Lead-free solder interconnect reliability:
Saved in:
| Format: | Book |
|---|---|
| Language: | English |
| Published: |
Materials Park, OH
ASM International
2005
|
| Subjects: | |
| Item Description: | Includes bibliographical references and index |
| Physical Description: | x, 292 p. ill. 26 cm |
| ISBN: | 0871708167 |
Staff View
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| 300 | |a x, 292 p. |b ill. |c 26 cm | ||
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| 500 | |a Includes bibliographical references and index | ||
| 650 | 4 | |a Microelectronic packaging |x Reliability | |
| 650 | 4 | |a Solder and soldering | |
| 650 | 4 | |a Lead-free electronics manufacturing processes | |
| 700 | 1 | |a Shangguan, Dongkai |e Sonstige |4 oth | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-015006237 | ||
Record in the Search Index
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| id | DE-604.BV021793637 |
| illustrated | Illustrated |
| index_date | 2024-07-02T15:45:24Z |
| indexdate | 2024-07-09T20:44:45Z |
| institution | BVB |
| isbn | 0871708167 |
| language | English |
| lccn | 2005050106 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015006237 |
| oclc_num | 60543308 |
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| owner | DE-Aug4 |
| owner_facet | DE-Aug4 |
| physical | x, 292 p. ill. 26 cm |
| publishDate | 2005 |
| publishDateSearch | 2005 |
| publishDateSort | 2005 |
| publisher | ASM International |
| record_format | marc |
| spelling | Lead-free solder interconnect reliability edited by Dongkai Shangguan Materials Park, OH ASM International 2005 x, 292 p. ill. 26 cm txt rdacontent n rdamedia nc rdacarrier Includes bibliographical references and index Microelectronic packaging Reliability Solder and soldering Lead-free electronics manufacturing processes Shangguan, Dongkai Sonstige oth |
| spellingShingle | Lead-free solder interconnect reliability Microelectronic packaging Reliability Solder and soldering Lead-free electronics manufacturing processes |
| title | Lead-free solder interconnect reliability |
| title_auth | Lead-free solder interconnect reliability |
| title_exact_search | Lead-free solder interconnect reliability |
| title_exact_search_txtP | Lead-free solder interconnect reliability |
| title_full | Lead-free solder interconnect reliability edited by Dongkai Shangguan |
| title_fullStr | Lead-free solder interconnect reliability edited by Dongkai Shangguan |
| title_full_unstemmed | Lead-free solder interconnect reliability edited by Dongkai Shangguan |
| title_short | Lead-free solder interconnect reliability |
| title_sort | lead free solder interconnect reliability |
| topic | Microelectronic packaging Reliability Solder and soldering Lead-free electronics manufacturing processes |
| topic_facet | Microelectronic packaging Reliability Solder and soldering Lead-free electronics manufacturing processes |
| work_keys_str_mv | AT shangguandongkai leadfreesolderinterconnectreliability |