Organic electronics: materials, manufacturing and applications
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| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Weinheim
WILEY-VCH
2006
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| Ausgabe: | 1. ed. |
| Schlagworte: | |
| Online-Zugang: | Inhaltstext Inhaltsverzeichnis |
| Beschreibung: | XVII, 428 S. Ill., graph. Darst. 240 mm x 170 mm |
| ISBN: | 3527312641 9783527312641 |
Internformat
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| 245 | 1 | 0 | |a Organic electronics |b materials, manufacturing and applications |c ed. by Hagen Klauk |
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| 264 | 1 | |a Weinheim |b WILEY-VCH |c 2006 | |
| 300 | |a XVII, 428 S. |b Ill., graph. Darst. |c 240 mm x 170 mm | ||
| 336 | |b txt |2 rdacontent | ||
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| 650 | 4 | |a Organic electronics | |
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Datensatz im Suchindex
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| adam_text | ORGANIC ELECTRONICS MATERIALS, MANUFACTURING AND APPLICATIONS EDITED BY
HAGEN KLAUK WTTEY- VCH ^/ILEY-VCH VERLAG GMBH & CO. KGAA THE EDITOR DR
HAGEN KLAUK MAX PLANCK INSTITUTE FOR SOLID STATE RESEARCH HEISENBERGSTR.
I 70569 STUTTGART GERMANY ALL BOOKS PUBLISHED BY WILEY-VCH ARE CAREFULLY
PRODUCED. NEVERTHELESS, AUTHORS, EDITORS, AND PUBLISHER DO NOT WANANT
THE INFOMATION CONTAINED IN THESE BOOKS, INCLUDING THIS BOOK, TO BE FREE
OFERRORS. READERS ARE ADVISED TO KEEP IN MIND THAT STATEMENTS, DATA,
ILLUSTRATIONS, PROCEDURAL DETAILS OR OTHER ITEMS MAY INADVEDENTLY BE
INACCURATE. LIBRARY OFCONGRESS CARD NO.: APPLIED FOR BRITISH LIBRARY
CATALOGUING-IN-PUBLICATION DATA A CATALOGUE RECORD FOR THIS BOOK IS
AVAILABLE FROM THE BRITISH LIBRARY. BIBLIOGRAPHIC INFORMATION PUBLISHED
BY DIE DEUTSCHE BIBLIOTHEK DIE DEUTSCHE BIBLIOTHEK LISTS THIS
PUBLICATION IN THE DEUTSCHE NATIONALBIBLIOGRAFIE; DETAILED BIBLIOGRAPHIC
DATA IS AVAILABLE IN THE INTERNET AT (HTTP://DNB.DDB.DE). @ 2006
WILEY-VCH VERLAG GMBH & CO. KGAA, WEINHEIM ALL RIGHTS RESEWED (INCLUDING
THOSE OF TRANSLATION INTO OTHER LANGUAGES). NO PART OF THIS BOOK MAY BE
REPRODUCED IN ANY FOM - BY PHOTOPRINTING, MICROFILM, OR ANY OT}ER MEANS
- NOR TRANSMITTED OR TRANSLATED INTO A MACHINE LANGUGE WITHOUT MITTEN
PERMISSION FROM THE PUBLISHERS. REGISTERED NAMES, TRADEMARKS, ETC. USED
IN THIS BOOK, EVEN WHEN NOT SPECIFICALLY MARKED AS SUCH, ARE NOT TO BE
CONSIDERED UNPROTECTED BY LAW. TYPESETTING ASCO TYPESETTER, HONG KONG
PRINTING STRAUSS GMBH, M BINDING SCHIIFFER GMBH, GRIINSTADT COVER DESIGN
GRAFIK-DESIGN SCHULZ, FUBGRINHEIM PRINTED IN THE FEDERAL REPUBLIC OF
GERMANY PRINTED ON ACID-FREE PAPER F SEN-L 3 978-3-527 -31264-7 RSBN-10
3-527-31264-1 CONTENTS PREFACE XIII AUTHOR LIST XV I INTRODUCTION 1
1 ORGANIC TRANSISTORS GILLES HOROWITZ 3 1.1 INTRODUCTION 3 1.2 OVERVIEW
OF THE ORGANIC THIN-FILM TRANSISTOR 4 1.2.1 ARE ORGANIC
``SEMICONDUCTORS REAL SEMICONDUCTORS? 4 1.2.2 THIN-FILM TRANSISTOR
ARCHITECTURE 7 1.2.3 OPERATING MODE 8 1.2.4 THICKNESS OF THE CHANNEL 10
1.3 CONTACT RESISTANCE 15 1.3.1 CONTACT RESISTANCE EXTRACTION 15 1.3.2
ORIGIN OF CONTACT RESISTANCE 19 1.4 CHARGE TRANSPORT 20 1.5 FABRICATION
TECHNIQUES 21 1.6 THE MATERIALS 23 1.6.1 POLYMERS 23 1.6.2 SMALL
MOLECULES 24 1.6.3 N-TYPE SEMICONDUCTORS 25 1.6.4 SINGLE CRYSTALS 26
1.6.5 INSULATORS 27 1.7 CONCLUDING REMARKS 28 ACKNOWLEDGEMENTS 29
REFERENCES 29 II ADVANCED MATERIALS FOR ORGANIC ELECTRONICS 33 2
HIGH-PERFORMANCE PENTACENE TRANSISTORS TOMMIE KELLEY 35 2.1 INTRODUCTION
35 2.2 ROUTES TO PERFORMANCE IMPROVEMENT 38 2.2.1 PURIFICATION 38 2.2.2
DEVICE EVOLUTION 39 2.2.3 STRUCTURAL PERFECTION 39 2.2.4 DEVICE
ARCHITECTURE 41 2.2.5 INTERFACIAL CONTROL 45 2.3 STRUCTURE--PROPERTY
RELATIONSHIPS 48 2.4 CONTINUING REPORTS OF HIGH MOBILITIES 51 2.5
PERFORMANCE IN PRACTICE 52 2.6 THE FUTURE OF HIGH-PERFORMANCE ORGANIC
TRANSISTORS 53 REFERENCES 54 3 ENGINEERED PENTACENES JOHN E. ANTHONY 58
3.1 INTRODUCTION 58 3.2 REVERSIBLE FUNCTIONALIZATION 59 3.3
2,3,9,10-TETRASUBSTITUTED AND 2,3-DISUBSTITUTED PENTACENES:
END-SUBSTITUTED DERIVATIVES 60 3.4 PERI-FUNCTIONALIZED PENTACENE 63 3.5
PENTACENE FUNCTIONALIZED AT BOTH PERI AND END POSITIONS 68 3.6
HETEROPENTACENES 69 3.7 CONCLUSION 72 REFERENCES 72 4 ORGANIC
SEMICONDUCTORS BASED ON POLYTHIOPHENE AND INDOLO[3,2-B]CARBAZOLE BENG S.
ONG, YILIANG WU, AND YUNING LI 75 4.1 INTRODUCTION 75 4.2 ISSUES AND
CHALLENGES 76 4.3 STRUCTURAL CONSIDERATIONS 79 4.4 POLYTHIOPHENE
SEMICONDUCTORS 80 4.4.1 HIGH-PERFORMANCE POLYTHIOPHENE DESIGN 81 4.4.2
POLYDIALKYLTERTHIOPHENES 82 4.4.3 POLYDIALKYLQUATERTHIOPHENES 87 4.4.4
POLYTHIOPHENE NANOPARTICLES 90 4.4.5 INKJET PATTERNED TFT ARRAYS 94 4.5
INDOCARBAZOLE DESIGNS 95 4.6 SUMMARY AND PROSPECTS 103 ACKNOWLEDGEMENTS
105 REFERENCES 105 5 ELECTRICAL AND ENVIRONMENTAL STABILITY OF POLYMER
THIN-FILM TRANSISTORS ALBERTO SALLEO AND MICHAEL L. CHABINYC 108 5.1
INTRODUCTION 108 5.2 CHARGE TRAPPING IN TFTS 109 5.2.1 GENERAL
CONSIDERATIONS 109 5.2.2 BIAS STRESS IN ORGANIC TRANSISTORS 111 5.3 BIAS
STRESS IN POLYFLUORENE AND POLYTHIOPHENE TFTS 112 5.3.1 REVERSIBLE BIAS
STRESS 113 5.3.2 LONG-LIVED BIAS STRESS 115 5.3.3 DEPENDENCE OF BIAS
STRESS ON OPERATING CONDITIONS; LIFETIME PREDICTIONS 116 5.3.4 A
MICROSCOPIC THEORY OF BIAS STRESS 118 5.4 CHEMICAL EFFECTS ON
STABILITY---DEFECTS AND IMPURITIES 119 5.4.1 INTRODUCTION 119 5.4.2
DEFECTS IN MOLECULAR STRUCTURE 120 5.4.2.1 DEFECTS FROM SYNTHESIS 120
5.4.2.2 PHOTO-INDUCED DEFECTS 121 5.4.3.1 THERMOCHEMICAL ANALYSIS 123
5.4.3.2 OXYGEN 124 5.4.3.3 WATER 126 5.4.3.4 ORGANIC SOLVENTS 127
5.4.3.5 INORGANIC IMPURITIES 127 5.4.3 IMPURITIES 123 5.4.4 STUDIES OF
TFT LIFETIME 128 5.5 CONCLUSION 129 ACKNOWLEDGMENTS 129 REFERENCES 129 6
GATE DIELECTRICS MARCUS HALIK 132 6.1 INTRODUCTION 132 6.2 THE IMPACT OF
GATE DIELECTRICS ON THE ELECTRICAL FUNCTIONALITY OF ORGANIC TFTS 133 6.3
INSULATING MATERIALS---AN OVERVIEW 135 6.3.1 INORGANIC GATE DIELECTRICS
136 6.3.2 POLYMER GATE DIELECTRICS 137 6.3.3 SELF-ASSEMBLED MONOLAYER
GATE DIELECTRICS 138 6.3.4 MULTI-LAYER AND MULTI-COMPONENT GATE
DIELECTRICS 139 6.3.5 MULTIFUNCTIONAL DIELECTRICS 140 6.4
APPLICATION-RELATED ASPECTS OF DIELECTRICS 140 6.4.1 POLY-4-VINYLPHENOL
DIELECTRICS 141 6.4.2 THE SELF-ASSEMBLED MONOLAYER APPROACH 153
REFERENCES 161 7 ADVANCED FLEXIBLE POLYMERIC SUBSTRATES WILLIAM A.
MACDONALD 163 7.1 INTRODUCTION 163 7.2 POLYESTER SUBSTRATES 163 7.3
PROPERTIES OF BASE SUBSTRATES 165 7.3.1 OPTICAL PROPERTIES 165 7.3.2
BIREFRINGENCE 166 7.3.3 THERMAL PROPERTIES 166 7.3.4 SOLVENT RESISTANCE
167 7.3.5 SURFACE QUALITY 170 7.3.6 MECHANICAL PROPERTIES 172 7.3.7
SUMMARY OF KEY PROPERTIES OF BASE SUBSTRATES 173 7.4 MULTILAYER
STRUCTURES 174 7.5 FILM IN APPLICATION 177 ACKNOWLEDGMENTS 178
REFERENCES 178 III MANUFACTURING FOR ORGANIC ELECTRONICS 181 8
REEL-TO-REEL VACUUM METALLIZATION ROLAND TREUTLEIN, MARTIN BERGSMANN,
AND CARL J. STONLEY 183 8.1 REEL-TO-REEL VACUUM METALLIZATION 183 8.1.1
THE METALLIZATION PROCESS 184 8.1.1.1 EVAPORATION SOURCES 184 8.1.1.2
PRETREATMENT AND CLEANING OF THE WEB SUBSTRATE 186 8.1.1.3 PVD PROCESS
FLOW 186 8.1.1.4 TYPICAL PROCESS TIMES, RATES, AND QUANTITIES 189
8.1.1.5 TRANSFER METALLIZATION 190 8.1.1.6 PATTERN-EVAPORATED LAYERS 191
8.1.2 PROPERTIES OF THE EVAPORATED LAYER 191 8.1.2.1 STRUCTURE 191
8.1.2.2 LAYER THICKNESS (CONDUCTIVITY) 192 8.1.2.3 BARRIER 195 8.1.2.4
LIGHT BARRIER 197 8.1.3 ENVIRONMENTAL BENEFITS OF VACUUM EVAPORATED
LAYERS 198 8.1.4 APPLICATIONS OF METALLIZED FILMS 199 8.1.4.1 BARRIER
PACKAGING 199 8.1.4.2 DECORATIVE APPLICATIONS 199 8.1.4.3 FUNCTIONAL
LAYERS 199 8.1.4.4 POLYMER ELECTRONIC SUBSTRATES 200 8.1.5 MARKET
ANALYSIS 201 REFERENCES 202 9 ORGANIC VAPOR PHASE DEPOSITION MICHAEL
HEUKEN AND NICO MEYER 203 9.1 INTRODUCTION 203 9.1.1 THE PRINCIPLE OF
OVPD 203 9.1.2 CLOSE COUPLED SHOWERHEAD TECHNOLOGY 204 9.2 DEPOSITION OF
ORGANIC THIN FILMS 207 9.2.1 PROCESS CONTROL IN OVPD 207 9.2.2
CO-DEPOSITION AND DOPING IN OVPD 211 9.2.3 CONTROLLED MORPHOLOGY AND
LAYER INTERFACES IN OVPD 213 9.3 ELECTRONIC DEVICES BY OVPD 215 9.3.1
OLEDS MADE BY OVPD 215 9.3.2 ORGANIC PHOTOVOLTAICS BY OVPD 220 9.3.3
ORGANIC THIN-FILM TRANSISTORS BY OVPD 221 9.4 FULL-COLOR OLED DISPLAYS
222 9.4.1 MICROPATTERNING BY USE OF SHADOW MASKS 222 9.4.2 MASK-LESS
PROCESSES 224 9.5 MATERIAL PROPERTIES OF ORGANIC MOLECULES FOR USE IN
OVPD 225 9.6 SUMMARY 226 ACKNOWLEDGMENT 229 REFERENCES 229 10 THERMAL
IMAGING AND MICRO-CONTACT PRINTING HEE HYUN LEE, JOHN ROGERS, AND
GRACIELA BLANCHET 233 10.1 INTRODUCTION 233 10.2 BUILDING BLOCKS 233
10.3 PRINTING AND PATTERNING TECHNIQUES 235 10.3.1 THERMAL IMAGING 235
10.3.2 PRINTED DEVICES: FROM TFTS TO LARGE-AREA BACKPLANES 236 10.4
PRINTABLE MATERIALS 240 10.4.1 POLYANILINE NANOTUBE COMPOSITES: A
HIGH-RESOLUTION PRINTABLE CONDUCTOR 240 10.5 MICRO-CONTACT PRINTING 245
10.5.1 CONTACT PRINTING WITH HIGH-RESOLUTION STAMPS 245 10.5.1.1
HIGH-RESOLUTION STAMPS 246 10.5.2 MICRO-CONTACT PRINTING 247 10.5.3
NANOTRANSFER PRINTING 251 10.6 LARGE AREA STAMPS, MOLDS, AND PHOTOMASKS
FOR SOFT LITHOGRAPHY 259 10.6.1 MICRO-CONTACT PRINTING: A PATH TO
REEL-TO-REEL ELECTRONICS 259 10.6.2 INEXPENSIVE APPROACHES TO LARGE-AREA
PRINTING 259 10.6.3 REGISTRATION USING THE LOCK-AND-KEY MECHANISM IN
SOFT IMPRINTING 264 10.7 CONCLUSIONS 266 ACKNOWLEDGMENTS 268 REFERENCES
265 11 THIN-FILM TRANSISTOR FABRICATION BY DIGITAL LITHOGRAPHY WILLIAM
S. WONG, JUERGEN H. DANIEL, MICHAEL L. CHABINYC, ANA CLAUDIA ARIAS,
STEVEN E. READY, AND RENE LUJAN 271 11.1 INTRODUCTION 271 11.2
JET-PRINTED PATTERNING FOR THIN-FILM TRANSISTOR PROCESSING 272 11.2.1
INTRODUCTION 272 11.2.2 JET-PRINTED PHASE-CHANGE ETCH MASKS 273 11.3
DIGITAL LITHOGRAPHY 276 11.3.1 DIGITAL LITHOGRAPHY FOR TFT DEVICE
FABRICATION 276 11.3.2 THIN-FILM TRANSISTOR DEVICE STRUCTURES 277
11.3.2.1 AMORPHOUS SILICON TFTS 277 11.3.2.2 POLYMERIC TFTS BY DIGITAL
LITHOGRAPHY 279 11.3.3 THIN-FILM TRANSISTOR DEVICE CHARACTERISTICS 282
11.3.3.1 A-SI:H TFTS 282 11.3.3.2 PRINTED POLYMERIC TFTS 284 11.4 TFTS
ON FLEXIBLE SUBSTRATES 285 11.4.1 INTRODUCTION 285 11.4.2 TFT PIXEL
DESIGN CONSIDERATIONS 285 11.4.3 DIGITAL LITHOGRAPHY FOR FLEXIBLE
BACKPLANES 287 11.5 DISPLAY APPLICATIONS WITH PRINT-PATTERNED BACKPLANES
290 11.6 CONCLUSIONS 291 ACKNOWLEDGMENTS 291 REFERENCES 291 12
MANUFACTURING OF ORGANIC TRANSISTOR CIRCUITS BY SOLUTION-BASED PRINTING
HENNING SIRRINGHAUS, CHRISTOPH W. SELE, TIMOTHY VON WERNE, AND CATHERINE
RAMSDALE 294 12.1 INTRODUCTION TO PRINTED ORGANIC THIN FILM TRANSISTORS
294 12.2 OVERVIEW OF PRINTING-BASED MANUFACTURING APPROACHES FOR OTFTS
297 12.2.1 SCREEN PRINTING 298 12.2.2 OFFSET PRINTING 299 12.2.3 GRAVURE
PRINTING 300 12.2.4 FLEXOGRAPHY 300 12.2.5 INKJET PRINTING 301 12.2.6
LASER-BASED DRY-PRINTING TECHNIQUES 302 12.2.7 OTHER NONLITHOGRAPHIC
MANUFACTURING APPROACHES 302 12.3 HIGH-RESOLUTION, SELF-ALIGNED INKJET
PRINTING 304 12.3.1 SELF-ALIGNED PRINTING BY SELECTIVE SURFACE TREATMENT
305 12.3.2 SELF-ALIGNED PRINTING BY SURFACE SEGREGATION 307 12.3.3
SELF-ALIGNED PRINTING BY AUTOPHOBING 308 12.4 PERFORMANCE AND
RELIABILITY OF SOLUTION-PROCESSED OTFTS FOR APPLICATIONS IN FLEXIBLE
DISPLAYS 314 12.5 CONCLUSIONS 318 ACKNOWLEDGMENTS 319 REFERENCES 319 IV
DEVICES, APPLICATIONS, AND PRODUCTS 323 13 FROM TRANSISTORS TO
LARGE-SCALE INTEGRATED CIRCUITS GERWIN H. GELINCK, ERIK VAN VEENENDAAL,
EDUARD J. MEIJER, EUGENIO CANTATORE, H. EDZER A. HUITEMA, PIETER VAN
LIESHOUT, FRED J. TOUWSLAGER, ALWIN W. MARSMAN, AND DAGO M. DE LEEUW 325
13.1 INTRODUCTION 325 13.2 DISCRETE DEVICES 326 13.2.1 BASIC DEVICE
OPERATION OF ORGANIC TRANSISTOR 326 13.2.2 CURRENT--VOLTAGE
CHARACTERISTICS 327 13.2.3 CAPACITANCE--VOLTAGE CHARACTERISTICS 328 13.3
FABRICATION AND CHARACTERIZATION OF INTEGRATED CIRCUITS 330 13.3.1
FABRICATION 331 13.3.2 MODELING 333 13.3.3 ANALYSIS OF INVERTERS 336
13.3.4 ANALYSIS OF INTEGRATED CIRCUITS 340 ACKNOWLEDGMENTS 342
REFERENCES 342 14 ROLL-UP ACTIVE-MATRIX DISPLAYS H. EDZER A. HUITEMA,
GERWIN H. GELINCK, ERIK VAN VEENENDAAL, FRED J. TOUWSLAGER, AND PIETER
J. G. VAN LIESHOUT 344 14.1 INTRODUCTION 344 14.1.1 NON-RIGID DISPLAY
RESEARCH AND DEVELOPMENT OVERVIEW 345 14.2 ROLLABLE ACTIVE-MATRIX
BACKPLANE TECHNOLOGY 346 14.3 ROLL-UP ACTIVE-MATRIX BACKPLANE DESIGN 349
14.3.1 FIELD-EFFECT MOBILITY EFFECTS 351 14.3.2 LEAKAGE CURRENT EFFECTS
353 14.4 THE ELECTRONIC INK FILM 354 14.5 ROLL-UP DISPLAY INTEGRATION
355 14.6 FUNCTIONAL ACTIVE-MATRIX ROLL-UP DISPLAYS 355 14.7 ROLL-UP
DISPLAY DEVICE CONCEPTS 358 14.8 TOWARDS A SYSTEM-ON-PLASTIC: DRIVER
INTEGRATION 358 14.8.1 ROW DRIVER INTEGRATION 358 14.8.2 STAND-ALONE
SHIFT REGISTERS 360 14.8.3 INTEGRATED SHIFT REGISTERS 362 ACKNOWLEDGMENT
364 REFERENCES 364 15 ACTIVE-MATRIX LIGHT-EMITTING DISPLAYS SHELBY F.
NELSON AND LISONG ZHOU 367 15.1 INTRODUCTION 367 15.2 OLED PIXEL
DIFFERENCES FROM LCDS 369 15.3 COMPLEX PIXEL DESIGN 369 15.4 PRACTICAL
DESIGN 370 15.5 AIM--SPICE SIMULATION OF PENTACENE TFT-DRIVEN OLEDS 372
15.6 FABRICATION PROCESS 375 15.7 DEVICE PASSIVATION 376 15.8 PVA AND
PARYLENE 380 15.9 PENTACENE TFT UNIFORMITY 381 15.10 STABILITY 383 15.11
INTEGRATION OF TFTS AND OLEDS 384 15.12 FLEXIBLE OLED DISPLAY 386 15.13
SUBSTRATE SELECTION AND MOUNTING 387 15.14 THERMAL DIMENSIONAL STABILITY
387 15.15 SURFACE QUALITY 388 15.16 CHEMICAL RESISTANCE 389 15.17
FABRICATION PROCESS 390 15.18 DISPLAY RESULTS 390 15.19 CONCLUSION 391
REFERENCES 392 16 LARGE-AREA DETECTORS AND SENSORS TAKAO SOMEYA AND
TAKAYASU SAKURAI 395 16.1 INTRODUCTION 395 16.2 LARGE-AREA PRESSURE
SENSORS 396 16.3 ORGANIC TRANSISTOR-BASED INTEGRATED CIRCUITS 398 16.4
BENDING EXPERIMENTS OF ORGANIC TRANSISTORS 400 16.5 HIGH-TEMPERATURE
OPERATION OF ORGANIC TRANSISTORS 401 16.6 SHEET IMAGE SCANNERS 402 16.7
THREE-DIMENSIONAL INTEGRATED CIRCUITS 405 16.8 FUTURE PROSPECTS OF
LARGE-AREA ELECTRONICS 407 16.9 REMAINING ISSUES 407 16.10 CONCLUSIONS
408 ACKNOWLEDGMENTS 409 REFERENCES 409 17 ORGANIC SEMICONDUCTOR-BASED
CHEMICAL SENSORS HOWARD E. KATZ AND JIA HUANG 411 17.1 BACKGROUND 411
17.2 INORGANIC AND NANOSTRCTURED SEMICONDUCTOR SENSORS 412 17.3
SENSITIVE ORGANIC FIELD-EFFECT TRANSISTORS 414 17.4 MECHANISTIC
RATIONALE 416 17.5 CONCLUSION 418 REFERENCES 419 INDEX 422
|
| adam_txt |
ORGANIC ELECTRONICS MATERIALS, MANUFACTURING AND APPLICATIONS EDITED BY
HAGEN KLAUK WTTEY- VCH \^/ILEY-VCH VERLAG GMBH & CO. KGAA THE EDITOR DR
HAGEN KLAUK MAX PLANCK INSTITUTE FOR SOLID STATE RESEARCH HEISENBERGSTR.
I 70569 STUTTGART GERMANY ALL BOOKS PUBLISHED BY WILEY-VCH ARE CAREFULLY
PRODUCED. NEVERTHELESS, AUTHORS, EDITORS, AND PUBLISHER DO NOT WANANT
THE INFOMATION CONTAINED IN THESE BOOKS, INCLUDING THIS BOOK, TO BE FREE
OFERRORS. READERS ARE ADVISED TO KEEP IN MIND THAT STATEMENTS, DATA,
ILLUSTRATIONS, PROCEDURAL DETAILS OR OTHER ITEMS MAY INADVEDENTLY BE
INACCURATE. LIBRARY OFCONGRESS CARD NO.: APPLIED FOR BRITISH LIBRARY
CATALOGUING-IN-PUBLICATION DATA A CATALOGUE RECORD FOR THIS BOOK IS
AVAILABLE FROM THE BRITISH LIBRARY. BIBLIOGRAPHIC INFORMATION PUBLISHED
BY DIE DEUTSCHE BIBLIOTHEK DIE DEUTSCHE BIBLIOTHEK LISTS THIS
PUBLICATION IN THE DEUTSCHE NATIONALBIBLIOGRAFIE; DETAILED BIBLIOGRAPHIC
DATA IS AVAILABLE IN THE INTERNET AT (HTTP://DNB.DDB.DE). @ 2006
WILEY-VCH VERLAG GMBH & CO. KGAA, WEINHEIM ALL RIGHTS RESEWED (INCLUDING
THOSE OF TRANSLATION INTO OTHER LANGUAGES). NO PART OF THIS BOOK MAY BE
REPRODUCED IN ANY FOM - BY PHOTOPRINTING, MICROFILM, OR ANY OT}ER MEANS
- NOR TRANSMITTED OR TRANSLATED INTO A MACHINE LANGUGE WITHOUT MITTEN
PERMISSION FROM THE PUBLISHERS. REGISTERED NAMES, TRADEMARKS, ETC. USED
IN THIS BOOK, EVEN WHEN NOT SPECIFICALLY MARKED AS SUCH, ARE NOT TO BE
CONSIDERED UNPROTECTED BY LAW. TYPESETTING ASCO TYPESETTER, HONG KONG
PRINTING STRAUSS GMBH, M BINDING SCHIIFFER GMBH, GRIINSTADT COVER DESIGN
GRAFIK-DESIGN SCHULZ, FUBGRINHEIM PRINTED IN THE FEDERAL REPUBLIC OF
GERMANY PRINTED ON ACID-FREE PAPER F SEN-L 3 978-3-527 -31264-7 RSBN-10
3-527-31264-1 CONTENTS PREFACE XIII AUTHOR LIST XV I INTRODUCTION 1
1 ORGANIC TRANSISTORS GILLES HOROWITZ 3 1.1 INTRODUCTION 3 1.2 OVERVIEW
OF THE ORGANIC THIN-FILM TRANSISTOR 4 1.2.1 ARE ORGANIC
``SEMICONDUCTORS'' REAL SEMICONDUCTORS? 4 1.2.2 THIN-FILM TRANSISTOR
ARCHITECTURE 7 1.2.3 OPERATING MODE 8 1.2.4 THICKNESS OF THE CHANNEL 10
1.3 CONTACT RESISTANCE 15 1.3.1 CONTACT RESISTANCE EXTRACTION 15 1.3.2
ORIGIN OF CONTACT RESISTANCE 19 1.4 CHARGE TRANSPORT 20 1.5 FABRICATION
TECHNIQUES 21 1.6 THE MATERIALS 23 1.6.1 POLYMERS 23 1.6.2 SMALL
MOLECULES 24 1.6.3 N-TYPE SEMICONDUCTORS 25 1.6.4 SINGLE CRYSTALS 26
1.6.5 INSULATORS 27 1.7 CONCLUDING REMARKS 28 ACKNOWLEDGEMENTS 29
REFERENCES 29 II ADVANCED MATERIALS FOR ORGANIC ELECTRONICS 33 2
HIGH-PERFORMANCE PENTACENE TRANSISTORS TOMMIE KELLEY 35 2.1 INTRODUCTION
35 2.2 ROUTES TO PERFORMANCE IMPROVEMENT 38 2.2.1 PURIFICATION 38 2.2.2
DEVICE EVOLUTION 39 2.2.3 STRUCTURAL PERFECTION 39 2.2.4 DEVICE
ARCHITECTURE 41 2.2.5 INTERFACIAL CONTROL 45 2.3 STRUCTURE--PROPERTY
RELATIONSHIPS 48 2.4 CONTINUING REPORTS OF HIGH MOBILITIES 51 2.5
PERFORMANCE IN PRACTICE 52 2.6 THE FUTURE OF HIGH-PERFORMANCE ORGANIC
TRANSISTORS 53 REFERENCES 54 3 ENGINEERED PENTACENES JOHN E. ANTHONY 58
3.1 INTRODUCTION 58 3.2 REVERSIBLE FUNCTIONALIZATION 59 3.3
2,3,9,10-TETRASUBSTITUTED AND 2,3-DISUBSTITUTED PENTACENES:
END-SUBSTITUTED DERIVATIVES 60 3.4 PERI-FUNCTIONALIZED PENTACENE 63 3.5
PENTACENE FUNCTIONALIZED AT BOTH PERI AND END POSITIONS 68 3.6
HETEROPENTACENES 69 3.7 CONCLUSION 72 REFERENCES 72 4 ORGANIC
SEMICONDUCTORS BASED ON POLYTHIOPHENE AND INDOLO[3,2-B]CARBAZOLE BENG S.
ONG, YILIANG WU, AND YUNING LI 75 4.1 INTRODUCTION 75 4.2 ISSUES AND
CHALLENGES 76 4.3 STRUCTURAL CONSIDERATIONS 79 4.4 POLYTHIOPHENE
SEMICONDUCTORS 80 4.4.1 HIGH-PERFORMANCE POLYTHIOPHENE DESIGN 81 4.4.2
POLYDIALKYLTERTHIOPHENES 82 4.4.3 POLYDIALKYLQUATERTHIOPHENES 87 4.4.4
POLYTHIOPHENE NANOPARTICLES 90 4.4.5 INKJET PATTERNED TFT ARRAYS 94 4.5
INDOCARBAZOLE DESIGNS 95 4.6 SUMMARY AND PROSPECTS 103 ACKNOWLEDGEMENTS
105 REFERENCES 105 5 ELECTRICAL AND ENVIRONMENTAL STABILITY OF POLYMER
THIN-FILM TRANSISTORS ALBERTO SALLEO AND MICHAEL L. CHABINYC 108 5.1
INTRODUCTION 108 5.2 CHARGE TRAPPING IN TFTS 109 5.2.1 GENERAL
CONSIDERATIONS 109 5.2.2 BIAS STRESS IN ORGANIC TRANSISTORS 111 5.3 BIAS
STRESS IN POLYFLUORENE AND POLYTHIOPHENE TFTS 112 5.3.1 REVERSIBLE BIAS
STRESS 113 5.3.2 LONG-LIVED BIAS STRESS 115 5.3.3 DEPENDENCE OF BIAS
STRESS ON OPERATING CONDITIONS; LIFETIME PREDICTIONS 116 5.3.4 A
MICROSCOPIC THEORY OF BIAS STRESS 118 5.4 CHEMICAL EFFECTS ON
STABILITY---DEFECTS AND IMPURITIES 119 5.4.1 INTRODUCTION 119 5.4.2
DEFECTS IN MOLECULAR STRUCTURE 120 5.4.2.1 DEFECTS FROM SYNTHESIS 120
5.4.2.2 PHOTO-INDUCED DEFECTS 121 5.4.3.1 THERMOCHEMICAL ANALYSIS 123
5.4.3.2 OXYGEN 124 5.4.3.3 WATER 126 5.4.3.4 ORGANIC SOLVENTS 127
5.4.3.5 INORGANIC IMPURITIES 127 5.4.3 IMPURITIES 123 5.4.4 STUDIES OF
TFT LIFETIME 128 5.5 CONCLUSION 129 ACKNOWLEDGMENTS 129 REFERENCES 129 6
GATE DIELECTRICS MARCUS HALIK 132 6.1 INTRODUCTION 132 6.2 THE IMPACT OF
GATE DIELECTRICS ON THE ELECTRICAL FUNCTIONALITY OF ORGANIC TFTS 133 6.3
INSULATING MATERIALS---AN OVERVIEW 135 6.3.1 INORGANIC GATE DIELECTRICS
136 6.3.2 POLYMER GATE DIELECTRICS 137 6.3.3 SELF-ASSEMBLED MONOLAYER
GATE DIELECTRICS 138 6.3.4 MULTI-LAYER AND MULTI-COMPONENT GATE
DIELECTRICS 139 6.3.5 MULTIFUNCTIONAL DIELECTRICS 140 6.4
APPLICATION-RELATED ASPECTS OF DIELECTRICS 140 6.4.1 POLY-4-VINYLPHENOL
DIELECTRICS 141 6.4.2 THE SELF-ASSEMBLED MONOLAYER APPROACH 153
REFERENCES 161 7 ADVANCED FLEXIBLE POLYMERIC SUBSTRATES WILLIAM A.
MACDONALD 163 7.1 INTRODUCTION 163 7.2 POLYESTER SUBSTRATES 163 7.3
PROPERTIES OF BASE SUBSTRATES 165 7.3.1 OPTICAL PROPERTIES 165 7.3.2
BIREFRINGENCE 166 7.3.3 THERMAL PROPERTIES 166 7.3.4 SOLVENT RESISTANCE
167 7.3.5 SURFACE QUALITY 170 7.3.6 MECHANICAL PROPERTIES 172 7.3.7
SUMMARY OF KEY PROPERTIES OF BASE SUBSTRATES 173 7.4 MULTILAYER
STRUCTURES 174 7.5 FILM IN APPLICATION 177 ACKNOWLEDGMENTS 178
REFERENCES 178 III MANUFACTURING FOR ORGANIC ELECTRONICS 181 8
REEL-TO-REEL VACUUM METALLIZATION ROLAND TREUTLEIN, MARTIN BERGSMANN,
AND CARL J. STONLEY 183 8.1 REEL-TO-REEL VACUUM METALLIZATION 183 8.1.1
THE METALLIZATION PROCESS 184 8.1.1.1 EVAPORATION SOURCES 184 8.1.1.2
PRETREATMENT AND CLEANING OF THE WEB SUBSTRATE 186 8.1.1.3 PVD PROCESS
FLOW 186 8.1.1.4 TYPICAL PROCESS TIMES, RATES, AND QUANTITIES 189
8.1.1.5 TRANSFER METALLIZATION 190 8.1.1.6 PATTERN-EVAPORATED LAYERS 191
8.1.2 PROPERTIES OF THE EVAPORATED LAYER 191 8.1.2.1 STRUCTURE 191
8.1.2.2 LAYER THICKNESS (CONDUCTIVITY) 192 8.1.2.3 BARRIER 195 8.1.2.4
LIGHT BARRIER 197 8.1.3 ENVIRONMENTAL BENEFITS OF VACUUM EVAPORATED
LAYERS 198 8.1.4 APPLICATIONS OF METALLIZED FILMS 199 8.1.4.1 BARRIER
PACKAGING 199 8.1.4.2 DECORATIVE APPLICATIONS 199 8.1.4.3 FUNCTIONAL
LAYERS 199 8.1.4.4 POLYMER ELECTRONIC SUBSTRATES 200 8.1.5 MARKET
ANALYSIS 201 REFERENCES 202 9 ORGANIC VAPOR PHASE DEPOSITION MICHAEL
HEUKEN AND NICO MEYER 203 9.1 INTRODUCTION 203 9.1.1 THE PRINCIPLE OF
OVPD 203 9.1.2 CLOSE COUPLED SHOWERHEAD TECHNOLOGY 204 9.2 DEPOSITION OF
ORGANIC THIN FILMS 207 9.2.1 PROCESS CONTROL IN OVPD 207 9.2.2
CO-DEPOSITION AND DOPING IN OVPD 211 9.2.3 CONTROLLED MORPHOLOGY AND
LAYER INTERFACES IN OVPD 213 9.3 ELECTRONIC DEVICES BY OVPD 215 9.3.1
OLEDS MADE BY OVPD 215 9.3.2 ORGANIC PHOTOVOLTAICS BY OVPD 220 9.3.3
ORGANIC THIN-FILM TRANSISTORS BY OVPD 221 9.4 FULL-COLOR OLED DISPLAYS
222 9.4.1 MICROPATTERNING BY USE OF SHADOW MASKS 222 9.4.2 MASK-LESS
PROCESSES 224 9.5 MATERIAL PROPERTIES OF ORGANIC MOLECULES FOR USE IN
OVPD 225 9.6 SUMMARY 226 ACKNOWLEDGMENT 229 REFERENCES 229 10 THERMAL
IMAGING AND MICRO-CONTACT PRINTING HEE HYUN LEE, JOHN ROGERS, AND
GRACIELA BLANCHET 233 10.1 INTRODUCTION 233 10.2 BUILDING BLOCKS 233
10.3 PRINTING AND PATTERNING TECHNIQUES 235 10.3.1 THERMAL IMAGING 235
10.3.2 PRINTED DEVICES: FROM TFTS TO LARGE-AREA BACKPLANES 236 10.4
PRINTABLE MATERIALS 240 10.4.1 POLYANILINE NANOTUBE COMPOSITES: A
HIGH-RESOLUTION PRINTABLE CONDUCTOR 240 10.5 MICRO-CONTACT PRINTING 245
10.5.1 CONTACT PRINTING WITH HIGH-RESOLUTION STAMPS 245 10.5.1.1
HIGH-RESOLUTION STAMPS 246 10.5.2 MICRO-CONTACT PRINTING 247 10.5.3
NANOTRANSFER PRINTING 251 10.6 LARGE AREA STAMPS, MOLDS, AND PHOTOMASKS
FOR SOFT LITHOGRAPHY 259 10.6.1 MICRO-CONTACT PRINTING: A PATH TO
REEL-TO-REEL ELECTRONICS 259 10.6.2 INEXPENSIVE APPROACHES TO LARGE-AREA
PRINTING 259 10.6.3 REGISTRATION USING THE LOCK-AND-KEY MECHANISM IN
SOFT IMPRINTING 264 10.7 CONCLUSIONS 266 ACKNOWLEDGMENTS 268 REFERENCES
265 11 THIN-FILM TRANSISTOR FABRICATION BY DIGITAL LITHOGRAPHY WILLIAM
S. WONG, JUERGEN H. DANIEL, MICHAEL L. CHABINYC, ANA CLAUDIA ARIAS,
STEVEN E. READY, AND RENE LUJAN 271 11.1 INTRODUCTION 271 11.2
JET-PRINTED PATTERNING FOR THIN-FILM TRANSISTOR PROCESSING 272 11.2.1
INTRODUCTION 272 11.2.2 JET-PRINTED PHASE-CHANGE ETCH MASKS 273 11.3
DIGITAL LITHOGRAPHY 276 11.3.1 DIGITAL LITHOGRAPHY FOR TFT DEVICE
FABRICATION 276 11.3.2 THIN-FILM TRANSISTOR DEVICE STRUCTURES 277
11.3.2.1 AMORPHOUS SILICON TFTS 277 11.3.2.2 POLYMERIC TFTS BY DIGITAL
LITHOGRAPHY 279 11.3.3 THIN-FILM TRANSISTOR DEVICE CHARACTERISTICS 282
11.3.3.1 A-SI:H TFTS 282 11.3.3.2 PRINTED POLYMERIC TFTS 284 11.4 TFTS
ON FLEXIBLE SUBSTRATES 285 11.4.1 INTRODUCTION 285 11.4.2 TFT PIXEL
DESIGN CONSIDERATIONS 285 11.4.3 DIGITAL LITHOGRAPHY FOR FLEXIBLE
BACKPLANES 287 11.5 DISPLAY APPLICATIONS WITH PRINT-PATTERNED BACKPLANES
290 11.6 CONCLUSIONS 291 ACKNOWLEDGMENTS 291 REFERENCES 291 12
MANUFACTURING OF ORGANIC TRANSISTOR CIRCUITS BY SOLUTION-BASED PRINTING
HENNING SIRRINGHAUS, CHRISTOPH W. SELE, TIMOTHY VON WERNE, AND CATHERINE
RAMSDALE 294 12.1 INTRODUCTION TO PRINTED ORGANIC THIN FILM TRANSISTORS
294 12.2 OVERVIEW OF PRINTING-BASED MANUFACTURING APPROACHES FOR OTFTS
297 12.2.1 SCREEN PRINTING 298 12.2.2 OFFSET PRINTING 299 12.2.3 GRAVURE
PRINTING 300 12.2.4 FLEXOGRAPHY 300 12.2.5 INKJET PRINTING 301 12.2.6
LASER-BASED DRY-PRINTING TECHNIQUES 302 12.2.7 OTHER NONLITHOGRAPHIC
MANUFACTURING APPROACHES 302 12.3 HIGH-RESOLUTION, SELF-ALIGNED INKJET
PRINTING 304 12.3.1 SELF-ALIGNED PRINTING BY SELECTIVE SURFACE TREATMENT
305 12.3.2 SELF-ALIGNED PRINTING BY SURFACE SEGREGATION 307 12.3.3
SELF-ALIGNED PRINTING BY AUTOPHOBING 308 12.4 PERFORMANCE AND
RELIABILITY OF SOLUTION-PROCESSED OTFTS FOR APPLICATIONS IN FLEXIBLE
DISPLAYS 314 12.5 CONCLUSIONS 318 ACKNOWLEDGMENTS 319 REFERENCES 319 IV
DEVICES, APPLICATIONS, AND PRODUCTS 323 13 FROM TRANSISTORS TO
LARGE-SCALE INTEGRATED CIRCUITS GERWIN H. GELINCK, ERIK VAN VEENENDAAL,
EDUARD J. MEIJER, EUGENIO CANTATORE, H. EDZER A. HUITEMA, PIETER VAN
LIESHOUT, FRED J. TOUWSLAGER, ALWIN W. MARSMAN, AND DAGO M. DE LEEUW 325
13.1 INTRODUCTION 325 13.2 DISCRETE DEVICES 326 13.2.1 BASIC DEVICE
OPERATION OF ORGANIC TRANSISTOR 326 13.2.2 CURRENT--VOLTAGE
CHARACTERISTICS 327 13.2.3 CAPACITANCE--VOLTAGE CHARACTERISTICS 328 13.3
FABRICATION AND CHARACTERIZATION OF INTEGRATED CIRCUITS 330 13.3.1
FABRICATION 331 13.3.2 MODELING 333 13.3.3 ANALYSIS OF INVERTERS 336
13.3.4 ANALYSIS OF INTEGRATED CIRCUITS 340 ACKNOWLEDGMENTS 342
REFERENCES 342 14 ROLL-UP ACTIVE-MATRIX DISPLAYS H. EDZER A. HUITEMA,
GERWIN H. GELINCK, ERIK VAN VEENENDAAL, FRED J. TOUWSLAGER, AND PIETER
J. G. VAN LIESHOUT 344 14.1 INTRODUCTION 344 14.1.1 NON-RIGID DISPLAY
RESEARCH AND DEVELOPMENT OVERVIEW 345 14.2 ROLLABLE ACTIVE-MATRIX
BACKPLANE TECHNOLOGY 346 14.3 ROLL-UP ACTIVE-MATRIX BACKPLANE DESIGN 349
14.3.1 FIELD-EFFECT MOBILITY EFFECTS 351 14.3.2 LEAKAGE CURRENT EFFECTS
353 14.4 THE ELECTRONIC INK FILM 354 14.5 ROLL-UP DISPLAY INTEGRATION
355 14.6 FUNCTIONAL ACTIVE-MATRIX ROLL-UP DISPLAYS 355 14.7 ROLL-UP
DISPLAY DEVICE CONCEPTS 358 14.8 TOWARDS A SYSTEM-ON-PLASTIC: DRIVER
INTEGRATION 358 14.8.1 ROW DRIVER INTEGRATION 358 14.8.2 STAND-ALONE
SHIFT REGISTERS 360 14.8.3 INTEGRATED SHIFT REGISTERS 362 ACKNOWLEDGMENT
364 REFERENCES 364 15 ACTIVE-MATRIX LIGHT-EMITTING DISPLAYS SHELBY F.
NELSON AND LISONG ZHOU 367 15.1 INTRODUCTION 367 15.2 OLED PIXEL
DIFFERENCES FROM LCDS 369 15.3 COMPLEX PIXEL DESIGN 369 15.4 PRACTICAL
DESIGN 370 15.5 AIM--SPICE SIMULATION OF PENTACENE TFT-DRIVEN OLEDS 372
15.6 FABRICATION PROCESS 375 15.7 DEVICE PASSIVATION 376 15.8 PVA AND
PARYLENE 380 15.9 PENTACENE TFT UNIFORMITY 381 15.10 STABILITY 383 15.11
INTEGRATION OF TFTS AND OLEDS 384 15.12 FLEXIBLE OLED DISPLAY 386 15.13
SUBSTRATE SELECTION AND MOUNTING 387 15.14 THERMAL DIMENSIONAL STABILITY
387 15.15 SURFACE QUALITY 388 15.16 CHEMICAL RESISTANCE 389 15.17
FABRICATION PROCESS 390 15.18 DISPLAY RESULTS 390 15.19 CONCLUSION 391
REFERENCES 392 16 LARGE-AREA DETECTORS AND SENSORS TAKAO SOMEYA AND
TAKAYASU SAKURAI 395 16.1 INTRODUCTION 395 16.2 LARGE-AREA PRESSURE
SENSORS 396 16.3 ORGANIC TRANSISTOR-BASED INTEGRATED CIRCUITS 398 16.4
BENDING EXPERIMENTS OF ORGANIC TRANSISTORS 400 16.5 HIGH-TEMPERATURE
OPERATION OF ORGANIC TRANSISTORS 401 16.6 SHEET IMAGE SCANNERS 402 16.7
THREE-DIMENSIONAL INTEGRATED CIRCUITS 405 16.8 FUTURE PROSPECTS OF
LARGE-AREA ELECTRONICS 407 16.9 REMAINING ISSUES 407 16.10 CONCLUSIONS
408 ACKNOWLEDGMENTS 409 REFERENCES 409 17 ORGANIC SEMICONDUCTOR-BASED
CHEMICAL SENSORS HOWARD E. KATZ AND JIA HUANG 411 17.1 BACKGROUND 411
17.2 INORGANIC AND NANOSTRCTURED SEMICONDUCTOR SENSORS 412 17.3
SENSITIVE ORGANIC FIELD-EFFECT TRANSISTORS 414 17.4 MECHANISTIC
RATIONALE 416 17.5 CONCLUSION 418 REFERENCES 419 INDEX 422 |
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| illustrated | Illustrated |
| index_date | 2024-07-02T15:09:34Z |
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| publisher | WILEY-VCH |
| record_format | marc |
| spelling | Organic electronics materials, manufacturing and applications ed. by Hagen Klauk 1. ed. Weinheim WILEY-VCH 2006 XVII, 428 S. Ill., graph. Darst. 240 mm x 170 mm txt rdacontent n rdamedia nc rdacarrier Électronique organique Organic electronics Dünnschichttransistor (DE-588)4150834-8 gnd rswk-swf Organischer Halbleiter (DE-588)4172780-0 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Dünnschichttransistor (DE-588)4150834-8 s Organischer Halbleiter (DE-588)4172780-0 s DE-604 Elektronisches Bauelement (DE-588)4014360-0 s Klauk, Hagen Sonstige (DE-588)131741578 oth text/html http://deposit.dnb.de/cgi-bin/dokserv?id=2712987&prov=M&dok_var=1&dok_ext=htm Inhaltstext DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014888190&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Organic electronics materials, manufacturing and applications Électronique organique Organic electronics Dünnschichttransistor (DE-588)4150834-8 gnd Organischer Halbleiter (DE-588)4172780-0 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| subject_GND | (DE-588)4150834-8 (DE-588)4172780-0 (DE-588)4014360-0 |
| title | Organic electronics materials, manufacturing and applications |
| title_auth | Organic electronics materials, manufacturing and applications |
| title_exact_search | Organic electronics materials, manufacturing and applications |
| title_exact_search_txtP | Organic electronics materials, manufacturing and applications |
| title_full | Organic electronics materials, manufacturing and applications ed. by Hagen Klauk |
| title_fullStr | Organic electronics materials, manufacturing and applications ed. by Hagen Klauk |
| title_full_unstemmed | Organic electronics materials, manufacturing and applications ed. by Hagen Klauk |
| title_short | Organic electronics |
| title_sort | organic electronics materials manufacturing and applications |
| title_sub | materials, manufacturing and applications |
| topic | Électronique organique Organic electronics Dünnschichttransistor (DE-588)4150834-8 gnd Organischer Halbleiter (DE-588)4172780-0 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| topic_facet | Électronique organique Organic electronics Dünnschichttransistor Organischer Halbleiter Elektronisches Bauelement |
| url | http://deposit.dnb.de/cgi-bin/dokserv?id=2712987&prov=M&dok_var=1&dok_ext=htm http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014888190&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT klaukhagen organicelectronicsmaterialsmanufacturingandapplications |