PADS
463 7.5 THE FRIIS TRANSMISSION EQUATION 466 7.6 EFFECTS OF REFLECTIONS
470 7.6.1 THE METHOD OF IMAGES 470 CONTENTS XI 7.6.2 NORMAL INCIDENCE OF
UNIFORM PLANE WAVES ON PLANE, MATERIAL BOUNDARIES 470 7.6.3 MULTIPATH
EFFECTS 479 7.7 BROADBAND MEASURMENT ANTENNAS 486 7.7.1 THE BICONICAL
ANTENNA 487 7.7.2 THE LOG-PERIODIC ANTENNA 490 PROBLEMS 494 REFERENCES
501 8 RADIATED EMISSIONS AND SUSCEPTIBILITY 503 8.1 SIMPLE EMISSION
MODELS FOR WIRES AND PCB LANDS 504 8.1.1 DIFFERENTIAL-MODE VERSUS
COMMON-MODE CURRENTS 504 8.1.2 DIFFERENTIAL-MODE CURRENT EMISSION MODEL
509 8.1.3 COMMON-MODE CURRENT EMISSION MODEL 514 8.1.4 CURRENT PROBES
518 8.1.5 EXPERIMENTAL RESULTS 523 8.2 SIMPLE SUSCEPTIBILITY MODELS FOR
WIRES AND PCB LANDS 533 8.2.1 EXPERIMENTAL RESULTS 544 8.2.2 SHIELDED
CABLES AND SURFACE TRANSFER IMPEDANCE 546 PROBLEMS 550 REFERENCES 556 9
CROSSTALK 559 9.1 THREE-CONDUCTOR TRANSMISSION LINES AND CROSSTALK 560
9.2 THE TRANSMISSION-LINE EQUATIONS FOR LOSSLESS LINES 564 9.3 THE
PER-UNIT-LENGTH PARAMETERS 567 9.3.1 HOMOGENEOUS VERSUS INHOMOGENEOUS
MEDIA 568 9.3.2 WIDE-SEPARATION APPROXIMATIONS FOR WIRES 570 9.3.3
NUMERICAL METHODS FOR OTHER STRUCTURES 580 9.3.3.1 WIRES WITH DIELECTRIC
INSULATIONS (RIBBON CABLES) 586 9.3.3.2 RECTANGULAR CROSS-SECTION
CONDUCTORS (PCB LANDS) 590 9.4 THE INDUCTIVE-CAPACITIVE COUPLING
APPROXIMATE MODEL 595 9.4.1 FREQUENCY-DOMAIN INDUCTIVE-CAPACITIVE
COUPLING MODEL 599 9.4.1.1 INCLUSION OF LOSSES: COMMON-IMPEDANCE
COUPLING 601 9.4.1.2 EXPERIMENTAL RESULTS 604 9.4.2 TIME-DOMAIN
INDUCTIVE-CAPACITIVE COUPLING MODEL 612 9.4.2.1 INCLUSION OF LOSSES:
COMMON-IMPEDANCE COUPLING 616 9.4.2.2 EXPERIMENTAL RESULTS 61 7 XII
CONTENTS 9.5 LUMPED-CIRCUIT APPROXIMATE MODELS 624 9.6 AN EXACT SPICE
(PSPICE) MODEL FOR LOSSLESS, COUPLED LINES 624 9.6.1 COMPUTED VERSUS
EXPERIMENTAL RESULTS FOR WIRES 633 9.6.2 COMPUTED VERSUS EXPERIMENTAL
RESULTS FOR PCBS 640 9.7 SHIELDED WIRES 647 9.7.1 PER-UNIT-LENGTH
PARAMETERS 648 9.7.2 INDUCTIVE AND CAPACITIVE COUPLING 651 9.7.3 EFFECT
OF SHIELD GROUNDING 658 9.7.4 EFFECT OF PIGTAILS 667 9.7.5 EFFECTS OF
MULTIPLE SHIELDS 669 9.7.6 MTL MODEL PREDICTIONS 675 9.8 TWISTED WIRES
677 9.8.1 PER-UNIT-LENGTH PARAMETERS 681 9.8.2 INDUCTIVE AND CAPACITIVE
COUPLING 685 9.8.3 EFFECTS OF TWIST 689 9.8.4 EFFECTS OF BALANCING 698
PROBLEMS 701 REFERENCES 710 10 SHIELDING 713 10.1 SHIELDING
EFFECTIVENESS 718 10.2 SHIELDING EFFECTIVENESS: FAR-FIELD SOURCES 721
10.2.1 EXACT SOLUTION 721 10.2.2 APPROXIMATE SOLUTION 725 10.2.2.1
REFLECTION LOSS 725 10.2.2.2 ABSORPTION LOSS 728 10.2.2.3
MULTIPLE-REFLECTION LOSS 729 70.2.2.4 TOTAL LOSS 731 10.3 SHIELDING
EFFECTIVENESS: NEAR-FIELD SOURCES 735 10.3.1 NEAR FIELD VERSUS FAR FIELD
736 10.3.2 ELECTRIC SOURCES 740 10.3.3 MAGNETIC SOURCES 740 10.4
LOW-FREQUENCY, MAGNETIC FIELD SHIELDING 742 10.5 EFFECT OF APERTURES 745
PROBLEMS 750 REFERENCES 751 11 SYSTEM DESIGN FOR EMC 753 11.1 CHANGING
THE WAY WE THINK ABOUT ELECTRICAL PHENOMENA 758 11.1.1 NONIDEAL BEHAVIOR
OF COMPONENTS AND THE HIDDEN SCHEMATIC 758 11.1.2 "ELECTRONS DO NOT READ
SCHEMATICS" 763 CONTENTS '? XIII 766 768 771 774 775 781 786 11.1.3 WHAT
DO WE MEAN BY THE TERM "SHIELDING"? 11.2 WHAT DO WE MEAN BY THE TERM
"GROUND"? 11.2.1 SAFETY GROUND 11.2.2 SIGNAL GROUND 11.2.3 GROUND BOUNCE
AND PARTIAL INDUCTANCE 11.2.3.1 PARTIAL INDUCTANCE OF WIRES 11.2.3.2
PARTIAL INDUCTANCE OF PCB LANDS 11.2.4 CURRENTS RETURN TO THEIR SOURCE
ON THE PATHS OF LOWEST IMPEDANCE 787 11.2.5 UTILIZING MUTUAL INDUCTANCE
AND IMAGE PLANES TO FORCE CURRENTS TO RETURN ON A DESIRED PATH 793
11.2.6 SINGLE-POINT GROUNDING, MULTIPOINT GROUNDING, AND HYBRID
GROUNDING 796 11.2.7 GROUND LOOPS AND SUBSYSTEM DECOUPLING 802 11.3
PRINTED CIRCUIT BOARD (PCB) DESIGN 805 11.3.1 COMPONENT SELECTION 805
11.3.2 COMPONENT SPEED AND PLACEMENT 806 11.3.3 CABLE I/O PLACEMENT AND
FILTERING 808 11.3.4 THE IMPORTANT GROUND GRID 810 11.3.5 POWER
DISTRIBUTION AND DECOUPLING CAPACITORS 812 11.3.6 REDUCTION OF LOOP
AREAS 822 11.3.7 MIXED-SIGNAL PCB PARTITIONING 823 11.4 SYSTEM
CONFIGURATION AND DESIGN 827 11.4.1 SYSTEM ENCLOSURES 827 11.4.2 POWER
LINE FILTER PLACEMENT 828 11.4.3 INTERCONNECTION AND NUMBER OF PRINTED
CIRCUIT BOARDS 829 11.4.4 INTERNAL CABLE ROUTING AND CONNECTOR PLACEMENT
831 11.4.5 PCB AND SUBSYSTEM PLACEMENT 832 11.4.6 PCB AND SUBSYSTEM
DECOUPLING 832 11.4.7 MOTOR NOISE SUPPRESSION 832 11.4.8 ELECTROSTATIC
DISCHARGE (ESD) 834 11.5 DIAGNOSTIC TOOLS 847 11.5.1 THE CONCEPT OF
DOMINANT EFFECT IN THE DIAGNOSIS OF EMC PROBLEMS 850 PROBLEM 856
REFERENCES 857 APPENDIX A THE PHASOR SOLUTION METHOD 859 A. 1 SOLVING
DIFFERENTIAL EQUATIONS FOR THEIR SINUSOIDAL, H 1 - 1 STEADY-STATE
SOLUTION 859 XIV CONTENTS A.2 SOLVING ELECTRIC CIRCUITS FOR THEIR
SINUSOIDAL, STEADY-STATE RESPONSE PROBLEMS REFERENCES 863 867 869
APPENDIX B THE ELECTROMAGNETIC FIELD EQUATIONS AND WAVES 871 B.I B.2 B.3
B.4 B.5 B.6 B.7 PROBLEMS REFERENCES 'VECTOR ANALYSIS MAXWELL'S EQUATIONS
B.2.1 FARADAY'S LAW B.2.2 AMPERE'S LAW B.2.3 GAUSS' LAWS B.2.4
CONSERVATION OF CHARGE B.2.5 CONSTITUTIVE PARAMETERS OF THE MEDIUM
BOUNDARY CONDITIONS SINUSOIDAL STEADY STATE POWER FLOW UNIFORM PLANE
WAVES B.6.1 LOSSLESS MEDIA B.6.2 LOSSY MEDIA B.6.3 POWER FLOW B.6.4
CONDUCTORS VERSUS DIELECTRICS B.6.5 SKIN DEPTH STATIC (DC)
ELECTROMAGNETIC FIELD RELATIONS* A SPECIAL CASE B.7.1 MAXWELL'S
EQUATIONS FOR STATIC (DC) FIELDS B.7.1.1 RANGE OF APPLICABILITY FOR
LOW-FREQUENCY FIELDS B.7.2 TWO-DIMENSIONAL FIELDS AND LAPLACE'S EQUATION
872 881 881 892 898 900 900 902 907 909 909 912 918 922 923 925 927 927
928 928 930 939 APPENDIX C COMPUTER CODES FOR CALCULATING THE
PER-UNIT-LENGTH (PUL) PARAMETERS AND CROSSTALK OF MULTICONDUCTOR
TRANSMISSION LINES 941 C. 1 WIDESEP.FOR FOR COMPUTING THE PUL PARAMETER
MATRICES OF WIDELY SPACED WIRES 942 C.2 RIBBON.FOR FOR COMPUTING THE PUL
PARAMETER MATRICES OF RIBBON CABLES 947 C.3 PCB.FOR FOR COMPUTING THE
PUL PARAMETER MATRICES OF PRINTED CIRCUIT BOARDS 949 CONTENTS XV C.4
MSTRP.FOR FOR COMPUTING THE PUL PARAMETER MATRICES OF COUPLED MICROSTRIP
LINES 951 C.5 STRPLINE.FOR FOR COMPUTING THE PUL PARAMETER MATRICES OF
COUPLED STRIPLINES 952 C.6 SPICEMTL.FOR FOR COMPUTING A SPICE (PSPICE)
SUBCIRCUIT MODEL OF A LOSSLESS, MULTICONDUCTOR TRANSMISSION LINE 954 C.7
SPICELPI.FOR FOR COMPUTING A SPICE (PSPICE) SUBCIRCUIT OF A LUMPED-PI
MODEL OF A LOSSLESS, MULTICONDUCTOR TRANSMISSION LINE 956 APPENDIX D A
SPICE (PSPICE) TUTORIAL 959 D. 1 CREATING THE SPICE OR PSPICE PROGRAM
D.2 CIRCUIT DESCRIPTION D.3 EXECUTION STATEMENTS D.4 OUTPUT STATEMENTS
D.5 EXAMPLES REFERENCES 960 961 966 968 970 974 INDEX 975 |
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| author | Paul, Clayton R. 1941- |
| author_GND | (DE-588)139330674 |
| author_facet | Paul, Clayton R. 1941- |
| author_role | aut |
| author_sort | Paul, Clayton R. 1941- |
| author_variant | c r p cr crp |
| building | Verbundindex |
| bvnumber | BV022381003 |
| callnumber-first | T - Technology |
| callnumber-label | TK7867 |
| callnumber-raw | TK7867.2 |
| callnumber-search | TK7867.2 |
| callnumber-sort | TK 47867.2 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4050 |
| ctrlnum | (OCoLC)288955385 (DE-599)BVBBV022381003 |
| dewey-full | 621.382/24 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.382/24 |
| dewey-search | 621.382/24 |
| dewey-sort | 3621.382 224 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | 2. ed. |
| format | Book |
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| id | DE-604.BV022381003 |
| illustrated | Illustrated |
| index_date | 2024-07-02T17:11:17Z |
| indexdate | 2024-07-09T20:56:23Z |
| institution | BVB |
| isbn | 0471755001 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015589992 |
| oclc_num | 288955385 |
| open_access_boolean | |
| owner | DE-1043 DE-83 DE-861 |
| owner_facet | DE-1043 DE-83 DE-861 |
| physical | XXI, 983 S. Ill., zahlr. graph. Darst. 1 CD-ROM(12 cm) |
| publishDate | 2006 |
| publishDateSearch | 2006 |
| publishDateSort | 2006 |
| publisher | Wiley Interscience |
| record_format | marc |
| series2 | Wiley series in microwave and optical engineering |
| spelling | Paul, Clayton R. 1941- Verfasser (DE-588)139330674 aut Introduction to electromagnetic compatibility Clayton R. Paul 2. ed. Hoboken, NJ Wiley Interscience 2006 XXI, 983 S. Ill., zahlr. graph. Darst. 1 CD-ROM(12 cm) txt rdacontent n rdamedia nc rdacarrier Wiley series in microwave and optical engineering Blindage (Électricité) Blindage (électricité) ram Circuits transistorisés - Bruit thermique ram Circuits électroniques - Bruit Compatibilité électromagnétique Compatibilité électromagnétique - Problèmes et exercices Compatibilité électromagnétique - Problèmes et exercices ram Compatibilité électromagnétique ram Électronique numérique Électronique numérique ram Electromagnetic compatibility Electronic circuits Noise Digital electronics Shielding (Electricity) Elektromagnetische Verträglichkeit (DE-588)4138552-4 gnd rswk-swf Elektromagnetische Verträglichkeit (DE-588)4138552-4 s DE-604 HEBIS Datenaustausch Darmstadt application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=015589992&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Paul, Clayton R. 1941- Introduction to electromagnetic compatibility Blindage (Électricité) Blindage (électricité) ram Circuits transistorisés - Bruit thermique ram Circuits électroniques - Bruit Compatibilité électromagnétique Compatibilité électromagnétique - Problèmes et exercices Compatibilité électromagnétique - Problèmes et exercices ram Compatibilité électromagnétique ram Électronique numérique Électronique numérique ram Electromagnetic compatibility Electronic circuits Noise Digital electronics Shielding (Electricity) Elektromagnetische Verträglichkeit (DE-588)4138552-4 gnd |
| subject_GND | (DE-588)4138552-4 |
| title | Introduction to electromagnetic compatibility |
| title_auth | Introduction to electromagnetic compatibility |
| title_exact_search | Introduction to electromagnetic compatibility |
| title_exact_search_txtP | Introduction to electromagnetic compatibility |
| title_full | Introduction to electromagnetic compatibility Clayton R. Paul |
| title_fullStr | Introduction to electromagnetic compatibility Clayton R. Paul |
| title_full_unstemmed | Introduction to electromagnetic compatibility Clayton R. Paul |
| title_short | Introduction to electromagnetic compatibility |
| title_sort | introduction to electromagnetic compatibility |
| topic | Blindage (Électricité) Blindage (électricité) ram Circuits transistorisés - Bruit thermique ram Circuits électroniques - Bruit Compatibilité électromagnétique Compatibilité électromagnétique - Problèmes et exercices Compatibilité électromagnétique - Problèmes et exercices ram Compatibilité électromagnétique ram Électronique numérique Électronique numérique ram Electromagnetic compatibility Electronic circuits Noise Digital electronics Shielding (Electricity) Elektromagnetische Verträglichkeit (DE-588)4138552-4 gnd |
| topic_facet | Blindage (Électricité) Blindage (électricité) Circuits transistorisés - Bruit thermique Circuits électroniques - Bruit Compatibilité électromagnétique Compatibilité électromagnétique - Problèmes et exercices Électronique numérique Electromagnetic compatibility Electronic circuits Noise Digital electronics Shielding (Electricity) Elektromagnetische Verträglichkeit |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=015589992&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT paulclaytonr introductiontoelectromagneticcompatibility |