ITherm ...: ITherm ... proceedings
Gespeichert in:
| Körperschaft: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Piscataway, NJ
IEEE
|
| Schlagworte: | |
| Beschreibung: | Bis 5 (1996) u.d.T.: Intersociety Conference on Thermal Phenomena in Electronic Systems: Intersociety Conference on Thermal Phenomena in Electronical Systems |
Internformat
MARC
| LEADER | 00000nam a2200000zca4500 | ||
|---|---|---|---|
| 001 | BV021859054 | ||
| 003 | DE-604 | ||
| 005 | 20130320 | ||
| 007 | t | ||
| 008 | 981026nuuuuuuuu |||| 10||| eng d | ||
| 022 | |y 1089-9870 |2 6 | ||
| 035 | |a (OCoLC)633690769 | ||
| 035 | |a (DE-599)BVBBV021859054 | ||
| 040 | |a DE-604 |b ger | ||
| 041 | 0 | |a eng | |
| 110 | 2 | |a Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems |e Verfasser |0 (DE-588)16147806-2 |4 aut | |
| 245 | 1 | 0 | |a ITherm ... |b ITherm ... proceedings |
| 264 | 1 | |a Piscataway, NJ |b IEEE | |
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 500 | |a Bis 5 (1996) u.d.T.: Intersociety Conference on Thermal Phenomena in Electronic Systems: Intersociety Conference on Thermal Phenomena in Electronical Systems | ||
| 650 | 0 | 7 | |a Halbleiterbauelement |0 (DE-588)4113826-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Temperaturabhängigkeit |0 (DE-588)4203793-1 |2 gnd |9 rswk-swf |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 689 | 0 | 0 | |a Halbleiterbauelement |0 (DE-588)4113826-0 |D s |
| 689 | 0 | 1 | |a Temperaturabhängigkeit |0 (DE-588)4203793-1 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Bhavnani, Sushil H. |e Sonstige |4 oth | |
| 700 | 1 | |a Kromann, Gary B. |e Sonstige |4 oth | |
| 700 | 1 | |a Amon, Cristina H. |e Sonstige |4 oth | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-015074840 | ||
Datensatz im Suchindex
| _version_ | 1804135798100983808 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author_corporate | Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems |
| author_corporate_role | aut |
| author_facet | Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems |
| author_sort | Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems |
| building | Verbundindex |
| bvnumber | BV021859054 |
| ctrlnum | (OCoLC)633690769 (DE-599)BVBBV021859054 |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01363nam a2200349zca4500</leader><controlfield tag="001">BV021859054</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20130320 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">981026nuuuuuuuu |||| 10||| eng d</controlfield><datafield tag="022" ind1=" " ind2=" "><subfield code="y">1089-9870</subfield><subfield code="2">6</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)633690769</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV021859054</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="110" ind1="2" ind2=" "><subfield code="a">Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems</subfield><subfield code="e">Verfasser</subfield><subfield code="0">(DE-588)16147806-2</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">ITherm ...</subfield><subfield code="b">ITherm ... proceedings</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Piscataway, NJ</subfield><subfield code="b">IEEE</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Bis 5 (1996) u.d.T.: Intersociety Conference on Thermal Phenomena in Electronic Systems: Intersociety Conference on Thermal Phenomena in Electronical Systems</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Halbleiterbauelement</subfield><subfield code="0">(DE-588)4113826-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Temperaturabhängigkeit</subfield><subfield code="0">(DE-588)4203793-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Halbleiterbauelement</subfield><subfield code="0">(DE-588)4113826-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Temperaturabhängigkeit</subfield><subfield code="0">(DE-588)4203793-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Bhavnani, Sushil H.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kromann, Gary B.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Amon, Cristina H.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-015074840</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV021859054 |
| illustrated | Not Illustrated |
| index_date | 2024-07-02T16:02:53Z |
| indexdate | 2024-07-09T20:46:13Z |
| institution | BVB |
| institution_GND | (DE-588)16147806-2 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015074840 |
| oclc_num | 633690769 |
| open_access_boolean | |
| publishDateSort | 0000 |
| publisher | IEEE |
| record_format | marc |
| spelling | Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Verfasser (DE-588)16147806-2 aut ITherm ... ITherm ... proceedings Piscataway, NJ IEEE txt rdacontent n rdamedia nc rdacarrier Bis 5 (1996) u.d.T.: Intersociety Conference on Thermal Phenomena in Electronic Systems: Intersociety Conference on Thermal Phenomena in Electronical Systems Halbleiterbauelement (DE-588)4113826-0 gnd rswk-swf Temperaturabhängigkeit (DE-588)4203793-1 gnd rswk-swf (DE-588)1071861417 Konferenzschrift gnd-content Halbleiterbauelement (DE-588)4113826-0 s Temperaturabhängigkeit (DE-588)4203793-1 s DE-604 Bhavnani, Sushil H. Sonstige oth Kromann, Gary B. Sonstige oth Amon, Cristina H. Sonstige oth |
| spellingShingle | ITherm ... ITherm ... proceedings Halbleiterbauelement (DE-588)4113826-0 gnd Temperaturabhängigkeit (DE-588)4203793-1 gnd |
| subject_GND | (DE-588)4113826-0 (DE-588)4203793-1 (DE-588)1071861417 |
| title | ITherm ... ITherm ... proceedings |
| title_auth | ITherm ... ITherm ... proceedings |
| title_exact_search | ITherm ... ITherm ... proceedings |
| title_exact_search_txtP | ITherm ... ITherm ... proceedings |
| title_full | ITherm ... ITherm ... proceedings |
| title_fullStr | ITherm ... ITherm ... proceedings |
| title_full_unstemmed | ITherm ... ITherm ... proceedings |
| title_short | ITherm ... |
| title_sort | itherm itherm proceedings |
| title_sub | ITherm ... proceedings |
| topic | Halbleiterbauelement (DE-588)4113826-0 gnd Temperaturabhängigkeit (DE-588)4203793-1 gnd |
| topic_facet | Halbleiterbauelement Temperaturabhängigkeit Konferenzschrift |
| work_keys_str_mv | AT intersocietyconferenceonthermalandthermomechanicalphenomenainelectronicsystems ithermithermproceedings AT bhavnanisushilh ithermithermproceedings AT kromanngaryb ithermithermproceedings AT amoncristinah ithermithermproceedings |