Microelectronic packaging and assembling:
Saved in:
Bibliographic Details
Format: Book
Language:English
Published: Oxford Pergamon 2000
Subjects:
Item Description:Literaturangaben. - In: Microelectronics reliability ; 40 (2000),7 : Special issue
Physical Description:S. 1069 - 1241, XI S. Ill., graph. Darst.

There is no print copy available.

Interlibrary loan Place Request Caution: Not in THWS collection!