Holdings: Metal based thin films for electronics

Metal based thin films for electronics:

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Bibliographic Details
Format:	Book
Language:	German
Published:	Weinheim Wiley-VCH 2006
Edition:	2., rev. and enl. ed.
Subjects:	Metallic films Thin films Dünne Schicht Metallschicht Elektroniktechnologie Mikroelektronik
Online Access:	Inhaltsverzeichnis
Physical Description:	XIV, 410S. Ill., graph. Darst.
ISBN:	3527406506 9783527406500

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LEADER	00000nam a2200000 c 4500
001	BV021663304
003	DE-604
005	00000000000000.0
007	t
008	060719s2006 gw ad\|\| \|\|\|\| 00\|\|\| ger d
020			\|a 3527406506 \|9 3-527-40650-6
020			\|a 9783527406500 \|9 978-3-527-40650-0
035			\|a (OCoLC)70961433
035			\|a (DE-599)BVBBV021663304
040			\|a DE-604 \|b ger \|e rakddb
041	0		\|a ger
044			\|a gw \|c DE
049			\|a DE-1043 \|a DE-29T
050		0	\|a TK7871.15.F5
084			\|a UP 7500 \|0 (DE-625)146433: \|2 rvk
084			\|a ZN 4150 \|0 (DE-625)157360: \|2 rvk
245	1	0	\|a Metal based thin films for electronics \|c Klaus Wetzig ... (eds.)
250			\|a 2., rev. and enl. ed.
264		1	\|a Weinheim \|b Wiley-VCH \|c 2006
300			\|a XIV, 410S. \|b Ill., graph. Darst.
336			\|b txt \|2 rdacontent
337			\|b n \|2 rdamedia
338			\|b nc \|2 rdacarrier
650		4	\|a Metallic films
650		4	\|a Thin films
650	0	7	\|a Dünne Schicht \|0 (DE-588)4136925-7 \|2 gnd \|9 rswk-swf
650	0	7	\|a Metallschicht \|0 (DE-588)4252858-6 \|2 gnd \|9 rswk-swf
650	0	7	\|a Elektroniktechnologie \|0 (DE-588)4402723-0 \|2 gnd \|9 rswk-swf
650	0	7	\|a Mikroelektronik \|0 (DE-588)4039207-7 \|2 gnd \|9 rswk-swf
689	0	0	\|a Dünne Schicht \|0 (DE-588)4136925-7 \|D s
689	0	1	\|a Metallschicht \|0 (DE-588)4252858-6 \|D s
689	0	2	\|a Elektroniktechnologie \|0 (DE-588)4402723-0 \|D s
689	0	3	\|a Mikroelektronik \|0 (DE-588)4039207-7 \|D s
689	0		\|5 DE-604
700	1		\|a Wetzig, Klaus \|e Sonstige \|4 oth
856	4	2	\|m HEBIS Datenaustausch Darmstadt \|q application/pdf \|u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014877776&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA \|3 Inhaltsverzeichnis
999			\|a oai:aleph.bib-bvb.de:BVB01-014877776

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_version_	1804135475481411584
adam_text	METAL BASED THIN FILMS FOR ELECTRONICS SECOND, REVISED AND ENLARGED EDITION KLAUS WETZIG AND CLAUS M. SCHNEIDER (EDITORS) WILEY- VCH WILEY-VCH VERLAG GMBH & CO. KGAA CONTENTS PREFACE XI LIST OF CONTRIBUTORS XIII 1 INTRODUCTION 1 KLAUS WETZIG, CLAUS M. SCHNEIDER 1.1 PROLOGUE 1 1.2 ORGANIZATION, AIM AND CONTENT OF THIS BOOK 2 2 THIN FILM SYSTEMS: BASIC ASPECTS 7 2.1 INTERCONNECTS FOR MICROELECTRONICS 7 RALPH SPOLENAK, EHRENFRIED ZSCHECH 2.1.1 INTRODUCTION 7 2.1.2 METALLIZATION LAYERS 8 2.1.3 MATERIALS SCIENCE OF METALLIC INTERCONNECTS 12 2.1.4 FUNCTION OF BARRIER AND NUCLEATION LAYERS AND MATERIALS SELECTION 26 2.2 METALLIZATION STRUCTURES IN ACOUSTOELECTRONICS 28 MANFRED WEIHNACHT 2.2.1 INTRODUCTION 28 2.2.2 FUNDAMENTALS OF SURFACE ACOUSTIC WAVES 30 2.2.3 INTERDIGITAL TRANSDUCERS (IDTS) 40 2.2.4 REFLECTOR GRATINGS 44 2.2.5 WAVEGUIDES, ENERGY TRAPPING 44 2.2.6 MULTISTRIP COUPLERS 45 2.2.7 INTERDIGITAL TRANSDUCERS WITH PIEZOELECTRIC LAYER 45 2.2.8 METAL STRIPS WITH DIELECTRIC COATINGS 47 2.3 SILICIDE LAYERS FOR ELECTRONICS 48 JOACHIM SCHUMANN 2.3.1 INTRODUCTION 48 2.3.2 THE BASIC CHEMICAL AND PHYSICAL PROPERTIES 49 2.3.3 PREPARATION OF SILICIDES 55 2.3.4 SILICIDES WITH METALLIC CONDUCTIVITY 62 2.3.5 SEMICONDUCTING SILICIDES 64 2.3.6 HETEROGENEOUSLY DISORDERED SILICIDE FILMS 68 METAL BASED THIN FILMS FOR ELECTRONICS, SECOND EDITION- KLAUS WETZIG AND CLAUS M. SCHNEIDER (EDS.) COPYRIGHT 2006 WILEY-VCH VERLAG GMBH & CO. KGAA, WEINHEIM ISBN: 3-527-40650-6 VI CONTENTS 2.4 COMPLEX LAYERED SYSTEMS FOR MAGNETOELECTRONICS 71 CLAUS M. SCHNEIDER 2.4.1 INTRODUCTION 71 2.4.2 MAGNETISM: A PRIMER 73 2.4.3 MAGNETIC COUPLING PHENOMENA 74 2.4.4 ELECTRIC TRANSPORT IN LAYERED MAGNETIC SYSTEMS 82 2.4.5 FUNCTIONAL THIN FILM SYSTEMS 93 2.5 MULTILAYER AND SINGLE-SURFACE REFLECTORS FOR X-RAY OPTICS 103 HERMANN MAI, STEFAN BRAUN 2.5.1 INTRODUCTION 103 2.5.2 REFRACTION AND REFLECTION AT SINGLE BOUNDARIES 105 2.5.3 BRAGG REFLECTION AT ID LATTICE SYSTEMS 109 2.5.4 MULTILAYER PREPARATION 119 2.6 METALLIC LAYERS FOR PHOTOVOLTAICS 122 WINFRIED BLAU 2.6.1 INTRODUCTION 122 2.6.2 SOLAR CELLS 123 2.6.3 FUNCTIONALITIES OF THIN METALLIC FILMS IN PV CELLS 124 2.6.4 EXAMPLES 129 2.7 REFERENCES 129 3 THIN FILM PREPARATION AND CHARACTERIZATION TECHNIQUES 141 3.1 THIN FILM PREPARATION METHODS 141 CHRISTIAN WENZEL 3.1.1 INTRODUCTION 141 3.1.2 PHYSICAL VAPOR DEPOSITION 143 3.1.3 CHEMICAL VAPOR DEPOSITION 153 3.1.4 NON VACUUM-BASED DEPOSITION 156 3.1.5 OUTLOOK 160 3.2 ELECTRON MICROSCOPY AND DIFFRACTION 160 KLAUS WETZIG, JU RGEN THOMAS 3.2.1 TRANSMISSION ELECTRON MICROSCOPY (TEM)-IMAGING 160 3.2.2 TEM-SELECTED AREA ELECTRON DIFFRACTION 168 3.2.3 IN SITU-SEM METHODS 172 3.2.4 ELECTRON BACKSCATTER DIFFRACTION 177 3.3 X-RAY SCATTERING TECHNIQUES 179 MICHAEL HECKER 3.3.1 WIDE ANGLE DIFFRACTION 180 3.3.2 REFLECTOMETRY 190 3.3.3 SOFT X-RAYS AND MAGNETIC SCATTERING 194 CONTENTS VII 3.4 SPECTROSCOPIC TECHNIQUES 197 KLAUS WETZIG 3.4.1 ELEMENT DISTRIBUTION ANALYSIS 197 3.4.2 ELEMENT DEPTH PROFILE ANALYSIS 207 3.5 STRESS MEASUREMENT TECHNIQUES 214 WINFRIED BRUCKNER 3.5.1 STRESS AND STRAIN 214 3.5.2 SUBSTRATE CURVATURE 217 3.5.3 MEASUREMENT TECHNIQUES 219 3.6 REFERENCES 22 5 4 CHALLENGES FOR THIN FILM SYSTEMS CHARACTERIZATION AND OPTIMIZATION 23 1 4.1 ELECTROMIGRATION IN METALLIZATION LAYERS 231 RALPH SPOLENAK, HORST WENDRDOCK, KLAUS WETZIG 4.1.1 FUNDAMENTALS 231 4.1.2 METHODS FOR QUANTITATIVE DAMAGE ANALYSIS 234 4.1.3 AL INTERCONNECTS 237 4.1.4 CU INTERCONNECTS 241 4.2 BARRIER AND NUCLEATION LAYERS FOR INTERCONNECTS 248 EHRENFRIED ZSCHECH 4.2.1 INTRODUCTION 248 4.2.2 PVD BARRIER LAYERS FOR COPPER INTERCONNECTS 249 4.2.3 BARRIER/SEED MICROSTRUCTURE AND STEP COVERAGE 255 4.2.4 NEW BARRIER/SEED CONCEPTS USING CVD AND ALD 259 4.2.5 ATOMIC LAYER DEPOSITION (ALD) 260 4.3 ACOUSTOMIGRATION IN SURFACE ACOUSTIC WAVES STRUCTURES 261 SIEGFRIED MENZEL, KLAUS WETZIG 4.3.1 GENERAL REMARKS 261 4.3.2 ACOUSTOMIGRATION MECHANISM 262 4.3.3 METALLIZATION CONCEPTS FOR POWER SAW STRUCTURES 263 4.3.4 EXPERIMENTAL SETUP AND SAW TECHNOLOGY 267 4.3.5 ACOUSTOMIGRATION EXPERIMENTS 272 4.4 THERMAL STABILITY OF MAGNETORESISTIVE LAYER STACKS 283 CLAUS M. SCHNEIDER, JTIRGEN THOMAS 4.4.1 METALLIC MULTILAYERS AS GMR MODEL SYSTEMS 284 4.4.2 CO/CU MULTILAYERS 285 4.4.3 NI 80 FE 20 /CU MULTILAYERS 293 4.5 FUNCTIONAL MAGNETIC LAYERS FOR SENSORS AND MRAMS 29 5 HARTMUT VINZELBERG, DIETER ELEFANT 4.5.1 MAGNETIC MULTILAYERS: LAYER THICKNESS DEPENDENCE OF THE GMR PARAMETERS 296 4.5.2 SPIN VALVES 301 VIII CONTENTS 4.5.3 MAGNETIC TUNNEL JUNCTIONS 305 4.6 MULTILAYERS FOR X-RAY OPTICAL PURPOSES 309 HERMANN MAI, STEFAN BRAUN 4.6.1 MULTILAYERS AS REFLECTORS FOR X-RAYS 309 4.6.2 REAL STRUCTURE OF NM-MULTILAYERS 311 4.6.3 HIGH-RESOLUTION MULTILAYERS 319 4.6.4 MULTILAYERS WITH UNIFORM AND GRADED PERIOD THICKNESS 322 4.7 FUNCTIONAL ELECTRIC LAYERS 323 JOACHIM SCHUMANN, JU RGEN THOMAS 4.7.1 RESISTANCE LAYERS 324 4.7.2 THERMOELECTRIC THIN FILMS 332 4.8 REFERENCES 340 5 DEVICES 349 5.1 DEVICE RELATED ASPECTS FOR SI-BASED ELECTRONICS 349 EHRENFRIED ZSCHECH 5.1.1 INTERCONNECT TECHNOLOGY AND MATERIALS TRENDS FOR MEMORY AND LOGIC PRODUCTS 349 5.1.2 COPPER INLAID PROCESS: PROCESS INTEGRATION AND MATERIALS RELATED TOPICS 350 5.1.3 WIRING HIERARCHY FOR COPPER/LOW-^ ON-CHIP INTERCONNECTS 351 5.1.4 NEW GLOBAL INTERCONNECT CONCEPTS 353 5.2 SAW HIGH FREQUENCY FILTERS, RESONATORS AND DELAY LINES 353 MANFRED WEIHNACHT 5.2.1 INTRODUCTION 353 5.2.2 TRANSVERSAL FILTERS 354 5.2.3 RESONATORS 357 5.2.4 FILTERS WITH SPREAD SPECTRUM 360 5.2.5 DELAY LINES 361 5.3 SENSOR DEVICES 362 CHRISTOPH TREUTLER 5.3.1 INTRODUCTION 362 5.3.2 REQUIREMENTS FOR THIN FILMS TO BE USED AS TRANSDUCERS 362 5.3.3 THIN FILM STRAIN GAUGES FOR PRESSURE SENSORS AND FORCE METERS 363 5.3.4 THIN FILM THERMOMETER IN A MICROMACHINED AIR-MASS FLOW METER FOR AUTOMOTIVE APPLICATIONS 364 5.3.5 MAGNETIC THIN FILMS FOR MEASURING POSITION, ANGLE, ROTATIONAL SPEED AND TORQUE 366 5.4 X-RAY OPTICAL SYSTEMS 373 HERMANN MAI, STEFAN BRAUN 5.4.1 BASIC PROPERTIES OF THE COMBINATION OF X-RAY OPTICAL ELEMENTS 373 5.4.2 X-RAY ASTRONOMY 374 5.4.3 X-RAY MICROSCOPY 377 CONTENTS IX 5.4.4 EXTREME ULTRAVIOLET LITHOGRAPHY (EUVL) 378 5.4.5 X-RAY REFLECTOMETRY AND DIFFRACTOMETRY 380 5.4.6 X-RAY FLUORESCENCE ANALYSIS 381 5.5 THERMOELECTRIC SENSORS AND TRANSDUCERS 383 JOACHIM SCHUMANN 5.5.1 INTRODUCTION 383 5.5.2 THERMOELECTRIC ENERGY CONVERSION - SOME BASIC CONSIDERATIONS 383 5.5.3 THERMOELECTRIC SENSORS 384 5.5.4 THERMOELECTRIC TRANSDUCERS 390 5.5.5 OUTLOOK 394 5.6 REFERENCES 394 6 OUTLOOK 39 9 KLAUS WETZIG, CLAUS M. SCHNEIDER 6.1 NEW FUNCTIONALITIES 399 6.2 MATERIALS-RELATED ASPECTS 400 6.3 MICROELECTRONICS - QUO VADIS? 401 6.4 WHAT YOU SEE IS WHAT YOU GET 402 6.5 REFERENCES 403 INDEX 405
adam_txt	METAL BASED THIN FILMS FOR ELECTRONICS SECOND, REVISED AND ENLARGED EDITION KLAUS WETZIG AND CLAUS M. SCHNEIDER (EDITORS) WILEY- VCH WILEY-VCH VERLAG GMBH & CO. KGAA CONTENTS PREFACE XI LIST OF CONTRIBUTORS XIII 1 INTRODUCTION 1 KLAUS WETZIG, CLAUS M. SCHNEIDER 1.1 PROLOGUE 1 1.2 ORGANIZATION, AIM AND CONTENT OF THIS BOOK 2 2 THIN FILM SYSTEMS: BASIC ASPECTS 7 2.1 INTERCONNECTS FOR MICROELECTRONICS 7 RALPH SPOLENAK, EHRENFRIED ZSCHECH 2.1.1 INTRODUCTION 7 2.1.2 METALLIZATION LAYERS 8 2.1.3 MATERIALS SCIENCE OF METALLIC INTERCONNECTS 12 2.1.4 FUNCTION OF BARRIER AND NUCLEATION LAYERS AND MATERIALS SELECTION 26 2.2 METALLIZATION STRUCTURES IN ACOUSTOELECTRONICS 28 MANFRED WEIHNACHT 2.2.1 INTRODUCTION 28 2.2.2 FUNDAMENTALS OF SURFACE ACOUSTIC WAVES 30 2.2.3 INTERDIGITAL TRANSDUCERS (IDTS) 40 2.2.4 REFLECTOR GRATINGS 44 2.2.5 WAVEGUIDES, ENERGY TRAPPING 44 2.2.6 MULTISTRIP COUPLERS 45 2.2.7 INTERDIGITAL TRANSDUCERS WITH PIEZOELECTRIC LAYER 45 2.2.8 METAL STRIPS WITH DIELECTRIC COATINGS 47 2.3 SILICIDE LAYERS FOR ELECTRONICS 48 JOACHIM SCHUMANN 2.3.1 INTRODUCTION 48 2.3.2 THE BASIC CHEMICAL AND PHYSICAL PROPERTIES 49 2.3.3 PREPARATION OF SILICIDES 55 2.3.4 SILICIDES WITH METALLIC CONDUCTIVITY 62 2.3.5 SEMICONDUCTING SILICIDES 64 2.3.6 HETEROGENEOUSLY DISORDERED SILICIDE FILMS 68 METAL BASED THIN FILMS FOR ELECTRONICS, SECOND EDITION- KLAUS WETZIG AND CLAUS M. SCHNEIDER (EDS.) COPYRIGHT 2006 WILEY-VCH VERLAG GMBH & CO. KGAA, WEINHEIM ISBN: 3-527-40650-6 VI CONTENTS 2.4 COMPLEX LAYERED SYSTEMS FOR MAGNETOELECTRONICS 71 CLAUS M. SCHNEIDER 2.4.1 INTRODUCTION 71 2.4.2 MAGNETISM: A PRIMER 73 2.4.3 MAGNETIC COUPLING PHENOMENA 74 2.4.4 ELECTRIC TRANSPORT IN LAYERED MAGNETIC SYSTEMS 82 2.4.5 FUNCTIONAL THIN FILM SYSTEMS 93 2.5 MULTILAYER AND SINGLE-SURFACE REFLECTORS FOR X-RAY OPTICS 103 HERMANN MAI, STEFAN BRAUN 2.5.1 INTRODUCTION 103 2.5.2 REFRACTION AND REFLECTION AT SINGLE BOUNDARIES 105 2.5.3 BRAGG REFLECTION AT ID LATTICE SYSTEMS 109 2.5.4 MULTILAYER PREPARATION 119 2.6 METALLIC LAYERS FOR PHOTOVOLTAICS 122 WINFRIED BLAU 2.6.1 INTRODUCTION 122 2.6.2 SOLAR CELLS 123 2.6.3 FUNCTIONALITIES OF THIN METALLIC FILMS IN PV CELLS 124 2.6.4 EXAMPLES 129 2.7 REFERENCES 129 3 THIN FILM PREPARATION AND CHARACTERIZATION TECHNIQUES 141 3.1 THIN FILM PREPARATION METHODS 141 CHRISTIAN WENZEL 3.1.1 INTRODUCTION 141 3.1.2 PHYSICAL VAPOR DEPOSITION 143 3.1.3 CHEMICAL VAPOR DEPOSITION 153 3.1.4 NON VACUUM-BASED DEPOSITION 156 3.1.5 OUTLOOK 160 3.2 ELECTRON MICROSCOPY AND DIFFRACTION 160 KLAUS WETZIG, JU'RGEN THOMAS 3.2.1 TRANSMISSION ELECTRON MICROSCOPY (TEM)-IMAGING 160 3.2.2 TEM-SELECTED AREA ELECTRON DIFFRACTION 168 3.2.3 IN SITU-SEM METHODS 172 3.2.4 ELECTRON BACKSCATTER DIFFRACTION 177 3.3 X-RAY SCATTERING TECHNIQUES 179 MICHAEL HECKER 3.3.1 WIDE ANGLE DIFFRACTION 180 3.3.2 REFLECTOMETRY 190 3.3.3 SOFT X-RAYS AND MAGNETIC SCATTERING 194 CONTENTS VII 3.4 SPECTROSCOPIC TECHNIQUES 197 KLAUS WETZIG 3.4.1 ELEMENT DISTRIBUTION ANALYSIS 197 3.4.2 ELEMENT DEPTH PROFILE ANALYSIS 207 3.5 STRESS MEASUREMENT TECHNIQUES 214 WINFRIED BRUCKNER 3.5.1 STRESS AND STRAIN 214 3.5.2 SUBSTRATE CURVATURE 217 3.5.3 MEASUREMENT TECHNIQUES 219 3.6 REFERENCES 22 5 4 CHALLENGES FOR THIN FILM SYSTEMS CHARACTERIZATION AND OPTIMIZATION 23 1 4.1 ELECTROMIGRATION IN METALLIZATION LAYERS 231 RALPH SPOLENAK, HORST WENDRDOCK, KLAUS WETZIG 4.1.1 FUNDAMENTALS 231 4.1.2 METHODS FOR QUANTITATIVE DAMAGE ANALYSIS 234 4.1.3 AL INTERCONNECTS 237 4.1.4 CU INTERCONNECTS 241 4.2 BARRIER AND NUCLEATION LAYERS FOR INTERCONNECTS 248 EHRENFRIED ZSCHECH 4.2.1 INTRODUCTION 248 4.2.2 PVD BARRIER LAYERS FOR COPPER INTERCONNECTS 249 4.2.3 BARRIER/SEED MICROSTRUCTURE AND STEP COVERAGE 255 4.2.4 NEW BARRIER/SEED CONCEPTS USING CVD AND ALD 259 4.2.5 ATOMIC LAYER DEPOSITION (ALD) 260 4.3 ACOUSTOMIGRATION IN SURFACE ACOUSTIC WAVES STRUCTURES 261 SIEGFRIED MENZEL, KLAUS WETZIG 4.3.1 GENERAL REMARKS 261 4.3.2 ACOUSTOMIGRATION MECHANISM 262 4.3.3 METALLIZATION CONCEPTS FOR POWER SAW STRUCTURES 263 4.3.4 EXPERIMENTAL SETUP AND SAW TECHNOLOGY 267 4.3.5 ACOUSTOMIGRATION EXPERIMENTS 272 4.4 THERMAL STABILITY OF MAGNETORESISTIVE LAYER STACKS 283 CLAUS M. SCHNEIDER, JTIRGEN THOMAS 4.4.1 METALLIC MULTILAYERS AS GMR MODEL SYSTEMS 284 4.4.2 CO/CU MULTILAYERS 285 4.4.3 NI 80 FE 20 /CU MULTILAYERS 293 4.5 FUNCTIONAL MAGNETIC LAYERS FOR SENSORS AND MRAMS 29 5 HARTMUT VINZELBERG, DIETER ELEFANT 4.5.1 MAGNETIC MULTILAYERS: LAYER THICKNESS DEPENDENCE OF THE GMR PARAMETERS 296 4.5.2 SPIN VALVES 301 VIII CONTENTS 4.5.3 MAGNETIC TUNNEL JUNCTIONS 305 4.6 MULTILAYERS FOR X-RAY OPTICAL PURPOSES 309 HERMANN MAI, STEFAN BRAUN 4.6.1 MULTILAYERS AS REFLECTORS FOR X-RAYS 309 4.6.2 REAL STRUCTURE OF NM-MULTILAYERS 311 4.6.3 HIGH-RESOLUTION MULTILAYERS 319 4.6.4 MULTILAYERS WITH UNIFORM AND GRADED PERIOD THICKNESS 322 4.7 FUNCTIONAL ELECTRIC LAYERS 323 JOACHIM SCHUMANN, JU'RGEN THOMAS 4.7.1 RESISTANCE LAYERS 324 4.7.2 THERMOELECTRIC THIN FILMS 332 4.8 REFERENCES 340 5 DEVICES 349 5.1 DEVICE RELATED ASPECTS FOR SI-BASED ELECTRONICS 349 EHRENFRIED ZSCHECH 5.1.1 INTERCONNECT TECHNOLOGY AND MATERIALS TRENDS FOR MEMORY AND LOGIC PRODUCTS 349 5.1.2 COPPER INLAID PROCESS: PROCESS INTEGRATION AND MATERIALS RELATED TOPICS 350 5.1.3 WIRING HIERARCHY FOR COPPER/LOW-^ ON-CHIP INTERCONNECTS 351 5.1.4 NEW GLOBAL INTERCONNECT CONCEPTS 353 5.2 SAW HIGH FREQUENCY FILTERS, RESONATORS AND DELAY LINES 353 MANFRED WEIHNACHT 5.2.1 INTRODUCTION 353 5.2.2 TRANSVERSAL FILTERS 354 5.2.3 RESONATORS 357 5.2.4 FILTERS WITH SPREAD SPECTRUM 360 5.2.5 DELAY LINES 361 5.3 SENSOR DEVICES 362 CHRISTOPH TREUTLER 5.3.1 INTRODUCTION 362 5.3.2 REQUIREMENTS FOR THIN FILMS TO BE USED AS TRANSDUCERS 362 5.3.3 THIN FILM STRAIN GAUGES FOR PRESSURE SENSORS AND FORCE METERS 363 5.3.4 THIN FILM THERMOMETER IN A MICROMACHINED AIR-MASS FLOW METER FOR AUTOMOTIVE APPLICATIONS 364 5.3.5 MAGNETIC THIN FILMS FOR MEASURING POSITION, ANGLE, ROTATIONAL SPEED AND TORQUE 366 5.4 X-RAY OPTICAL SYSTEMS 373 HERMANN MAI, STEFAN BRAUN 5.4.1 BASIC PROPERTIES OF THE COMBINATION OF X-RAY OPTICAL ELEMENTS 373 5.4.2 X-RAY ASTRONOMY 374 5.4.3 X-RAY MICROSCOPY 377 CONTENTS IX 5.4.4 EXTREME ULTRAVIOLET LITHOGRAPHY (EUVL) 378 5.4.5 X-RAY REFLECTOMETRY AND DIFFRACTOMETRY 380 5.4.6 X-RAY FLUORESCENCE ANALYSIS 381 5.5 THERMOELECTRIC SENSORS AND TRANSDUCERS 383 JOACHIM SCHUMANN 5.5.1 INTRODUCTION 383 5.5.2 THERMOELECTRIC ENERGY CONVERSION - SOME BASIC CONSIDERATIONS 383 5.5.3 THERMOELECTRIC SENSORS 384 5.5.4 THERMOELECTRIC TRANSDUCERS 390 5.5.5 OUTLOOK 394 5.6 REFERENCES 394 6 OUTLOOK 39 9 KLAUS WETZIG, CLAUS M. SCHNEIDER 6.1 NEW FUNCTIONALITIES 399 6.2 MATERIALS-RELATED ASPECTS 400 6.3 MICROELECTRONICS - QUO VADIS? 401 6.4 WHAT YOU SEE IS WHAT YOU GET 402 6.5 REFERENCES 403 INDEX 405
any_adam_object	1
any_adam_object_boolean	1
building	Verbundindex
bvnumber	BV021663304
callnumber-first	T - Technology
callnumber-label	TK7871
callnumber-raw	TK7871.15.F5
callnumber-search	TK7871.15.F5
callnumber-sort	TK 47871.15 F5
callnumber-subject	TK - Electrical and Nuclear Engineering
classification_rvk	UP 7500 ZN 4150
ctrlnum	(OCoLC)70961433 (DE-599)BVBBV021663304
discipline	Physik Elektrotechnik / Elektronik / Nachrichtentechnik
discipline_str_mv	Physik Elektrotechnik / Elektronik / Nachrichtentechnik
edition	2., rev. and enl. ed.
format	Book
fullrecord	<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01780nam a2200469 c 4500</leader><controlfield tag="001">BV021663304</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">060719s2006 gw ad\|\| \|\|\|\| 00\|\|\| ger d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3527406506</subfield><subfield code="9">3-527-40650-6</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783527406500</subfield><subfield code="9">978-3-527-40650-0</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)70961433</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV021663304</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakddb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">ger</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">gw</subfield><subfield code="c">DE</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1043</subfield><subfield code="a">DE-29T</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7871.15.F5</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">UP 7500</subfield><subfield code="0">(DE-625)146433:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4150</subfield><subfield code="0">(DE-625)157360:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Metal based thin films for electronics</subfield><subfield code="c">Klaus Wetzig ... (eds.)</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">2., rev. and enl. ed.</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Weinheim</subfield><subfield code="b">Wiley-VCH</subfield><subfield code="c">2006</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">XIV, 410S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Metallic films</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thin films</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Dünne Schicht</subfield><subfield code="0">(DE-588)4136925-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Metallschicht</subfield><subfield code="0">(DE-588)4252858-6</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Elektroniktechnologie</subfield><subfield code="0">(DE-588)4402723-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Dünne Schicht</subfield><subfield code="0">(DE-588)4136925-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Metallschicht</subfield><subfield code="0">(DE-588)4252858-6</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Elektroniktechnologie</subfield><subfield code="0">(DE-588)4402723-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wetzig, Klaus</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">HEBIS Datenaustausch Darmstadt</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014877776&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-014877776</subfield></datafield></record></collection>
id	DE-604.BV021663304
illustrated	Illustrated
index_date	2024-07-02T15:06:39Z
indexdate	2024-07-09T20:41:06Z
institution	BVB
isbn	3527406506 9783527406500
language	German
oai_aleph_id	oai:aleph.bib-bvb.de:BVB01-014877776
oclc_num	70961433
open_access_boolean
owner	DE-1043 DE-29T
owner_facet	DE-1043 DE-29T
physical	XIV, 410S. Ill., graph. Darst.
publishDate	2006
publishDateSearch	2006
publishDateSort	2006
publisher	Wiley-VCH
record_format	marc
spelling	Metal based thin films for electronics Klaus Wetzig ... (eds.) 2., rev. and enl. ed. Weinheim Wiley-VCH 2006 XIV, 410S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Metallic films Thin films Dünne Schicht (DE-588)4136925-7 gnd rswk-swf Metallschicht (DE-588)4252858-6 gnd rswk-swf Elektroniktechnologie (DE-588)4402723-0 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Dünne Schicht (DE-588)4136925-7 s Metallschicht (DE-588)4252858-6 s Elektroniktechnologie (DE-588)4402723-0 s Mikroelektronik (DE-588)4039207-7 s DE-604 Wetzig, Klaus Sonstige oth HEBIS Datenaustausch Darmstadt application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014877776&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis
spellingShingle	Metal based thin films for electronics Metallic films Thin films Dünne Schicht (DE-588)4136925-7 gnd Metallschicht (DE-588)4252858-6 gnd Elektroniktechnologie (DE-588)4402723-0 gnd Mikroelektronik (DE-588)4039207-7 gnd
subject_GND	(DE-588)4136925-7 (DE-588)4252858-6 (DE-588)4402723-0 (DE-588)4039207-7
title	Metal based thin films for electronics
title_auth	Metal based thin films for electronics
title_exact_search	Metal based thin films for electronics
title_exact_search_txtP	Metal based thin films for electronics
title_full	Metal based thin films for electronics Klaus Wetzig ... (eds.)
title_fullStr	Metal based thin films for electronics Klaus Wetzig ... (eds.)
title_full_unstemmed	Metal based thin films for electronics Klaus Wetzig ... (eds.)
title_short	Metal based thin films for electronics
title_sort	metal based thin films for electronics
topic	Metallic films Thin films Dünne Schicht (DE-588)4136925-7 gnd Metallschicht (DE-588)4252858-6 gnd Elektroniktechnologie (DE-588)4402723-0 gnd Mikroelektronik (DE-588)4039207-7 gnd
topic_facet	Metallic films Thin films Dünne Schicht Metallschicht Elektroniktechnologie Mikroelektronik
url	http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014877776&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA
work_keys_str_mv	AT wetzigklaus metalbasedthinfilmsforelectronics

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