Bonding in microsystem technology:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
[Berlin]
Springer
2006
|
| Schriftenreihe: | Springer series in advanced microelectronics
24 |
| Schlagworte: | |
| Online-Zugang: | Inhaltstext |
| Beschreibung: | XVIII, 331 S. Ill., graph. Darst. |
| ISBN: | 1402045786 1402045891 9781402045783 9781402045899 |
Internformat
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| 245 | 1 | 0 | |a Bonding in microsystem technology |c J. A. Dziuban |
| 264 | 1 | |a [Berlin] |b Springer |c 2006 | |
| 300 | |a XVIII, 331 S. |b Ill., graph. Darst. | ||
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Datensatz im Suchindex
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| discipline | Maschinenbau / Maschinenwesen Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Maschinenbau / Maschinenwesen Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| illustrated | Illustrated |
| index_date | 2024-07-02T15:58:21Z |
| indexdate | 2024-07-09T20:45:43Z |
| institution | BVB |
| isbn | 1402045786 1402045891 9781402045783 9781402045899 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015046704 |
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| physical | XVIII, 331 S. Ill., graph. Darst. |
| publishDate | 2006 |
| publishDateSearch | 2006 |
| publishDateSort | 2006 |
| publisher | Springer |
| record_format | marc |
| series | Springer series in advanced microelectronics |
| series2 | Springer series in advanced microelectronics |
| spelling | Dziuban, Jan A. Verfasser aut Bonding in microsystem technology J. A. Dziuban [Berlin] Springer 2006 XVIII, 331 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Springer series in advanced microelectronics 24 Bonden (DE-588)4232594-8 gnd rswk-swf Mikrosystemtechnik (DE-588)4221617-5 gnd rswk-swf Bonden (DE-588)4232594-8 s Mikrosystemtechnik (DE-588)4221617-5 s DE-604 Springer series in advanced microelectronics 24 (DE-604)BV012563021 24 text/html http://deposit.dnb.de/cgi-bin/dokserv?id=2803809&prov=M&dok_var=1&dok_ext=htm Inhaltstext |
| spellingShingle | Dziuban, Jan A. Bonding in microsystem technology Springer series in advanced microelectronics Bonden (DE-588)4232594-8 gnd Mikrosystemtechnik (DE-588)4221617-5 gnd |
| subject_GND | (DE-588)4232594-8 (DE-588)4221617-5 |
| title | Bonding in microsystem technology |
| title_auth | Bonding in microsystem technology |
| title_exact_search | Bonding in microsystem technology |
| title_exact_search_txtP | Bonding in microsystem technology |
| title_full | Bonding in microsystem technology J. A. Dziuban |
| title_fullStr | Bonding in microsystem technology J. A. Dziuban |
| title_full_unstemmed | Bonding in microsystem technology J. A. Dziuban |
| title_short | Bonding in microsystem technology |
| title_sort | bonding in microsystem technology |
| topic | Bonden (DE-588)4232594-8 gnd Mikrosystemtechnik (DE-588)4221617-5 gnd |
| topic_facet | Bonden Mikrosystemtechnik |
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