Advanced packaging concepts for digital avionics: papers presented at the Avionics Panel Symposium held in San Diego, USA, 6 - 9 June 1994
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | Undetermined |
| Veröffentlicht: |
Neuilly sur Seine
AGARD
1994
|
| Schriftenreihe: | AGARD conference proceedings
562 |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Getr. Zählung graph.Darst. |
| ISBN: | 9283600045 |
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| adam_text | AGARD-CP-562 ADVISORYGROUP FORAEROSPACE RESEARCH & DEVELOPMENT 7 RUE
ANCELLE, 92200 NEUILLY-SUR-SEINE, FRANCE AGARD CONFERENCE PROCEEDINGS
562 ADVANCED PACKAGING CONCEPTS FOR DIGITAL AVIONICS (LES TECHNIQUES
AVANCEES DE MISE SOUS BOITIER) PAPERS PRESENTED AT THE AVIONICS PANEL
SYMPOSIUM HELD IN SAN DIEGO, CA, USA, 6-9 JUNE 1994. & NORTH ATLANTIC
TREATY ORGANIZATION ORGANISATION DU TRAITE DE L ATLANTIQUE NORD UB/TIB
HANNOVER 89 112 083048 CONTENTS PAGE THEME/THEME III AVIONICS PANEL AND
TECHNICALPROGRAMME COMMITTEE IV TECHNICAL EVALUATION REPORT * DISCUSSION
ISSUES T BY J.M. BORKY KEYNOTE ADDRESS BY HONORABLE R.N. LONGUEMARE (NOT
PUBLISHED) SESSION I *CURRENTPACKAGINGDESIGNS AND LIMITATIONS THE IMPACT
OF ADVANCED PACKAGING TECHNOLOGY ON MODULAR AVIONICS ARCHITECTURES 1 BY
R. MORGAN, J. OSTGAARD STANDARD HARDWARE ACQUISITION AND RELIABILITY
PROGRAM (SHARP) ADVANCED SEM-E 2 PACKAGING BY M.H. MOSIER, A. HAWKINS
FASTPACK: SOLUTIONS OPTIMISEES POUR LECONDITIONNEMENT DE PAVIONIQUE
MODULAIRE ISSUES 3 D UNE ETUDE PARAMETRIQUE. PART I: ASPECTS PORTEUR PAR
G. VEBER, S. BARBAGELETA, P. HELIE FASTPACK: OPTIMIZED SOLUTIONS FOR
MODULAR AVIONICS DERIVED FROM A PARAMETRIC STUDY. 4 PART H: AVIONICS BY
M. CAPLOT, G. LABAUNE, C. CAPOGNA, C. SARNO, J. HERREWYN, J.C. DHAUSSY,
P. BLEICHER THE ADVANCED AVIONICS SUBSYSTEM TECHNOLOGY DEMONSTRATION
PROGRAM 5 BY T. MONAGHAN, G. KANAWATI, J. ABRAHAM, D. OLSON, R. IYER
IMPROVING MULTICHIP MODULE (MCM) DESIGN AND RELIABILITY USING THE
INTELLIGENTMCM 6 ANALYZER BY MJ. STOKLOSA, D.J. HOLZHAUER, D.W.
RICHARDS, P.J. ROCCI, P.S. YAWORSKY SESSION II *REQUIREMENTS
FORADVANCEDPACKAGINGTECHNOLOGY ULTRA-RELIABLE DIGITAL AVIONICS (URDA)
PROCESSOR 7 BY R. BRANSTETTER, W. RUSZCZYK, F. MIVILLE PACKAGING THEMAMA
MODULE 8 BY J.D. SEALS THE DEMISE OFPLASTIC ENCAPSULATED MICROCIRCUIT
MYTHS 9 BY E.B. HAKIM, R.K. AGARWAL, M. PECHT MCMS FOR AVIONICS *
TECHNOLOGY SELECTION AND INTERMODULE INTERCONNECTION 10 BY N. CHANDLER,
I.R. CROSTON, S.G. TYLER, T.G. HAMILL, P.E. HOLBOURN 3-D COMPUTER 11* BY
M. LITTLE, M. YUNG ADVANCED STANDARD ELECTRONIC MODULES FORMAT-E (SEM-E)
PROCESSES FOR RAPID PROTOTYPING 12 BY A. HAWKINS RELIABILITY ASSESSMENT
OF MULTICHIP MODULE TECHNOLOGIES VIA THE TRI-SERVICE/NASA 13 RELTECH
PROGRAM BY D.F. FAYETTE ASSURING KNOWN GOOD DIE (KGD) FOR RELIABLE, COST
EFFECTIVE MCMS 14 BY D.E. DASKIEWICH THE DESIGN AND MANUFACTURING
DEVELOPMENT OF AN ACTIVE SILICON SUBSTRATE MCM 15 BY M.G. ROUGHTON, L.
WAITE HIGH DENSITY MONOLITHIC PACKAGING TECHNOLOGY FOR DIGITAL/MICROWAVE
AVIONICS 16 BY T.G. FERTIG, T. WALTER, E. GAVER, K. LEAHY SESSION FFL *
ADVANCED PACKAGING TECHNOLOGIES LIQUID FLOW-THROUGH COOLING OF
ELECTRONIC MODULES 17 BY S. SRIDHAR, M.D. OSTERMAN, J.M. CARBONELL, K.E.
HEROLD IMMERSION/TWO PHASE COOLING 18 BY J. JONES, E. PERKOSKI
MICROCHANNEL HEAT PIPE COOLING OF MODULES 19 BY G. MOSER THE IEEE
SCALABLE COHERENT INTERFACE * AN APPROACH FOR A UNIFIED AVIONICS NETWORK
20 BY R. LACHENMAIER, T. STRETCH A TECHNIQUE FOR INCREASING THE
BANDWIDTH OF HIGH PERFORMANCE ELECTRICAL BACKPLANES 21 BY W. ROSEN, S.
RAJAN, V. GERSHMAN, M. SHADARAM PAPER CANCELLED 22 OPTICAL BACKPLANE FOR
MODULAR AVIONICS 23 BY R. BOGENBERGER, O. KRUMPHOLZ HIGH PERFORMANCE
BACKPLANE COMPONENTS FOR MODULAR AVIONICS 24 BY C.J. GROVES-KIRBY, M.J.
GOODWIN, J.P. HALL, G. GLYNN, J. HANKEY, M.D. SALIK, R.C. GOODFELLOW, D.
JIBB THE ROC OPTICAL CONNECTOR 25 BY R.J. PIMPINELLA, J.D. SEALS
SESSIONIV *ADVANCEDPACKAGING APPLICATIONS BOITIERS COMPOSITES POUR
EQUIPEMENTS ELECTRONIQUES AEROPORTES : UNE ETUDE TECHNOLOGIQUE 26 ET CEM
PAR B. DUMONT, J. LECUELLET, S. LAFORET, G. LABAUNE, M. CAPLOT
LIGHTWEIGHT ELECTRONIC ENCLOSURES USING COMPOSITE MATERIALS 27 BY C.
SARNO DISTRIBUTED POWER FOR AVIONICS SUBSYSTEMS BY R.L. STEIGERWALD, MR.
WILDI ALIMENTATIONS MODULAIRES POUR UNE ARCHITECTURE DISTRIBUEE PAR A.
MOREAU, JM. REY, M. CAPLOT, JP. DELVINQUIER PAPER CANCELLED
ELECTROMAGNETIC COMPATIBILITY EFFECTS OF ADVANCED PACKAGING
CONFIGURATIONS BY B. AUDONE, L. BOLLA, D. TARDUCCI MODULAR CNI AVIONICS
SYSTEM BY P.H. REITBERGER, G. MEY * NOT AVAILABLE AT TIME OFPRINTING VIL
|
| adam_txt |
AGARD-CP-562 ADVISORYGROUP FORAEROSPACE RESEARCH & DEVELOPMENT 7 RUE
ANCELLE, 92200 NEUILLY-SUR-SEINE, FRANCE AGARD CONFERENCE PROCEEDINGS
562 ADVANCED PACKAGING CONCEPTS FOR DIGITAL AVIONICS (LES TECHNIQUES
AVANCEES DE MISE SOUS BOITIER) PAPERS PRESENTED AT THE AVIONICS PANEL
SYMPOSIUM HELD IN SAN DIEGO, CA, USA, 6-9 JUNE 1994. & NORTH ATLANTIC
TREATY ORGANIZATION ORGANISATION DU TRAITE DE L'ATLANTIQUE NORD UB/TIB
HANNOVER 89 112 083048 CONTENTS PAGE THEME/THEME III AVIONICS PANEL AND
TECHNICALPROGRAMME COMMITTEE IV TECHNICAL EVALUATION REPORT * DISCUSSION
ISSUES T BY J.M. BORKY KEYNOTE ADDRESS BY HONORABLE R.N. LONGUEMARE (NOT
PUBLISHED) SESSION I *CURRENTPACKAGINGDESIGNS AND LIMITATIONS THE IMPACT
OF ADVANCED PACKAGING TECHNOLOGY ON MODULAR AVIONICS ARCHITECTURES 1 BY
R. MORGAN, J. OSTGAARD STANDARD HARDWARE ACQUISITION AND RELIABILITY
PROGRAM (SHARP) ADVANCED SEM-E 2 PACKAGING BY M.H. MOSIER, A. HAWKINS
FASTPACK: SOLUTIONS OPTIMISEES POUR LECONDITIONNEMENT DE PAVIONIQUE
MODULAIRE ISSUES 3 D'UNE ETUDE PARAMETRIQUE. PART I: ASPECTS PORTEUR PAR
G. VEBER, S. BARBAGELETA, P. HELIE FASTPACK: OPTIMIZED SOLUTIONS FOR
MODULAR AVIONICS DERIVED FROM A PARAMETRIC STUDY. 4 PART H: AVIONICS BY
M. CAPLOT, G. LABAUNE, C. CAPOGNA, C. SARNO, J. HERREWYN, J.C. DHAUSSY,
P. BLEICHER THE ADVANCED AVIONICS SUBSYSTEM TECHNOLOGY DEMONSTRATION
PROGRAM 5 BY T. MONAGHAN, G. KANAWATI, J. ABRAHAM, D. OLSON, R. IYER
IMPROVING MULTICHIP MODULE (MCM) DESIGN AND RELIABILITY USING THE
INTELLIGENTMCM 6 ANALYZER BY MJ. STOKLOSA, D.J. HOLZHAUER, D.W.
RICHARDS, P.J. ROCCI, P.S. YAWORSKY SESSION II *REQUIREMENTS
FORADVANCEDPACKAGINGTECHNOLOGY ULTRA-RELIABLE DIGITAL AVIONICS (URDA)
PROCESSOR 7 BY R. BRANSTETTER, W. RUSZCZYK, F. MIVILLE PACKAGING THEMAMA
MODULE 8 BY J.D. SEALS THE DEMISE OFPLASTIC ENCAPSULATED MICROCIRCUIT
MYTHS 9 BY E.B. HAKIM, R.K. AGARWAL, M. PECHT MCMS FOR AVIONICS *
TECHNOLOGY SELECTION AND INTERMODULE INTERCONNECTION 10 BY N. CHANDLER,
I.R. CROSTON, S.G. TYLER, T.G. HAMILL, P.E. HOLBOURN 3-D COMPUTER 11* BY
M. LITTLE, M. YUNG ADVANCED STANDARD ELECTRONIC MODULES FORMAT-E (SEM-E)
PROCESSES FOR RAPID PROTOTYPING 12 BY A. HAWKINS RELIABILITY ASSESSMENT
OF MULTICHIP MODULE TECHNOLOGIES VIA THE TRI-SERVICE/NASA 13 RELTECH
PROGRAM BY D.F. FAYETTE ASSURING KNOWN GOOD DIE (KGD) FOR RELIABLE, COST
EFFECTIVE MCMS 14 BY D.E. DASKIEWICH THE DESIGN AND MANUFACTURING
DEVELOPMENT OF AN ACTIVE SILICON SUBSTRATE MCM 15 BY M.G. ROUGHTON, L.
WAITE HIGH DENSITY MONOLITHIC PACKAGING TECHNOLOGY FOR DIGITAL/MICROWAVE
AVIONICS 16 BY T.G. FERTIG, T. WALTER, E. GAVER, K. LEAHY SESSION FFL *
ADVANCED PACKAGING TECHNOLOGIES LIQUID FLOW-THROUGH COOLING OF
ELECTRONIC MODULES 17 BY S. SRIDHAR, M.D. OSTERMAN, J.M. CARBONELL, K.E.
HEROLD IMMERSION/TWO PHASE COOLING 18 BY J. JONES, E. PERKOSKI
MICROCHANNEL HEAT PIPE COOLING OF MODULES 19 BY G. MOSER THE IEEE
SCALABLE COHERENT INTERFACE * AN APPROACH FOR A UNIFIED AVIONICS NETWORK
20 BY R. LACHENMAIER, T. STRETCH A TECHNIQUE FOR INCREASING THE
BANDWIDTH OF HIGH PERFORMANCE ELECTRICAL BACKPLANES 21 BY W. ROSEN, S.
RAJAN, V. GERSHMAN, M. SHADARAM PAPER CANCELLED 22 OPTICAL BACKPLANE FOR
MODULAR AVIONICS 23 BY R. BOGENBERGER, O. KRUMPHOLZ HIGH PERFORMANCE
BACKPLANE COMPONENTS FOR MODULAR AVIONICS 24 BY C.J. GROVES-KIRBY, M.J.
GOODWIN, J.P. HALL, G. GLYNN, J. HANKEY, M.D. SALIK, R.C. GOODFELLOW, D.
JIBB THE ROC OPTICAL CONNECTOR 25 BY R.J. PIMPINELLA, J.D. SEALS
SESSIONIV *ADVANCEDPACKAGING APPLICATIONS BOITIERS COMPOSITES POUR
EQUIPEMENTS ELECTRONIQUES AEROPORTES : UNE ETUDE TECHNOLOGIQUE 26 ET CEM
PAR B. DUMONT, J. LECUELLET, S. LAFORET, G. LABAUNE, M. CAPLOT
LIGHTWEIGHT ELECTRONIC ENCLOSURES USING COMPOSITE MATERIALS 27 BY C.
SARNO DISTRIBUTED POWER FOR AVIONICS SUBSYSTEMS BY R.L. STEIGERWALD, MR.
WILDI ALIMENTATIONS MODULAIRES POUR UNE ARCHITECTURE DISTRIBUEE PAR A.
MOREAU, JM. REY, M. CAPLOT, JP. DELVINQUIER PAPER CANCELLED
ELECTROMAGNETIC COMPATIBILITY EFFECTS OF ADVANCED PACKAGING
CONFIGURATIONS BY B. AUDONE, L. BOLLA, D. TARDUCCI MODULAR CNI AVIONICS
SYSTEM BY P.H. REITBERGER, G. MEY * NOT AVAILABLE AT TIME OFPRINTING VIL |
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| isbn | 9283600045 |
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| spelling | Advanced packaging concepts for digital avionics papers presented at the Avionics Panel Symposium held in San Diego, USA, 6 - 9 June 1994 Neuilly sur Seine AGARD 1994 Getr. Zählung graph.Darst. txt rdacontent n rdamedia nc rdacarrier AGARD conference proceedings 562 Digitaltechnik (DE-588)4012303-0 gnd rswk-swf VLSI (DE-588)4117388-0 gnd rswk-swf Avionik (DE-588)4196491-3 gnd rswk-swf (DE-588)1071861417 Konferenzschrift gnd-content Digitaltechnik (DE-588)4012303-0 s DE-604 VLSI (DE-588)4117388-0 s Avionik (DE-588)4196491-3 s AGARD conference proceedings 562 (DE-604)BV001900884 GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=015344684&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Advanced packaging concepts for digital avionics papers presented at the Avionics Panel Symposium held in San Diego, USA, 6 - 9 June 1994 AGARD conference proceedings Digitaltechnik (DE-588)4012303-0 gnd VLSI (DE-588)4117388-0 gnd Avionik (DE-588)4196491-3 gnd |
| subject_GND | (DE-588)4012303-0 (DE-588)4117388-0 (DE-588)4196491-3 (DE-588)1071861417 |
| title | Advanced packaging concepts for digital avionics papers presented at the Avionics Panel Symposium held in San Diego, USA, 6 - 9 June 1994 |
| title_auth | Advanced packaging concepts for digital avionics papers presented at the Avionics Panel Symposium held in San Diego, USA, 6 - 9 June 1994 |
| title_exact_search | Advanced packaging concepts for digital avionics papers presented at the Avionics Panel Symposium held in San Diego, USA, 6 - 9 June 1994 |
| title_exact_search_txtP | Advanced packaging concepts for digital avionics papers presented at the Avionics Panel Symposium held in San Diego, USA, 6 - 9 June 1994 |
| title_full | Advanced packaging concepts for digital avionics papers presented at the Avionics Panel Symposium held in San Diego, USA, 6 - 9 June 1994 |
| title_fullStr | Advanced packaging concepts for digital avionics papers presented at the Avionics Panel Symposium held in San Diego, USA, 6 - 9 June 1994 |
| title_full_unstemmed | Advanced packaging concepts for digital avionics papers presented at the Avionics Panel Symposium held in San Diego, USA, 6 - 9 June 1994 |
| title_short | Advanced packaging concepts for digital avionics |
| title_sort | advanced packaging concepts for digital avionics papers presented at the avionics panel symposium held in san diego usa 6 9 june 1994 |
| title_sub | papers presented at the Avionics Panel Symposium held in San Diego, USA, 6 - 9 June 1994 |
| topic | Digitaltechnik (DE-588)4012303-0 gnd VLSI (DE-588)4117388-0 gnd Avionik (DE-588)4196491-3 gnd |
| topic_facet | Digitaltechnik VLSI Avionik Konferenzschrift |
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