Proceedings: [4] January 22-24, 1992, Fairmont Hotel, Calif., USA
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Bibliographic Details
Corporate Author: International Conference on Wafer Scale Integration (Author)
Format: Conference Proceeding Book
Language:English
Published: Washington, DC IEEE Computer Soc. Pr. 1992
Subjects:
Physical Description:XI, 363 S. Ill., graph. Darst.
ISBN:0818624825
0780306767
0818624817

There is no print copy available.

Interlibrary loan Place Request Caution: Not in THWS collection!