Lead-free solder interconnect reliability:
Gespeichert in:
Format: | Buch |
---|---|
Sprache: | English |
Veröffentlicht: |
Materials Park, OH
ASM International
2005
|
Schlagworte: | |
Beschreibung: | Includes bibliographical references and index |
Beschreibung: | x, 292 p. ill. 26 cm |
ISBN: | 0871708167 |
Internformat
MARC
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500 | |a Includes bibliographical references and index | ||
650 | 4 | |a Microelectronic packaging |x Reliability | |
650 | 4 | |a Solder and soldering | |
650 | 4 | |a Lead-free electronics manufacturing processes | |
700 | 1 | |a Shangguan, Dongkai |e Sonstige |4 oth | |
999 | |a oai:aleph.bib-bvb.de:BVB01-015006237 |
Datensatz im Suchindex
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bvnumber | BV021793637 |
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callnumber-raw | TK7870.15 |
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callnumber-sort | TK 47870.15 |
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dewey-full | 621.381/046 |
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dewey-ones | 621 - Applied physics |
dewey-raw | 621.381/046 |
dewey-search | 621.381/046 |
dewey-sort | 3621.381 246 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Book |
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id | DE-604.BV021793637 |
illustrated | Illustrated |
index_date | 2024-07-02T15:45:24Z |
indexdate | 2024-07-09T20:44:45Z |
institution | BVB |
isbn | 0871708167 |
language | English |
lccn | 2005050106 |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-015006237 |
oclc_num | 60543308 |
open_access_boolean | |
owner | DE-Aug4 |
owner_facet | DE-Aug4 |
physical | x, 292 p. ill. 26 cm |
publishDate | 2005 |
publishDateSearch | 2005 |
publishDateSort | 2005 |
publisher | ASM International |
record_format | marc |
spelling | Lead-free solder interconnect reliability edited by Dongkai Shangguan Materials Park, OH ASM International 2005 x, 292 p. ill. 26 cm txt rdacontent n rdamedia nc rdacarrier Includes bibliographical references and index Microelectronic packaging Reliability Solder and soldering Lead-free electronics manufacturing processes Shangguan, Dongkai Sonstige oth |
spellingShingle | Lead-free solder interconnect reliability Microelectronic packaging Reliability Solder and soldering Lead-free electronics manufacturing processes |
title | Lead-free solder interconnect reliability |
title_auth | Lead-free solder interconnect reliability |
title_exact_search | Lead-free solder interconnect reliability |
title_exact_search_txtP | Lead-free solder interconnect reliability |
title_full | Lead-free solder interconnect reliability edited by Dongkai Shangguan |
title_fullStr | Lead-free solder interconnect reliability edited by Dongkai Shangguan |
title_full_unstemmed | Lead-free solder interconnect reliability edited by Dongkai Shangguan |
title_short | Lead-free solder interconnect reliability |
title_sort | lead free solder interconnect reliability |
topic | Microelectronic packaging Reliability Solder and soldering Lead-free electronics manufacturing processes |
topic_facet | Microelectronic packaging Reliability Solder and soldering Lead-free electronics manufacturing processes |
work_keys_str_mv | AT shangguandongkai leadfreesolderinterconnectreliability |