APA (7th ed.) Citation

(2001). Special issue on advances in materials science of IC interconnects and packaging. TMS.

Chicago Style (17th ed.) Citation

Special Issue on Advances in Materials Science of IC Interconnects and Packaging. Warrendale, PA: TMS, 2001.

MLA (9th ed.) Citation

Special Issue on Advances in Materials Science of IC Interconnects and Packaging. TMS, 2001.

Warning: These citations may not always be 100% accurate.