Handbook of plasma processing technology: fundamentals, etching, deposition, and surface interactions
Gespeichert in:
Format: | Buch |
---|---|
Sprache: | English |
Veröffentlicht: |
Park Ridge, NJ
Noyes
1990
|
Ausgabe: | 2.print. |
Schlagworte: | |
Beschreibung: | XXIII, 523 S. |
ISBN: | 0815512201 |
Internformat
MARC
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245 | 1 | 0 | |a Handbook of plasma processing technology |b fundamentals, etching, deposition, and surface interactions |
250 | |a 2.print. | ||
264 | 1 | |a Park Ridge, NJ |b Noyes |c 1990 | |
300 | |a XXIII, 523 S. | ||
336 | |b txt |2 rdacontent | ||
337 | |b n |2 rdamedia | ||
338 | |b nc |2 rdacarrier | ||
650 | 4 | |a Ingeniería del plasma | |
650 | 4 | |a Plasma - Erosión selectiva | |
650 | 4 | |a Semiconductores - Ataque químico | |
650 | 4 | |a Plasma engineering | |
650 | 4 | |a Plasma etching | |
650 | 4 | |a Semiconductors |x Etching | |
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700 | 1 | |a Rossnagel, Stephen M. |e Sonstige |4 oth | |
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Datensatz im Suchindex
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adam_txt | |
any_adam_object | |
any_adam_object_boolean | |
building | Verbundindex |
bvnumber | BV021910173 |
callnumber-first | T - Technology |
callnumber-label | TA2020 |
callnumber-raw | TA2020 |
callnumber-search | TA2020 |
callnumber-sort | TA 42020 |
callnumber-subject | TA - General and Civil Engineering |
classification_rvk | ZM 7680 |
ctrlnum | (OCoLC)53783848 (DE-599)BVBBV021910173 |
discipline | Werkstoffwissenschaften / Fertigungstechnik |
discipline_str_mv | Werkstoffwissenschaften / Fertigungstechnik |
edition | 2.print. |
format | Book |
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id | DE-604.BV021910173 |
illustrated | Not Illustrated |
index_date | 2024-07-02T16:05:12Z |
indexdate | 2024-07-09T20:47:12Z |
institution | BVB |
isbn | 0815512201 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015125348 |
oclc_num | 53783848 |
open_access_boolean | |
owner | DE-706 |
owner_facet | DE-706 |
physical | XXIII, 523 S. |
publishDate | 1990 |
publishDateSearch | 1990 |
publishDateSort | 1990 |
publisher | Noyes |
record_format | marc |
spelling | Handbook of plasma processing technology fundamentals, etching, deposition, and surface interactions 2.print. Park Ridge, NJ Noyes 1990 XXIII, 523 S. txt rdacontent n rdamedia nc rdacarrier Ingeniería del plasma Plasma - Erosión selectiva Semiconductores - Ataque químico Plasma engineering Plasma etching Semiconductors Etching Plasmastrahlbearbeitung (DE-588)4136199-4 gnd rswk-swf Sputtern (DE-588)4182614-0 gnd rswk-swf Plasmaätzen (DE-588)4174821-9 gnd rswk-swf Dünnschichttechnik (DE-588)4136339-5 gnd rswk-swf Halbleiter (DE-588)4022993-2 gnd rswk-swf Ätzen (DE-588)4000648-7 gnd rswk-swf Plasma (DE-588)4046249-3 gnd rswk-swf Plasmatechnik (DE-588)4140353-8 gnd rswk-swf Ätzen (DE-588)4000648-7 s DE-604 Plasma (DE-588)4046249-3 s Dünnschichttechnik (DE-588)4136339-5 s Halbleiter (DE-588)4022993-2 s Plasmastrahlbearbeitung (DE-588)4136199-4 s 1\p DE-604 Plasmatechnik (DE-588)4140353-8 s 2\p DE-604 Sputtern (DE-588)4182614-0 s 3\p DE-604 Plasmaätzen (DE-588)4174821-9 s 4\p DE-604 Rossnagel, Stephen M. Sonstige oth 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 3\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 4\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
spellingShingle | Handbook of plasma processing technology fundamentals, etching, deposition, and surface interactions Ingeniería del plasma Plasma - Erosión selectiva Semiconductores - Ataque químico Plasma engineering Plasma etching Semiconductors Etching Plasmastrahlbearbeitung (DE-588)4136199-4 gnd Sputtern (DE-588)4182614-0 gnd Plasmaätzen (DE-588)4174821-9 gnd Dünnschichttechnik (DE-588)4136339-5 gnd Halbleiter (DE-588)4022993-2 gnd Ätzen (DE-588)4000648-7 gnd Plasma (DE-588)4046249-3 gnd Plasmatechnik (DE-588)4140353-8 gnd |
subject_GND | (DE-588)4136199-4 (DE-588)4182614-0 (DE-588)4174821-9 (DE-588)4136339-5 (DE-588)4022993-2 (DE-588)4000648-7 (DE-588)4046249-3 (DE-588)4140353-8 |
title | Handbook of plasma processing technology fundamentals, etching, deposition, and surface interactions |
title_auth | Handbook of plasma processing technology fundamentals, etching, deposition, and surface interactions |
title_exact_search | Handbook of plasma processing technology fundamentals, etching, deposition, and surface interactions |
title_exact_search_txtP | Handbook of plasma processing technology fundamentals, etching, deposition, and surface interactions |
title_full | Handbook of plasma processing technology fundamentals, etching, deposition, and surface interactions |
title_fullStr | Handbook of plasma processing technology fundamentals, etching, deposition, and surface interactions |
title_full_unstemmed | Handbook of plasma processing technology fundamentals, etching, deposition, and surface interactions |
title_short | Handbook of plasma processing technology |
title_sort | handbook of plasma processing technology fundamentals etching deposition and surface interactions |
title_sub | fundamentals, etching, deposition, and surface interactions |
topic | Ingeniería del plasma Plasma - Erosión selectiva Semiconductores - Ataque químico Plasma engineering Plasma etching Semiconductors Etching Plasmastrahlbearbeitung (DE-588)4136199-4 gnd Sputtern (DE-588)4182614-0 gnd Plasmaätzen (DE-588)4174821-9 gnd Dünnschichttechnik (DE-588)4136339-5 gnd Halbleiter (DE-588)4022993-2 gnd Ätzen (DE-588)4000648-7 gnd Plasma (DE-588)4046249-3 gnd Plasmatechnik (DE-588)4140353-8 gnd |
topic_facet | Ingeniería del plasma Plasma - Erosión selectiva Semiconductores - Ataque químico Plasma engineering Plasma etching Semiconductors Etching Plasmastrahlbearbeitung Sputtern Plasmaätzen Dünnschichttechnik Halbleiter Ätzen Plasma Plasmatechnik |
work_keys_str_mv | AT rossnagelstephenm handbookofplasmaprocessingtechnologyfundamentalsetchingdepositionandsurfaceinteractions |