Metal based thin films for electronics:
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | German |
| Veröffentlicht: |
Weinheim
Wiley-VCH
2006
|
| Ausgabe: | 2., rev. and enl. ed. |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | XIV, 410S. Ill., graph. Darst. |
| ISBN: | 3527406506 9783527406500 |
Internformat
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| 245 | 1 | 0 | |a Metal based thin films for electronics |c Klaus Wetzig ... (eds.) |
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Datensatz im Suchindex
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| adam_text | METAL BASED THIN FILMS FOR ELECTRONICS SECOND, REVISED AND ENLARGED
EDITION KLAUS WETZIG AND CLAUS M. SCHNEIDER (EDITORS) WILEY- VCH
WILEY-VCH VERLAG GMBH & CO. KGAA CONTENTS PREFACE XI LIST OF
CONTRIBUTORS XIII 1 INTRODUCTION 1 KLAUS WETZIG, CLAUS M. SCHNEIDER 1.1
PROLOGUE 1 1.2 ORGANIZATION, AIM AND CONTENT OF THIS BOOK 2 2 THIN FILM
SYSTEMS: BASIC ASPECTS 7 2.1 INTERCONNECTS FOR MICROELECTRONICS 7 RALPH
SPOLENAK, EHRENFRIED ZSCHECH 2.1.1 INTRODUCTION 7 2.1.2 METALLIZATION
LAYERS 8 2.1.3 MATERIALS SCIENCE OF METALLIC INTERCONNECTS 12 2.1.4
FUNCTION OF BARRIER AND NUCLEATION LAYERS AND MATERIALS SELECTION 26 2.2
METALLIZATION STRUCTURES IN ACOUSTOELECTRONICS 28 MANFRED WEIHNACHT
2.2.1 INTRODUCTION 28 2.2.2 FUNDAMENTALS OF SURFACE ACOUSTIC WAVES 30
2.2.3 INTERDIGITAL TRANSDUCERS (IDTS) 40 2.2.4 REFLECTOR GRATINGS 44
2.2.5 WAVEGUIDES, ENERGY TRAPPING 44 2.2.6 MULTISTRIP COUPLERS 45 2.2.7
INTERDIGITAL TRANSDUCERS WITH PIEZOELECTRIC LAYER 45 2.2.8 METAL STRIPS
WITH DIELECTRIC COATINGS 47 2.3 SILICIDE LAYERS FOR ELECTRONICS 48
JOACHIM SCHUMANN 2.3.1 INTRODUCTION 48 2.3.2 THE BASIC CHEMICAL AND
PHYSICAL PROPERTIES 49 2.3.3 PREPARATION OF SILICIDES 55 2.3.4 SILICIDES
WITH METALLIC CONDUCTIVITY 62 2.3.5 SEMICONDUCTING SILICIDES 64 2.3.6
HETEROGENEOUSLY DISORDERED SILICIDE FILMS 68 METAL BASED THIN FILMS FOR
ELECTRONICS, SECOND EDITION- KLAUS WETZIG AND CLAUS M. SCHNEIDER (EDS.)
COPYRIGHT 2006 WILEY-VCH VERLAG GMBH & CO. KGAA, WEINHEIM ISBN:
3-527-40650-6 VI CONTENTS 2.4 COMPLEX LAYERED SYSTEMS FOR
MAGNETOELECTRONICS 71 CLAUS M. SCHNEIDER 2.4.1 INTRODUCTION 71 2.4.2
MAGNETISM: A PRIMER 73 2.4.3 MAGNETIC COUPLING PHENOMENA 74 2.4.4
ELECTRIC TRANSPORT IN LAYERED MAGNETIC SYSTEMS 82 2.4.5 FUNCTIONAL THIN
FILM SYSTEMS 93 2.5 MULTILAYER AND SINGLE-SURFACE REFLECTORS FOR X-RAY
OPTICS 103 HERMANN MAI, STEFAN BRAUN 2.5.1 INTRODUCTION 103 2.5.2
REFRACTION AND REFLECTION AT SINGLE BOUNDARIES 105 2.5.3 BRAGG
REFLECTION AT ID LATTICE SYSTEMS 109 2.5.4 MULTILAYER PREPARATION 119
2.6 METALLIC LAYERS FOR PHOTOVOLTAICS 122 WINFRIED BLAU 2.6.1
INTRODUCTION 122 2.6.2 SOLAR CELLS 123 2.6.3 FUNCTIONALITIES OF THIN
METALLIC FILMS IN PV CELLS 124 2.6.4 EXAMPLES 129 2.7 REFERENCES 129 3
THIN FILM PREPARATION AND CHARACTERIZATION TECHNIQUES 141 3.1 THIN FILM
PREPARATION METHODS 141 CHRISTIAN WENZEL 3.1.1 INTRODUCTION 141 3.1.2
PHYSICAL VAPOR DEPOSITION 143 3.1.3 CHEMICAL VAPOR DEPOSITION 153 3.1.4
NON VACUUM-BASED DEPOSITION 156 3.1.5 OUTLOOK 160 3.2 ELECTRON
MICROSCOPY AND DIFFRACTION 160 KLAUS WETZIG, JU RGEN THOMAS 3.2.1
TRANSMISSION ELECTRON MICROSCOPY (TEM)-IMAGING 160 3.2.2 TEM-SELECTED
AREA ELECTRON DIFFRACTION 168 3.2.3 IN SITU-SEM METHODS 172 3.2.4
ELECTRON BACKSCATTER DIFFRACTION 177 3.3 X-RAY SCATTERING TECHNIQUES 179
MICHAEL HECKER 3.3.1 WIDE ANGLE DIFFRACTION 180 3.3.2 REFLECTOMETRY 190
3.3.3 SOFT X-RAYS AND MAGNETIC SCATTERING 194 CONTENTS VII 3.4
SPECTROSCOPIC TECHNIQUES 197 KLAUS WETZIG 3.4.1 ELEMENT DISTRIBUTION
ANALYSIS 197 3.4.2 ELEMENT DEPTH PROFILE ANALYSIS 207 3.5 STRESS
MEASUREMENT TECHNIQUES 214 WINFRIED BRUCKNER 3.5.1 STRESS AND STRAIN 214
3.5.2 SUBSTRATE CURVATURE 217 3.5.3 MEASUREMENT TECHNIQUES 219 3.6
REFERENCES 22 5 4 CHALLENGES FOR THIN FILM SYSTEMS CHARACTERIZATION AND
OPTIMIZATION 23 1 4.1 ELECTROMIGRATION IN METALLIZATION LAYERS 231 RALPH
SPOLENAK, HORST WENDRDOCK, KLAUS WETZIG 4.1.1 FUNDAMENTALS 231 4.1.2
METHODS FOR QUANTITATIVE DAMAGE ANALYSIS 234 4.1.3 AL INTERCONNECTS 237
4.1.4 CU INTERCONNECTS 241 4.2 BARRIER AND NUCLEATION LAYERS FOR
INTERCONNECTS 248 EHRENFRIED ZSCHECH 4.2.1 INTRODUCTION 248 4.2.2 PVD
BARRIER LAYERS FOR COPPER INTERCONNECTS 249 4.2.3 BARRIER/SEED
MICROSTRUCTURE AND STEP COVERAGE 255 4.2.4 NEW BARRIER/SEED CONCEPTS
USING CVD AND ALD 259 4.2.5 ATOMIC LAYER DEPOSITION (ALD) 260 4.3
ACOUSTOMIGRATION IN SURFACE ACOUSTIC WAVES STRUCTURES 261 SIEGFRIED
MENZEL, KLAUS WETZIG 4.3.1 GENERAL REMARKS 261 4.3.2 ACOUSTOMIGRATION
MECHANISM 262 4.3.3 METALLIZATION CONCEPTS FOR POWER SAW STRUCTURES 263
4.3.4 EXPERIMENTAL SETUP AND SAW TECHNOLOGY 267 4.3.5 ACOUSTOMIGRATION
EXPERIMENTS 272 4.4 THERMAL STABILITY OF MAGNETORESISTIVE LAYER STACKS
283 CLAUS M. SCHNEIDER, JTIRGEN THOMAS 4.4.1 METALLIC MULTILAYERS AS GMR
MODEL SYSTEMS 284 4.4.2 CO/CU MULTILAYERS 285 4.4.3 NI 80 FE 20 /CU
MULTILAYERS 293 4.5 FUNCTIONAL MAGNETIC LAYERS FOR SENSORS AND MRAMS 29
5 HARTMUT VINZELBERG, DIETER ELEFANT 4.5.1 MAGNETIC MULTILAYERS: LAYER
THICKNESS DEPENDENCE OF THE GMR PARAMETERS 296 4.5.2 SPIN VALVES 301
VIII CONTENTS 4.5.3 MAGNETIC TUNNEL JUNCTIONS 305 4.6 MULTILAYERS FOR
X-RAY OPTICAL PURPOSES 309 HERMANN MAI, STEFAN BRAUN 4.6.1 MULTILAYERS
AS REFLECTORS FOR X-RAYS 309 4.6.2 REAL STRUCTURE OF NM-MULTILAYERS 311
4.6.3 HIGH-RESOLUTION MULTILAYERS 319 4.6.4 MULTILAYERS WITH UNIFORM AND
GRADED PERIOD THICKNESS 322 4.7 FUNCTIONAL ELECTRIC LAYERS 323 JOACHIM
SCHUMANN, JU RGEN THOMAS 4.7.1 RESISTANCE LAYERS 324 4.7.2
THERMOELECTRIC THIN FILMS 332 4.8 REFERENCES 340 5 DEVICES 349 5.1
DEVICE RELATED ASPECTS FOR SI-BASED ELECTRONICS 349 EHRENFRIED ZSCHECH
5.1.1 INTERCONNECT TECHNOLOGY AND MATERIALS TRENDS FOR MEMORY AND LOGIC
PRODUCTS 349 5.1.2 COPPER INLAID PROCESS: PROCESS INTEGRATION AND
MATERIALS RELATED TOPICS 350 5.1.3 WIRING HIERARCHY FOR COPPER/LOW-^
ON-CHIP INTERCONNECTS 351 5.1.4 NEW GLOBAL INTERCONNECT CONCEPTS 353 5.2
SAW HIGH FREQUENCY FILTERS, RESONATORS AND DELAY LINES 353 MANFRED
WEIHNACHT 5.2.1 INTRODUCTION 353 5.2.2 TRANSVERSAL FILTERS 354 5.2.3
RESONATORS 357 5.2.4 FILTERS WITH SPREAD SPECTRUM 360 5.2.5 DELAY LINES
361 5.3 SENSOR DEVICES 362 CHRISTOPH TREUTLER 5.3.1 INTRODUCTION 362
5.3.2 REQUIREMENTS FOR THIN FILMS TO BE USED AS TRANSDUCERS 362 5.3.3
THIN FILM STRAIN GAUGES FOR PRESSURE SENSORS AND FORCE METERS 363 5.3.4
THIN FILM THERMOMETER IN A MICROMACHINED AIR-MASS FLOW METER FOR
AUTOMOTIVE APPLICATIONS 364 5.3.5 MAGNETIC THIN FILMS FOR MEASURING
POSITION, ANGLE, ROTATIONAL SPEED AND TORQUE 366 5.4 X-RAY OPTICAL
SYSTEMS 373 HERMANN MAI, STEFAN BRAUN 5.4.1 BASIC PROPERTIES OF THE
COMBINATION OF X-RAY OPTICAL ELEMENTS 373 5.4.2 X-RAY ASTRONOMY 374
5.4.3 X-RAY MICROSCOPY 377 CONTENTS IX 5.4.4 EXTREME ULTRAVIOLET
LITHOGRAPHY (EUVL) 378 5.4.5 X-RAY REFLECTOMETRY AND DIFFRACTOMETRY 380
5.4.6 X-RAY FLUORESCENCE ANALYSIS 381 5.5 THERMOELECTRIC SENSORS AND
TRANSDUCERS 383 JOACHIM SCHUMANN 5.5.1 INTRODUCTION 383 5.5.2
THERMOELECTRIC ENERGY CONVERSION - SOME BASIC CONSIDERATIONS 383 5.5.3
THERMOELECTRIC SENSORS 384 5.5.4 THERMOELECTRIC TRANSDUCERS 390 5.5.5
OUTLOOK 394 5.6 REFERENCES 394 6 OUTLOOK 39 9 KLAUS WETZIG, CLAUS M.
SCHNEIDER 6.1 NEW FUNCTIONALITIES 399 6.2 MATERIALS-RELATED ASPECTS 400
6.3 MICROELECTRONICS - QUO VADIS? 401 6.4 WHAT YOU SEE IS WHAT YOU GET
402 6.5 REFERENCES 403 INDEX 405
|
| adam_txt |
METAL BASED THIN FILMS FOR ELECTRONICS SECOND, REVISED AND ENLARGED
EDITION KLAUS WETZIG AND CLAUS M. SCHNEIDER (EDITORS) WILEY- VCH
WILEY-VCH VERLAG GMBH & CO. KGAA CONTENTS PREFACE XI LIST OF
CONTRIBUTORS XIII 1 INTRODUCTION 1 KLAUS WETZIG, CLAUS M. SCHNEIDER 1.1
PROLOGUE 1 1.2 ORGANIZATION, AIM AND CONTENT OF THIS BOOK 2 2 THIN FILM
SYSTEMS: BASIC ASPECTS 7 2.1 INTERCONNECTS FOR MICROELECTRONICS 7 RALPH
SPOLENAK, EHRENFRIED ZSCHECH 2.1.1 INTRODUCTION 7 2.1.2 METALLIZATION
LAYERS 8 2.1.3 MATERIALS SCIENCE OF METALLIC INTERCONNECTS 12 2.1.4
FUNCTION OF BARRIER AND NUCLEATION LAYERS AND MATERIALS SELECTION 26 2.2
METALLIZATION STRUCTURES IN ACOUSTOELECTRONICS 28 MANFRED WEIHNACHT
2.2.1 INTRODUCTION 28 2.2.2 FUNDAMENTALS OF SURFACE ACOUSTIC WAVES 30
2.2.3 INTERDIGITAL TRANSDUCERS (IDTS) 40 2.2.4 REFLECTOR GRATINGS 44
2.2.5 WAVEGUIDES, ENERGY TRAPPING 44 2.2.6 MULTISTRIP COUPLERS 45 2.2.7
INTERDIGITAL TRANSDUCERS WITH PIEZOELECTRIC LAYER 45 2.2.8 METAL STRIPS
WITH DIELECTRIC COATINGS 47 2.3 SILICIDE LAYERS FOR ELECTRONICS 48
JOACHIM SCHUMANN 2.3.1 INTRODUCTION 48 2.3.2 THE BASIC CHEMICAL AND
PHYSICAL PROPERTIES 49 2.3.3 PREPARATION OF SILICIDES 55 2.3.4 SILICIDES
WITH METALLIC CONDUCTIVITY 62 2.3.5 SEMICONDUCTING SILICIDES 64 2.3.6
HETEROGENEOUSLY DISORDERED SILICIDE FILMS 68 METAL BASED THIN FILMS FOR
ELECTRONICS, SECOND EDITION- KLAUS WETZIG AND CLAUS M. SCHNEIDER (EDS.)
COPYRIGHT 2006 WILEY-VCH VERLAG GMBH & CO. KGAA, WEINHEIM ISBN:
3-527-40650-6 VI CONTENTS 2.4 COMPLEX LAYERED SYSTEMS FOR
MAGNETOELECTRONICS 71 CLAUS M. SCHNEIDER 2.4.1 INTRODUCTION 71 2.4.2
MAGNETISM: A PRIMER 73 2.4.3 MAGNETIC COUPLING PHENOMENA 74 2.4.4
ELECTRIC TRANSPORT IN LAYERED MAGNETIC SYSTEMS 82 2.4.5 FUNCTIONAL THIN
FILM SYSTEMS 93 2.5 MULTILAYER AND SINGLE-SURFACE REFLECTORS FOR X-RAY
OPTICS 103 HERMANN MAI, STEFAN BRAUN 2.5.1 INTRODUCTION 103 2.5.2
REFRACTION AND REFLECTION AT SINGLE BOUNDARIES 105 2.5.3 BRAGG
REFLECTION AT ID LATTICE SYSTEMS 109 2.5.4 MULTILAYER PREPARATION 119
2.6 METALLIC LAYERS FOR PHOTOVOLTAICS 122 WINFRIED BLAU 2.6.1
INTRODUCTION 122 2.6.2 SOLAR CELLS 123 2.6.3 FUNCTIONALITIES OF THIN
METALLIC FILMS IN PV CELLS 124 2.6.4 EXAMPLES 129 2.7 REFERENCES 129 3
THIN FILM PREPARATION AND CHARACTERIZATION TECHNIQUES 141 3.1 THIN FILM
PREPARATION METHODS 141 CHRISTIAN WENZEL 3.1.1 INTRODUCTION 141 3.1.2
PHYSICAL VAPOR DEPOSITION 143 3.1.3 CHEMICAL VAPOR DEPOSITION 153 3.1.4
NON VACUUM-BASED DEPOSITION 156 3.1.5 OUTLOOK 160 3.2 ELECTRON
MICROSCOPY AND DIFFRACTION 160 KLAUS WETZIG, JU'RGEN THOMAS 3.2.1
TRANSMISSION ELECTRON MICROSCOPY (TEM)-IMAGING 160 3.2.2 TEM-SELECTED
AREA ELECTRON DIFFRACTION 168 3.2.3 IN SITU-SEM METHODS 172 3.2.4
ELECTRON BACKSCATTER DIFFRACTION 177 3.3 X-RAY SCATTERING TECHNIQUES 179
MICHAEL HECKER 3.3.1 WIDE ANGLE DIFFRACTION 180 3.3.2 REFLECTOMETRY 190
3.3.3 SOFT X-RAYS AND MAGNETIC SCATTERING 194 CONTENTS VII 3.4
SPECTROSCOPIC TECHNIQUES 197 KLAUS WETZIG 3.4.1 ELEMENT DISTRIBUTION
ANALYSIS 197 3.4.2 ELEMENT DEPTH PROFILE ANALYSIS 207 3.5 STRESS
MEASUREMENT TECHNIQUES 214 WINFRIED BRUCKNER 3.5.1 STRESS AND STRAIN 214
3.5.2 SUBSTRATE CURVATURE 217 3.5.3 MEASUREMENT TECHNIQUES 219 3.6
REFERENCES 22 5 4 CHALLENGES FOR THIN FILM SYSTEMS CHARACTERIZATION AND
OPTIMIZATION 23 1 4.1 ELECTROMIGRATION IN METALLIZATION LAYERS 231 RALPH
SPOLENAK, HORST WENDRDOCK, KLAUS WETZIG 4.1.1 FUNDAMENTALS 231 4.1.2
METHODS FOR QUANTITATIVE DAMAGE ANALYSIS 234 4.1.3 AL INTERCONNECTS 237
4.1.4 CU INTERCONNECTS 241 4.2 BARRIER AND NUCLEATION LAYERS FOR
INTERCONNECTS 248 EHRENFRIED ZSCHECH 4.2.1 INTRODUCTION 248 4.2.2 PVD
BARRIER LAYERS FOR COPPER INTERCONNECTS 249 4.2.3 BARRIER/SEED
MICROSTRUCTURE AND STEP COVERAGE 255 4.2.4 NEW BARRIER/SEED CONCEPTS
USING CVD AND ALD 259 4.2.5 ATOMIC LAYER DEPOSITION (ALD) 260 4.3
ACOUSTOMIGRATION IN SURFACE ACOUSTIC WAVES STRUCTURES 261 SIEGFRIED
MENZEL, KLAUS WETZIG 4.3.1 GENERAL REMARKS 261 4.3.2 ACOUSTOMIGRATION
MECHANISM 262 4.3.3 METALLIZATION CONCEPTS FOR POWER SAW STRUCTURES 263
4.3.4 EXPERIMENTAL SETUP AND SAW TECHNOLOGY 267 4.3.5 ACOUSTOMIGRATION
EXPERIMENTS 272 4.4 THERMAL STABILITY OF MAGNETORESISTIVE LAYER STACKS
283 CLAUS M. SCHNEIDER, JTIRGEN THOMAS 4.4.1 METALLIC MULTILAYERS AS GMR
MODEL SYSTEMS 284 4.4.2 CO/CU MULTILAYERS 285 4.4.3 NI 80 FE 20 /CU
MULTILAYERS 293 4.5 FUNCTIONAL MAGNETIC LAYERS FOR SENSORS AND MRAMS 29
5 HARTMUT VINZELBERG, DIETER ELEFANT 4.5.1 MAGNETIC MULTILAYERS: LAYER
THICKNESS DEPENDENCE OF THE GMR PARAMETERS 296 4.5.2 SPIN VALVES 301
VIII CONTENTS 4.5.3 MAGNETIC TUNNEL JUNCTIONS 305 4.6 MULTILAYERS FOR
X-RAY OPTICAL PURPOSES 309 HERMANN MAI, STEFAN BRAUN 4.6.1 MULTILAYERS
AS REFLECTORS FOR X-RAYS 309 4.6.2 REAL STRUCTURE OF NM-MULTILAYERS 311
4.6.3 HIGH-RESOLUTION MULTILAYERS 319 4.6.4 MULTILAYERS WITH UNIFORM AND
GRADED PERIOD THICKNESS 322 4.7 FUNCTIONAL ELECTRIC LAYERS 323 JOACHIM
SCHUMANN, JU'RGEN THOMAS 4.7.1 RESISTANCE LAYERS 324 4.7.2
THERMOELECTRIC THIN FILMS 332 4.8 REFERENCES 340 5 DEVICES 349 5.1
DEVICE RELATED ASPECTS FOR SI-BASED ELECTRONICS 349 EHRENFRIED ZSCHECH
5.1.1 INTERCONNECT TECHNOLOGY AND MATERIALS TRENDS FOR MEMORY AND LOGIC
PRODUCTS 349 5.1.2 COPPER INLAID PROCESS: PROCESS INTEGRATION AND
MATERIALS RELATED TOPICS 350 5.1.3 WIRING HIERARCHY FOR COPPER/LOW-^
ON-CHIP INTERCONNECTS 351 5.1.4 NEW GLOBAL INTERCONNECT CONCEPTS 353 5.2
SAW HIGH FREQUENCY FILTERS, RESONATORS AND DELAY LINES 353 MANFRED
WEIHNACHT 5.2.1 INTRODUCTION 353 5.2.2 TRANSVERSAL FILTERS 354 5.2.3
RESONATORS 357 5.2.4 FILTERS WITH SPREAD SPECTRUM 360 5.2.5 DELAY LINES
361 5.3 SENSOR DEVICES 362 CHRISTOPH TREUTLER 5.3.1 INTRODUCTION 362
5.3.2 REQUIREMENTS FOR THIN FILMS TO BE USED AS TRANSDUCERS 362 5.3.3
THIN FILM STRAIN GAUGES FOR PRESSURE SENSORS AND FORCE METERS 363 5.3.4
THIN FILM THERMOMETER IN A MICROMACHINED AIR-MASS FLOW METER FOR
AUTOMOTIVE APPLICATIONS 364 5.3.5 MAGNETIC THIN FILMS FOR MEASURING
POSITION, ANGLE, ROTATIONAL SPEED AND TORQUE 366 5.4 X-RAY OPTICAL
SYSTEMS 373 HERMANN MAI, STEFAN BRAUN 5.4.1 BASIC PROPERTIES OF THE
COMBINATION OF X-RAY OPTICAL ELEMENTS 373 5.4.2 X-RAY ASTRONOMY 374
5.4.3 X-RAY MICROSCOPY 377 CONTENTS IX 5.4.4 EXTREME ULTRAVIOLET
LITHOGRAPHY (EUVL) 378 5.4.5 X-RAY REFLECTOMETRY AND DIFFRACTOMETRY 380
5.4.6 X-RAY FLUORESCENCE ANALYSIS 381 5.5 THERMOELECTRIC SENSORS AND
TRANSDUCERS 383 JOACHIM SCHUMANN 5.5.1 INTRODUCTION 383 5.5.2
THERMOELECTRIC ENERGY CONVERSION - SOME BASIC CONSIDERATIONS 383 5.5.3
THERMOELECTRIC SENSORS 384 5.5.4 THERMOELECTRIC TRANSDUCERS 390 5.5.5
OUTLOOK 394 5.6 REFERENCES 394 6 OUTLOOK 39 9 KLAUS WETZIG, CLAUS M.
SCHNEIDER 6.1 NEW FUNCTIONALITIES 399 6.2 MATERIALS-RELATED ASPECTS 400
6.3 MICROELECTRONICS - QUO VADIS? 401 6.4 WHAT YOU SEE IS WHAT YOU GET
402 6.5 REFERENCES 403 INDEX 405 |
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| ctrlnum | (OCoLC)70961433 (DE-599)BVBBV021663304 |
| discipline | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
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| edition | 2., rev. and enl. ed. |
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| id | DE-604.BV021663304 |
| illustrated | Illustrated |
| index_date | 2024-07-02T15:06:39Z |
| indexdate | 2024-07-09T20:41:06Z |
| institution | BVB |
| isbn | 3527406506 9783527406500 |
| language | German |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-014877776 |
| oclc_num | 70961433 |
| open_access_boolean | |
| owner | DE-1043 DE-29T |
| owner_facet | DE-1043 DE-29T |
| physical | XIV, 410S. Ill., graph. Darst. |
| publishDate | 2006 |
| publishDateSearch | 2006 |
| publishDateSort | 2006 |
| publisher | Wiley-VCH |
| record_format | marc |
| spelling | Metal based thin films for electronics Klaus Wetzig ... (eds.) 2., rev. and enl. ed. Weinheim Wiley-VCH 2006 XIV, 410S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Metallic films Thin films Dünne Schicht (DE-588)4136925-7 gnd rswk-swf Metallschicht (DE-588)4252858-6 gnd rswk-swf Elektroniktechnologie (DE-588)4402723-0 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Dünne Schicht (DE-588)4136925-7 s Metallschicht (DE-588)4252858-6 s Elektroniktechnologie (DE-588)4402723-0 s Mikroelektronik (DE-588)4039207-7 s DE-604 Wetzig, Klaus Sonstige oth HEBIS Datenaustausch Darmstadt application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014877776&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Metal based thin films for electronics Metallic films Thin films Dünne Schicht (DE-588)4136925-7 gnd Metallschicht (DE-588)4252858-6 gnd Elektroniktechnologie (DE-588)4402723-0 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| subject_GND | (DE-588)4136925-7 (DE-588)4252858-6 (DE-588)4402723-0 (DE-588)4039207-7 |
| title | Metal based thin films for electronics |
| title_auth | Metal based thin films for electronics |
| title_exact_search | Metal based thin films for electronics |
| title_exact_search_txtP | Metal based thin films for electronics |
| title_full | Metal based thin films for electronics Klaus Wetzig ... (eds.) |
| title_fullStr | Metal based thin films for electronics Klaus Wetzig ... (eds.) |
| title_full_unstemmed | Metal based thin films for electronics Klaus Wetzig ... (eds.) |
| title_short | Metal based thin films for electronics |
| title_sort | metal based thin films for electronics |
| topic | Metallic films Thin films Dünne Schicht (DE-588)4136925-7 gnd Metallschicht (DE-588)4252858-6 gnd Elektroniktechnologie (DE-588)4402723-0 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| topic_facet | Metallic films Thin films Dünne Schicht Metallschicht Elektroniktechnologie Mikroelektronik |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014877776&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT wetzigklaus metalbasedthinfilmsforelectronics |