Bonding in microsystem technology:
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Bibliographic Details
Main Author: Dziuban, Jan A. (Author)
Format: Book
Language:English
Published: [Berlin] Springer 2006
Series:Springer series in advanced microelectronics 24
Subjects:
Online Access:Inhaltstext
Physical Description:XVIII, 331 S. Ill., graph. Darst.
ISBN:1402045786
1402045891
9781402045783
9781402045899

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