Thick film technology and chip joining:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
New York [u.a.]
Gordon and Breach
1972
|
| Schriftenreihe: | Process and materials in electronics
1 |
| Schlagworte: | |
| Beschreibung: | 221 S. Ill., graph. Darst. |
| ISBN: | 0677034407 |
Internformat
MARC
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| 245 | 1 | 0 | |a Thick film technology and chip joining |c Lewis F. Miller |
| 264 | 1 | |a New York [u.a.] |b Gordon and Breach |c 1972 | |
| 300 | |a 221 S. |b Ill., graph. Darst. | ||
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| 830 | 0 | |a Process and materials in electronics |v 1 |w (DE-604)BV021855329 | |
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Datensatz im Suchindex
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|---|---|
| adam_txt | |
| any_adam_object | |
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| author | Miller, Lewis F. |
| author_facet | Miller, Lewis F. |
| author_role | aut |
| author_sort | Miller, Lewis F. |
| author_variant | l f m lf lfm |
| building | Verbundindex |
| bvnumber | BV022070113 |
| callnumber-first | T - Technology |
| callnumber-label | TK7874 |
| callnumber-raw | TK7874 |
| callnumber-search | TK7874 |
| callnumber-sort | TK 47874 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | UP 7500 |
| ctrlnum | (OCoLC)447124 (DE-599)BVBBV022070113 |
| dewey-full | 621.381/73 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/73 |
| dewey-search | 621.381/73 |
| dewey-sort | 3621.381 273 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV022070113 |
| illustrated | Illustrated |
| index_date | 2024-07-02T16:13:52Z |
| indexdate | 2024-07-09T20:50:10Z |
| institution | BVB |
| isbn | 0677034407 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015284894 |
| oclc_num | 447124 |
| open_access_boolean | |
| owner | DE-706 |
| owner_facet | DE-706 |
| physical | 221 S. Ill., graph. Darst. |
| publishDate | 1972 |
| publishDateSearch | 1972 |
| publishDateSort | 1972 |
| publisher | Gordon and Breach |
| record_format | marc |
| series | Process and materials in electronics |
| series2 | Process and materials in electronics |
| spelling | Miller, Lewis F. Verfasser aut Thick film technology and chip joining Lewis F. Miller New York [u.a.] Gordon and Breach 1972 221 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Process and materials in electronics 1 Microelectronics Thick films Dickschichttechnik (DE-588)4012133-1 gnd rswk-swf Dickschichttechnik (DE-588)4012133-1 s DE-604 Process and materials in electronics 1 (DE-604)BV021855329 |
| spellingShingle | Miller, Lewis F. Thick film technology and chip joining Process and materials in electronics Microelectronics Thick films Dickschichttechnik (DE-588)4012133-1 gnd |
| subject_GND | (DE-588)4012133-1 |
| title | Thick film technology and chip joining |
| title_auth | Thick film technology and chip joining |
| title_exact_search | Thick film technology and chip joining |
| title_exact_search_txtP | Thick film technology and chip joining |
| title_full | Thick film technology and chip joining Lewis F. Miller |
| title_fullStr | Thick film technology and chip joining Lewis F. Miller |
| title_full_unstemmed | Thick film technology and chip joining Lewis F. Miller |
| title_short | Thick film technology and chip joining |
| title_sort | thick film technology and chip joining |
| topic | Microelectronics Thick films Dickschichttechnik (DE-588)4012133-1 gnd |
| topic_facet | Microelectronics Thick films Dickschichttechnik |
| volume_link | (DE-604)BV021855329 |
| work_keys_str_mv | AT millerlewisf thickfilmtechnologyandchipjoining |