Fundamentals of semiconductor manufacturing and process control:
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| 650 | 4 | |a Semiconductors |x Design and construction | |
| 650 | 4 | |a Integrated circuits |x Design and construction | |
| 650 | 4 | |a Process control |x Statistical methods | |
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| adam_text | IMAGE 1
FUN DAMENTALS OF
SEMICONDUCTOR MANUFACTURING AND PROCESS CONTROL
GARY S. MAY, PH.D. GEORGIA INSTITUTE OF TECHNOLOGY ATLANTA, GEORGIA
COSTAS J. SPANOS, PH.D.
UNIVERSITY OF CALIFORNIA AT BERKELEY BERKELEY, CALIFORNIA
WILEY-INTERSCIENCE
A JOHN WILEY & SONS, INC., PUBLICATION
IMAGE 2
CONTENTS
PREFACE XVII
ACKNOWLEDGMENTS XIX
1 INTRODUCTION TO SEMICONDUCTOR MANUFACTURING 1
OBJECTIVES / 1 INTRODUCTION / 1 1.1. HISTORICAL EVOLUTION / 2 1.1.1.
MANUFACTURING AND QUALITY CONTROL / 3
1.1.2. SEMICONDUCTOR PROCESSES / 5 1.1.3. INTEGRATED CIRCUIT
MANUFACTURING / 7 1.2. MODERN SEMICONDUCTOR MANUFACTURING / 8 1.2.1.
UNIT PROCESSES / 9
1.2.2. PROCESS SEQUENCES / 11 1.2.3. INFORMATION FLOW / 12 1.2.4.
PROCESS ORGANIZATION / 14 1.3. GOALS OF MANUFACTURING / 15
1.3.1. COST / 15
1.3.2. QUALITY / 17 1.3.3. VARIABILITY / 17 1.3.4. YIELD / 17 1.3.5.
RELIABILITY / 18 1.4. MANUFACTURING SYSTEMS / 18
1.4.1. CONTINUOUS FLOW / 19 1.4.1.1. BATCH PROCESSES I 20 1.4.1.2.
SINGLE WORKPIECE I 20
1.4.2. DISCRETE PARTS / 21 1.5. OUTLINE FOR REMAINDER OF THE BOOK / 21
SUMMARY / 22 PROBLEMS / 22
REFERENCES / 23
VII
IMAGE 3
CONTENTS
TECHNOLOGY OVERVIEW
OBJECTIVES / 25 INTRODUCTION / 25 2.1. UNIT PROCESSES / 25 2.1.1.
OXIDATION / 26
2.1.1.1. GROWTH KINETICS I 27 2.1.1.2. THIN OXIDE GROWTH I 31 2.1.1.3.
OXIDE QUALITY I 33 2.1.2. PHOTOLITHOGRAPHY / 34 2.1.2.1. EXPOSURE TOOLS
I 35 2.1.2.2. MASKS I 38 2.1.2.3. PHOTORESIST I 39 2.1.2.4. PATTERN
TRANSFER I 41 2.1.2.5. E-BEAM LITHOGRAPHY I 43 2.1.2.6. X-RAY
LITHOGRAPHY I 45 2.1.3. ETCHING / 47 2.1.3.1. WET CHEMICAL ETCHING I 47
2.1.3.2. DRY ETCHING I 48 2.1.4. DOPING / 51 2.1.4.1. DIFFUSION I 52
2.1.4.2. ION IMPLANTATION I 56 2.1.5. DEPOSITION / 58 2.1.5.1. PHYSICAL
VAPOR DEPOSITION I 59 2.1.5.2. CHEMICAL VAPOR DEPOSITION I 60 2.1.6.
PLANARIZATION / 61 2.2. PROCESS INTEGRATION / 61 2.2.1. BIPOLAR
TECHNOLOGY / 63 2.2.2. CMOS TECHNOLOGY / 66
2.2.2.1. BASIC NMOS FABRICATION SEQUENCE I 67 2.2.2.2. CMOS FABRICATION
SEQUENCE I 70 2.2.3. BICMOS TECHNOLOGY / 74 2.2.4. PACKAGING / 75
2.2.4.1. DIE SEPARATION I 76 2.2.4.2. PACKAGE TYPES I 77 2.2.4.3.
ATTACHMENT METHODS I 79 SUMMARY / 80 PROBLEMS / 80 REFERENCES / 81
IMAGE 4
CONTENTS
PROCESS MONITORING
OBJECTIVES / 82 INTRODUCTION / 82 3.1. PROCESS FLOW AND KEY MEASUREMENT
POINTS / 83 3.2. WAFER STATE MEASUREMENTS / 84
3.2.1. BLANKET THIN FILM / 85 3.2.1.1. INTERFEROMETRY I 85 3.2.1.2.
ELLIPSOMETRY I 88 3.2.1.3. QUARTZ CRYSTAL MONITOR I 91 3.2.1.4.
FOUR-POINT PROBE I 92 3.2.2. PATTERNED THIN FILM / 93
3.2.2.1. PROSSOMETRY I 93 3.2.2.2. ATOMIC FORCE MICROSCOPY I 93 3.2.2.3.
SCANNING ELECTRON MICROSCOPY I 95 3.2.2.4. SCATTEROMETRY I 96 3.2.2.5.
ELECTRICAL LINEWIDTH MEASUREMENT I 98 3.2.3. PARTICLE/DEFECT INSPECTION
/ 98
3.2.3.1. CLEANROOM AIR MONITORING I 99 3.2.3.2. PRODUCT MONITORING I 100
3.2.4. ELECTRICAL TESTING / 102 3.2.4.1. TEST STRUCTURES I 102
3.2.4.2. FINAL TEST I 106
3.3. EQUIPMENT STATE MEASUREMENTS / 107 3.3.1. THERMAL OPERATIONS / 109
3.3.1.1. TEMPERATURE I 109 3.3.1.2. PRESSURE I 109
3.3.1.3. GAS FLOW I 110 3.3.2. PLASMA OPERATIONS / 111 3.3.2.1.
TEMPERATURE I 111 3.3.2.2. PRESSURE I 112
3.3.2.3. GAS FLOW I 112 3.3.2.4. RESIDUAL GAS ANALYSIS I 112 3.3.2.5.
OPTICAL EMISSION SPECTROSCOPY I 114 3.3.2.6. FOURIER TRANSFORM INFRARED
SPECTROSCOPY I 115 3.3.2.7. RFMONITORS I 116 3.3.3. LITHOGRAPHY
OPERATIONS / 116 3.3.4. IMPLANTATION / 117
IMAGE 5
X CONTENTS
3.3.5. PLANARIZATION / 118
SUMMARY / 118 PROBLEMS / 119 REFERENCES / 120
4 STATISTICAL FUNDAMENTALS 122
OBJECTIVES / 122 INTRODUCTION / 122 4.1. PROBABILITY DISTRIBUTIONS / 123
4.1.1. DISCRETE DISTRIBUTIONS / 124
4.1.1.1. HYPERGEOMETRIC I 124 4.1.1.2. BINOMIAL I 125 4.1.1.3. POISSON I
127 4.1.1.4. PASCAL I 128 4.1.2. CONTINUOUS DISTRIBUTIONS / 128
4.1.2.1. NORMAL I 129 4.1.2.2. EXPONENTIAL I 131 4.1.3. USEFUL
APPROXIMATIONS / 132 4.1.3.1. POISSON APPROXIMATION TO THE
BINOMIAL I 132 4.1.3.2. NORMAL APPROXIMATION TO THE BINOMIAL I 132 4.2.
SAMPLING FROM A NORMAL DISTRIBUTION / 133
4.2.1. CHI-SQUARE DISTRIBUTION / 134 4.2.2. T DISTRIBUTION / 134 4.2.3.
F DISTRIBUTION / 135 4.3. ESTIMATION / 136 4.3.1. CONFIDENCE INTERVAL
FOR THE MEAN WITH KNOWN
VARIANCE / 137 4.3.2. CONFIDENCE INTERVAL FOR THE MEAN WITH UNKNOWN
VARIANCE / 137 4.3.3. CONFIDENCE INTERVAL FOR VARIANCE / 137 4.3.4.
CONFIDENCE INTERVAL FOR THE DIFFERENCE BETWEEN TWO
MEANS, KNOWN VARIANCE / 138 4.3.5. CONFIDENCE INTERVAL FOR THE
DIFFERENCE BETWEEN TWO MEANS, UNKNOWN VARIANCES / 138 4.3.6. CONFIDENCE
INTERVAL FOR THE RATIO OF TWO
VARIANCES / 139
4.4. HYPOTHESIS TESTING / 140 4.4.1. TESTS ON MEANS WITH KNOWN VARIANCE
/ 141 4.4.2. TESTS ON MEANS WITH UNKNOWN VARIANCE / 142 4.4.3. TESTS ON
VARIANCE / 143
IMAGE 6
CONTENTS XI
SUMMARY / 145
PROBLEMS / 145 REFERENCE / 146
5 YIELD MODELING 147
OBJECTIVES / 147 INTRODUCTION / 147 5.1. DEFINITIONS OF YIELD COMPONENTS
/ 148 5.2. FUNCTIONAL YIELD MODELS / 149
5.2.1. POISSON MODEL / 151 5.2.2. MURPHY S YIELD INTEGRAL / 152 5.2.3.
NEGATIVE BINOMIAL MODEL / 154 5.3. FUNCTIONAL YIELD MODEL COMPONENTS /
156
5.3.1. DEFECT DENSITY / 156 5.3.2. CRITICAL AREA / 157 5.3.3. GLOBAL
YIELD LOSS / 158 5.4. PARAMETRIC YIELD / 159 5.5. YIELD SIMULATION / 161
5.5.1. FUNCTIONAL YIELD SIMULATION / 162
5.5.2. PARAMETRIC YIELD SIMULATION / 167 5.6. DESIGN CENTERING / 171
5.6.1. ACCEPTABILITY REGIONS / 172
5.6.2. PARAMETRIC YIELD OPTIMIZATION / 173 5.7. PROCESS INTRODUCTION AND
TIME-TO-YIELD / 174 SUMMARY / 176 PROBLEMS / 177 REFERENCES / 180
6 STATISTICAL PROCESS CONTROL 181
OBJECTIVES / 181 INTRODUCTION / 181 6.1. CONTROL CHART BASICS / 182 6.2.
PATTERNS IN CONTROL CHARTS / 184
6.3. CONTROL CHARTS FOR ATTRIBUTES / 186 6.3.1. CONTROL CHART FOR
FRACTION NONCONFORMING / 187 6.3.1.1. CHART DESIGN I 188 6.3.1.2.
VARIABLE SAMPLE SIZE I 189
6.3.1.3. OPERATING CHARACTERISTIC AND AVERAGE RUNLENGTH I 191 6.3.2.
CONTROL CHART FOR DEFECTS / 193 6.3.3. CONTROL CHART FOR DEFECT DENSITY
/ 193
IMAGE 7
XUE CONTENTS
6.4. CONTROL CHARTS FOR VARIABLES / 195
6.4.1. CONTROL CHARTS FOR X A N D FI / 195 6.4.1.1. RATIONAL SUBGROUPS I
199 6.4.1.2. OPERATING CHARACTERISTIC AND AVERAGE RUNLENGTH I 200 6.4.2.
CONTROL CHARTS FOR X AND S I 202 6.4.3. PROCESS CAPABILITY / 204 6.4.4.
MODIFIED AND ACCEPTANCE CHARTS / 206 6.4.5. CUSUM CHART / 208
6.4.5.1. TABULAR CUSUM CHART I 210 6.4.5.2. AVERAGE RUNLENGTH I 210
6.4.5.3. CUSUM FOR VARIANCE I 211 6.4.6. MOVING-AVERAGE CHARTS / 212
6.4.6.1. BASIC MOVING-AVERAGE CHART I 212 6.4.6.2. EXPONENTIALLY
WEIGHTED MOVING-AVERAGE
CHART I 213
6.5. MULTIVARIATE CONTROL / 215 6.5.1. CONTROL OF MEANS / 217 6.5.2.
CONTROL OF VARIABILITY / 220
6.6. SPC WITH CORRELATED PROCESS DATA / 221 6.6.1. TIME-SERIES MODELING
/ 221 6.6.2. MODEL-BASED SPC / 223 SUMMARY / 224 PROBLEMS / 224
REFERENCES / 227
7 STATISTICAL EXPERIMENTAL DESIGN 228
OBJECTIVES / 228 INTRODUCTION / 228 7.1. COMPARING DISTRIBUTIONS / 229
7.2. ANALYSIS OF VARIANCE / 232
7.2.1. SUMS OF SQUARES / 232 7.2.2. ANOVA TABLE / 234 7.2.2.1. GEOMETRIE
INTERPRETATION I 235 7.2.2.2. ANOVA DIAGNOSTICS I 237
7.2.3. RANDOMIZED BLOCK EXPERIMENTS / 240 7.2.3.1. MATHEMATICAL MODEL I
242 7.2.3.2. DIAGNOSTIC CHECKING I 243
IIA. TWO-WAY DESIGNS / 245 7.2.4.1. ANALYSIS I 245 7.2.4.2. DATA
TRANSFORMATION I 246
IMAGE 8
CONTENTS XUEI
7.3. FACTORIAL DESIGNS / 249
7.3.1. TWO-LEVEL FACTORIALS / 250 7.3.1.1. MAIN EFFECTS I 251 7.3.1.2.
INTERACTION EFFECTS I 251 7.3.1.3. STANDARD ERROR I 252 7.3.1.4.
BLOCKING I 254 7.3.2. FRACTIONAL FACTORIALS / 256
7.3.2.1. CONSTRUCTION OF FRACTIONAL FACTORIALS I 256 7.3.2.2. RESOLUTION
I 257 7.3.3. ANALYZING FACTORIALS / 257
7.3.3.1. THE YATES ALGORITHM I 258 7.3.3.2. NORMAL PROBABILITY PLOTS I
258 7.3.4. ADVANCED DESIGNS / 260 7.4. TAGUCHI METHOD / 262 7.4.1.
CATEGORIZING PROCESS VARIABLES / 263 7.4.2. SIGNAL-TO-NOISE RATIO / 264
7.4.3. ORTHOGONAL ARRAYS / 264 7.4.4. DATA ANALYSIS / 266 SUMMARY / 269
PROBLEMS / 269 REFERENCES / 271
8 PROCESS MODELING 272
OBJECTIVES / 272 INTRODUCTION / 272 8.1. REGRESSION MODELING / 273
8.1.1. SINGLE-PARAMETER MODEL / 274
8.1.1.1. RESIDUAIS I 275 8.1.1.2. STANDARD ERROR I 276 8.1.1.3. ANALYSIS
OF VARIANCE I 276 8.1.2. TWO-PARAMETER MODEL / 277
8.1.2.1. ANALYSIS OF VARIANCE I 279 8.1.2.2. PRECISION OF ESTIMATES I
279 8.1.2.3. LINEAR MODEL WITH NONZERO INTERCEPT I 280
8.1.3. MULTIVARIATE MODELS / 283 8.1.4. NONLINEAR REGRESSION / 285
8.1.5. REGRESSION CHART / 287 8.2. RESPONSE SURFACE METHODS / 289 8.2.1.
HYPOTHETICAL YIELD EXAMPLE / 289
IMAGE 9
XJV CONTENTS
8.2.1.1. DIAGNOSTIC CHECKING I 292
8.2.1.2. AUGMENTED MODEL I 293 8.2.2. PLASMA ETCHING EXAMPLE / 294
8.2.2.1. EXPERIMENTAL DESIGN I 295 8.2.2.2. EXPERIMENTAL TECHNIQUE I 297
8.2.2.3. ANALYSIS I 298
8.3. EVOLUTIONARY OPERATION / 301 8.4. PRINCIPAL-COMPONENT ANALYSIS /
306 8.5. INTELLIGENT MODELING TECHNIQUES / 310 8.5.1. NEURAL NETWORKS /
310
8.5.2. FUZZY LOGIC / 314 8.6. PROCESS OPTIMIZATION / 318 8.6.1. POWELL S
ALGORITHM / 318 8.6.2. SIMPLEX METHOD / 320
8.6.3. GENETIC ALGORITHMS / 323 8.6.4. HYBRID METHODS / 325 8.6.5. PECVD
OPTIMIZATION: A CASE STUDY / 326 SUMMARY / 327 PROBLEMS / 328 REFERENCES
/ 331
9 ADVANCED PROCESS CONTROL 333
OBJECTIVES / 333 INTRODUCTION / 333 9.1. RUN-BY-RUN CONTROL WITH
CONSTANT TERM ADAPTATION / 335 9.1.1. SINGLE-VARIABLE METHODS / 335
9.1.1.1. GRADUAL DRIFT I 337 9.1.1.2. ABRUPT SHIFTS I 339 9. 1.2.
MULTIVARIATE TECHNIQUES / 343 9.1.2.1. EXPONENTIALLY WEIGHTED
MOVING-AVERAGE
(EWMA) GRADUAL MODEL I 343 9.1.2.2. PREDICTOR-CORRECTOR CONTROL I 343
9.1.3. PRACTICAL CONSIDERATIONS / 346 9.1.3.1. INPUT BOUNDS I 346
9.1.3.2. INPUT RESOLUTION I 348 9.1.3.3. INPUT WEIGHTS I 348 9.1.3.4.
OUTPUT WEIGHTS I 350 9.2. MULTIVARIATE CONTROL WITH COMPLETE MODEL
ADAPTATION / 351 9.2.1. DETECTION OF PROCESS DISTURBANCES VIA
MODEL-BASED SPC / 352
IMAGE 10
CONTENTS XV
9.2.1.1. MALFUNCTION ALARMS I 352
9.2.1.2. ALARMS FOR FEEDBACK CONTROL I 353 9.2.2. FUELL MODEL ADAPTATION
/ 354 9.2.3. AUTOMATED RECIPE GENERATION / 356 9.2.4. FEEDFORWARD
CONTROL / 358 9.3. SUPERVISORY CONTROL / 359
9.3.1. SUPERVISORY CONTROL USING COMPLETE MODEL ADAPTATION / 359
9.3.1.1. ACCEPTABLE INPUT RANGES OF PHOTOLITHOGRAPHIC MACHINES I 361
9.3.1.2. EXPERIMENTAL EXAMPLES I 363 9.3.2. INTELLIGENT SUPERVISORY
CONTROL / 364 SUMMARY / 373 PROBLEMS / 373 REFERENCES / 378
10 PROCESS AND EQUIPMENT DIAGNOSIS 379
OBJECTIVES / 379 INTRODUCTION / 379 10.1. ALGORITHMIC METHODS / 381
10.1.1. HIPPOCRATES / 381
10.1.1.1. MEASUREMENT PLAN I 382 10.1.1.2. FAULT DIAGNOSIS I 383
10.1.1.3. EXAMPLE I 383 10.1.2. MERLIN / 384
10.1.2.1. KNOWLEDGE REPRESENTATION I 385 10.1.2.2. INFERENCE MECHANISM I
387 10.1.2.3. CASE STUDY I 390 10.2. EXPERT SYSTEMS / 391
10.2.1. PIES / 391 10.2.1.1. KNOWLEDGE BASE I 393 10.2.1.2. DIAGNOSTIC
REASONING I 394 10.2.1.3. EXAMPLES I 395 10.2.2. PEDX / 395
10.2.2.1. ARCHITECTURE I 396 10.2.2.2. RULE-BASED REASONING I 397
10.2.2.3. IMPLEMENTATION I 398 10.3. NEURAL NETWORK APPROACHES / 398
10.3.1. PROCESS CONTROL NEURAL NETWORK / 398 10.3.2. PATTERN RECOGNITION
IN CVD DIAGNOSIS / 400 10.4. HYBRID METHODS / 402
IMAGE 11
XVI CONTENTS
10.4.1. TIME-SERIES DIAGNOSIS / 402
10.4.2. HYBRID EXPERT SYSTEM / 403 10.4.2.1. DEMPSTER-SHAFER THEORY I
406 10.4.2.2. MAINTENANCE DIAGNOSIS I 408 10.4.2.3. ONLINE DIAGNOSIS I
409 10.4.2.4. INLINE DIAGNOSIS I 413 SUMMARY / 414 PROBLEMS / 414
REFERENCES / 415
APPENDIX A: SOME PROPERTIES OF THE ERROR FUNCTION 417
APPENDIX B: CUMULATIVE STANDARD NORMAL DISTRIBUTION 420
APPENDIX C: PERCENTAGE POINTS OF THE X 2 DISTRIBUTION 423
APPENDIX D: PERCENTAGE POINTS OF THE T DISTRIBUTION 425
APPENDIX E: PERCENTAGE POINTS OF THE F DISTRIBUTION 427
APPENDIX F: FACTORS FOR CONSTRUCTING VARIABLES CONTROL CHARTS 438
INDEX 441
|
| adam_txt |
IMAGE 1
FUN DAMENTALS OF
SEMICONDUCTOR MANUFACTURING AND PROCESS CONTROL
GARY S. MAY, PH.D. GEORGIA INSTITUTE OF TECHNOLOGY ATLANTA, GEORGIA
COSTAS J. SPANOS, PH.D.
UNIVERSITY OF CALIFORNIA AT BERKELEY BERKELEY, CALIFORNIA
WILEY-INTERSCIENCE
A JOHN WILEY & SONS, INC., PUBLICATION
IMAGE 2
CONTENTS
PREFACE XVII
ACKNOWLEDGMENTS XIX
1 INTRODUCTION TO SEMICONDUCTOR MANUFACTURING 1
OBJECTIVES / 1 INTRODUCTION / 1 1.1. HISTORICAL EVOLUTION / 2 1.1.1.
MANUFACTURING AND QUALITY CONTROL / 3
1.1.2. SEMICONDUCTOR PROCESSES / 5 1.1.3. INTEGRATED CIRCUIT
MANUFACTURING / 7 1.2. MODERN SEMICONDUCTOR MANUFACTURING / 8 1.2.1.
UNIT PROCESSES / 9
1.2.2. PROCESS SEQUENCES / 11 1.2.3. INFORMATION FLOW / 12 1.2.4.
PROCESS ORGANIZATION / 14 1.3. GOALS OF MANUFACTURING / 15
1.3.1. COST / 15
1.3.2. QUALITY / 17 1.3.3. VARIABILITY / 17 1.3.4. YIELD / 17 1.3.5.
RELIABILITY / 18 1.4. MANUFACTURING SYSTEMS / 18
1.4.1. CONTINUOUS FLOW / 19 1.4.1.1. BATCH PROCESSES I 20 1.4.1.2.
SINGLE WORKPIECE I 20
1.4.2. DISCRETE PARTS / 21 1.5. OUTLINE FOR REMAINDER OF THE BOOK / 21
SUMMARY / 22 PROBLEMS / 22
REFERENCES / 23
VII
IMAGE 3
CONTENTS
TECHNOLOGY OVERVIEW
OBJECTIVES / 25 INTRODUCTION / 25 2.1. UNIT PROCESSES / 25 2.1.1.
OXIDATION / 26
2.1.1.1. GROWTH KINETICS I 27 2.1.1.2. THIN OXIDE GROWTH I 31 2.1.1.3.
OXIDE QUALITY I 33 2.1.2. PHOTOLITHOGRAPHY / 34 2.1.2.1. EXPOSURE TOOLS
I 35 2.1.2.2. MASKS I 38 2.1.2.3. PHOTORESIST I 39 2.1.2.4. PATTERN
TRANSFER I 41 2.1.2.5. E-BEAM LITHOGRAPHY I 43 2.1.2.6. X-RAY
LITHOGRAPHY I 45 2.1.3. ETCHING / 47 2.1.3.1. WET CHEMICAL ETCHING I 47
2.1.3.2. DRY ETCHING I 48 2.1.4. DOPING / 51 2.1.4.1. DIFFUSION I 52
2.1.4.2. ION IMPLANTATION I 56 2.1.5. DEPOSITION / 58 2.1.5.1. PHYSICAL
VAPOR DEPOSITION I 59 2.1.5.2. CHEMICAL VAPOR DEPOSITION I 60 2.1.6.
PLANARIZATION / 61 2.2. PROCESS INTEGRATION / 61 2.2.1. BIPOLAR
TECHNOLOGY / 63 2.2.2. CMOS TECHNOLOGY / 66
2.2.2.1. BASIC NMOS FABRICATION SEQUENCE I 67 2.2.2.2. CMOS FABRICATION
SEQUENCE I 70 2.2.3. BICMOS TECHNOLOGY / 74 2.2.4. PACKAGING / 75
2.2.4.1. DIE SEPARATION I 76 2.2.4.2. PACKAGE TYPES I 77 2.2.4.3.
ATTACHMENT METHODS I 79 SUMMARY / 80 PROBLEMS / 80 REFERENCES / 81
IMAGE 4
CONTENTS
PROCESS MONITORING
OBJECTIVES / 82 INTRODUCTION / 82 3.1. PROCESS FLOW AND KEY MEASUREMENT
POINTS / 83 3.2. WAFER STATE MEASUREMENTS / 84
3.2.1. BLANKET THIN FILM / 85 3.2.1.1. INTERFEROMETRY I 85 3.2.1.2.
ELLIPSOMETRY I 88 3.2.1.3. QUARTZ CRYSTAL MONITOR I 91 3.2.1.4.
FOUR-POINT PROBE I 92 3.2.2. PATTERNED THIN FILM / 93
3.2.2.1. PROSSOMETRY I 93 3.2.2.2. ATOMIC FORCE MICROSCOPY I 93 3.2.2.3.
SCANNING ELECTRON MICROSCOPY I 95 3.2.2.4. SCATTEROMETRY I 96 3.2.2.5.
ELECTRICAL LINEWIDTH MEASUREMENT I 98 3.2.3. PARTICLE/DEFECT INSPECTION
/ 98
3.2.3.1. CLEANROOM AIR MONITORING I 99 3.2.3.2. PRODUCT MONITORING I 100
3.2.4. ELECTRICAL TESTING / 102 3.2.4.1. TEST STRUCTURES I 102
3.2.4.2. FINAL TEST I 106
3.3. EQUIPMENT STATE MEASUREMENTS / 107 3.3.1. THERMAL OPERATIONS / 109
3.3.1.1. TEMPERATURE I 109 3.3.1.2. PRESSURE I 109
3.3.1.3. GAS FLOW I 110 3.3.2. PLASMA OPERATIONS / 111 3.3.2.1.
TEMPERATURE I 111 3.3.2.2. PRESSURE I 112
3.3.2.3. GAS FLOW I 112 3.3.2.4. RESIDUAL GAS ANALYSIS I 112 3.3.2.5.
OPTICAL EMISSION SPECTROSCOPY I 114 3.3.2.6. FOURIER TRANSFORM INFRARED
SPECTROSCOPY I 115 3.3.2.7. RFMONITORS I 116 3.3.3. LITHOGRAPHY
OPERATIONS / 116 3.3.4. IMPLANTATION / 117
IMAGE 5
X CONTENTS
3.3.5. PLANARIZATION / 118
SUMMARY / 118 PROBLEMS / 119 REFERENCES / 120
4 STATISTICAL FUNDAMENTALS 122
OBJECTIVES / 122 INTRODUCTION / 122 4.1. PROBABILITY DISTRIBUTIONS / 123
4.1.1. DISCRETE DISTRIBUTIONS / 124
4.1.1.1. HYPERGEOMETRIC I 124 4.1.1.2. BINOMIAL I 125 4.1.1.3. POISSON I
127 4.1.1.4. PASCAL I 128 4.1.2. CONTINUOUS DISTRIBUTIONS / 128
4.1.2.1. NORMAL I 129 4.1.2.2. EXPONENTIAL I 131 4.1.3. USEFUL
APPROXIMATIONS / 132 4.1.3.1. POISSON APPROXIMATION TO THE
BINOMIAL I 132 4.1.3.2. NORMAL APPROXIMATION TO THE BINOMIAL I 132 4.2.
SAMPLING FROM A NORMAL DISTRIBUTION / 133
4.2.1. CHI-SQUARE DISTRIBUTION / 134 4.2.2. T DISTRIBUTION / 134 4.2.3.
F DISTRIBUTION / 135 4.3. ESTIMATION / 136 4.3.1. CONFIDENCE INTERVAL
FOR THE MEAN WITH KNOWN
VARIANCE / 137 4.3.2. CONFIDENCE INTERVAL FOR THE MEAN WITH UNKNOWN
VARIANCE / 137 4.3.3. CONFIDENCE INTERVAL FOR VARIANCE / 137 4.3.4.
CONFIDENCE INTERVAL FOR THE DIFFERENCE BETWEEN TWO
MEANS, KNOWN VARIANCE / 138 4.3.5. CONFIDENCE INTERVAL FOR THE
DIFFERENCE BETWEEN TWO MEANS, UNKNOWN VARIANCES / 138 4.3.6. CONFIDENCE
INTERVAL FOR THE RATIO OF TWO
VARIANCES / 139
4.4. HYPOTHESIS TESTING / 140 4.4.1. TESTS ON MEANS WITH KNOWN VARIANCE
/ 141 4.4.2. TESTS ON MEANS WITH UNKNOWN VARIANCE / 142 4.4.3. TESTS ON
VARIANCE / 143
IMAGE 6
CONTENTS XI
SUMMARY / 145
PROBLEMS / 145 REFERENCE / 146
5 YIELD MODELING 147
OBJECTIVES / 147 INTRODUCTION / 147 5.1. DEFINITIONS OF YIELD COMPONENTS
/ 148 5.2. FUNCTIONAL YIELD MODELS / 149
5.2.1. POISSON MODEL / 151 5.2.2. MURPHY'S YIELD INTEGRAL / 152 5.2.3.
NEGATIVE BINOMIAL MODEL / 154 5.3. FUNCTIONAL YIELD MODEL COMPONENTS /
156
5.3.1. DEFECT DENSITY / 156 5.3.2. CRITICAL AREA / 157 5.3.3. GLOBAL
YIELD LOSS / 158 5.4. PARAMETRIC YIELD / 159 5.5. YIELD SIMULATION / 161
5.5.1. FUNCTIONAL YIELD SIMULATION / 162
5.5.2. PARAMETRIC YIELD SIMULATION / 167 5.6. DESIGN CENTERING / 171
5.6.1. ACCEPTABILITY REGIONS / 172
5.6.2. PARAMETRIC YIELD OPTIMIZATION / 173 5.7. PROCESS INTRODUCTION AND
TIME-TO-YIELD / 174 SUMMARY / 176 PROBLEMS / 177 REFERENCES / 180
6 STATISTICAL PROCESS CONTROL 181
OBJECTIVES / 181 INTRODUCTION / 181 6.1. CONTROL CHART BASICS / 182 6.2.
PATTERNS IN CONTROL CHARTS / 184
6.3. CONTROL CHARTS FOR ATTRIBUTES / 186 6.3.1. CONTROL CHART FOR
FRACTION NONCONFORMING / 187 6.3.1.1. CHART DESIGN I 188 6.3.1.2.
VARIABLE SAMPLE SIZE I 189
6.3.1.3. OPERATING CHARACTERISTIC AND AVERAGE RUNLENGTH I 191 6.3.2.
CONTROL CHART FOR DEFECTS / 193 6.3.3. CONTROL CHART FOR DEFECT DENSITY
/ 193
IMAGE 7
XUE CONTENTS
6.4. CONTROL CHARTS FOR VARIABLES / 195
6.4.1. CONTROL CHARTS FOR X A N D FI / 195 6.4.1.1. RATIONAL SUBGROUPS I
199 6.4.1.2. OPERATING CHARACTERISTIC AND AVERAGE RUNLENGTH I 200 6.4.2.
CONTROL CHARTS FOR X AND S I 202 6.4.3. PROCESS CAPABILITY / 204 6.4.4.
MODIFIED AND ACCEPTANCE CHARTS / 206 6.4.5. CUSUM CHART / 208
6.4.5.1. TABULAR CUSUM CHART I 210 6.4.5.2. AVERAGE RUNLENGTH I 210
6.4.5.3. CUSUM FOR VARIANCE I 211 6.4.6. MOVING-AVERAGE CHARTS / 212
6.4.6.1. BASIC MOVING-AVERAGE CHART I 212 6.4.6.2. EXPONENTIALLY
WEIGHTED MOVING-AVERAGE
CHART I 213
6.5. MULTIVARIATE CONTROL / 215 6.5.1. CONTROL OF MEANS / 217 6.5.2.
CONTROL OF VARIABILITY / 220
6.6. SPC WITH CORRELATED PROCESS DATA / 221 6.6.1. TIME-SERIES MODELING
/ 221 6.6.2. MODEL-BASED SPC / 223 SUMMARY / 224 PROBLEMS / 224
REFERENCES / 227
7 STATISTICAL EXPERIMENTAL DESIGN 228
OBJECTIVES / 228 INTRODUCTION / 228 7.1. COMPARING DISTRIBUTIONS / 229
7.2. ANALYSIS OF VARIANCE / 232
7.2.1. SUMS OF SQUARES / 232 7.2.2. ANOVA TABLE / 234 7.2.2.1. GEOMETRIE
INTERPRETATION I 235 7.2.2.2. ANOVA DIAGNOSTICS I 237
7.2.3. RANDOMIZED BLOCK EXPERIMENTS / 240 7.2.3.1. MATHEMATICAL MODEL I
242 7.2.3.2. DIAGNOSTIC CHECKING I 243
IIA. TWO-WAY DESIGNS / 245 7.2.4.1. ANALYSIS I 245 7.2.4.2. DATA
TRANSFORMATION I 246
IMAGE 8
CONTENTS XUEI
7.3. FACTORIAL DESIGNS / 249
7.3.1. TWO-LEVEL FACTORIALS / 250 7.3.1.1. MAIN EFFECTS I 251 7.3.1.2.
INTERACTION EFFECTS I 251 7.3.1.3. STANDARD ERROR I 252 7.3.1.4.
BLOCKING I 254 7.3.2. FRACTIONAL FACTORIALS / 256
7.3.2.1. CONSTRUCTION OF FRACTIONAL FACTORIALS I 256 7.3.2.2. RESOLUTION
I 257 7.3.3. ANALYZING FACTORIALS / 257
7.3.3.1. THE YATES ALGORITHM I 258 7.3.3.2. NORMAL PROBABILITY PLOTS I
258 7.3.4. ADVANCED DESIGNS / 260 7.4. TAGUCHI METHOD / 262 7.4.1.
CATEGORIZING PROCESS VARIABLES / 263 7.4.2. SIGNAL-TO-NOISE RATIO / 264
7.4.3. ORTHOGONAL ARRAYS / 264 7.4.4. DATA ANALYSIS / 266 SUMMARY / 269
PROBLEMS / 269 REFERENCES / 271
8 PROCESS MODELING 272
OBJECTIVES / 272 INTRODUCTION / 272 8.1. REGRESSION MODELING / 273
8.1.1. SINGLE-PARAMETER MODEL / 274
8.1.1.1. RESIDUAIS I 275 8.1.1.2. STANDARD ERROR I 276 8.1.1.3. ANALYSIS
OF VARIANCE I 276 8.1.2. TWO-PARAMETER MODEL / 277
8.1.2.1. ANALYSIS OF VARIANCE I 279 8.1.2.2. PRECISION OF ESTIMATES I
279 8.1.2.3. LINEAR MODEL WITH NONZERO INTERCEPT I 280
8.1.3. MULTIVARIATE MODELS / 283 8.1.4. NONLINEAR REGRESSION / 285
8.1.5. REGRESSION CHART / 287 8.2. RESPONSE SURFACE METHODS / 289 8.2.1.
HYPOTHETICAL YIELD EXAMPLE / 289
IMAGE 9
XJV CONTENTS
8.2.1.1. DIAGNOSTIC CHECKING I 292
8.2.1.2. AUGMENTED MODEL I 293 8.2.2. PLASMA ETCHING EXAMPLE / 294
8.2.2.1. EXPERIMENTAL DESIGN I 295 8.2.2.2. EXPERIMENTAL TECHNIQUE I 297
8.2.2.3. ANALYSIS I 298
8.3. EVOLUTIONARY OPERATION / 301 8.4. PRINCIPAL-COMPONENT ANALYSIS /
306 8.5. INTELLIGENT MODELING TECHNIQUES / 310 8.5.1. NEURAL NETWORKS /
310
8.5.2. FUZZY LOGIC / 314 8.6. PROCESS OPTIMIZATION / 318 8.6.1. POWELL'S
ALGORITHM / 318 8.6.2. SIMPLEX METHOD / 320
8.6.3. GENETIC ALGORITHMS / 323 8.6.4. HYBRID METHODS / 325 8.6.5. PECVD
OPTIMIZATION: A CASE STUDY / 326 SUMMARY / 327 PROBLEMS / 328 REFERENCES
/ 331
9 ADVANCED PROCESS CONTROL 333
OBJECTIVES / 333 INTRODUCTION / 333 9.1. RUN-BY-RUN CONTROL WITH
CONSTANT TERM ADAPTATION / 335 9.1.1. SINGLE-VARIABLE METHODS / 335
9.1.1.1. GRADUAL DRIFT I 337 9.1.1.2. ABRUPT SHIFTS I 339 9. 1.2.
MULTIVARIATE TECHNIQUES / 343 9.1.2.1. EXPONENTIALLY WEIGHTED
MOVING-AVERAGE
(EWMA) GRADUAL MODEL I 343 9.1.2.2. PREDICTOR-CORRECTOR CONTROL I 343
9.1.3. PRACTICAL CONSIDERATIONS / 346 9.1.3.1. INPUT BOUNDS I 346
9.1.3.2. INPUT RESOLUTION I 348 9.1.3.3. INPUT WEIGHTS I 348 9.1.3.4.
OUTPUT WEIGHTS I 350 9.2. MULTIVARIATE CONTROL WITH COMPLETE MODEL
ADAPTATION / 351 9.2.1. DETECTION OF PROCESS DISTURBANCES VIA
MODEL-BASED SPC / 352
IMAGE 10
CONTENTS XV
9.2.1.1. MALFUNCTION ALARMS I 352
9.2.1.2. ALARMS FOR FEEDBACK CONTROL I 353 9.2.2. FUELL MODEL ADAPTATION
/ 354 9.2.3. AUTOMATED RECIPE GENERATION / 356 9.2.4. FEEDFORWARD
CONTROL / 358 9.3. SUPERVISORY CONTROL / 359
9.3.1. SUPERVISORY CONTROL USING COMPLETE MODEL ADAPTATION / 359
9.3.1.1. ACCEPTABLE INPUT RANGES OF PHOTOLITHOGRAPHIC MACHINES I 361
9.3.1.2. EXPERIMENTAL EXAMPLES I 363 9.3.2. INTELLIGENT SUPERVISORY
CONTROL / 364 SUMMARY / 373 PROBLEMS / 373 REFERENCES / 378
10 PROCESS AND EQUIPMENT DIAGNOSIS 379
OBJECTIVES / 379 INTRODUCTION / 379 10.1. ALGORITHMIC METHODS / 381
10.1.1. HIPPOCRATES / 381
10.1.1.1. MEASUREMENT PLAN I 382 10.1.1.2. FAULT DIAGNOSIS I 383
10.1.1.3. EXAMPLE I 383 10.1.2. MERLIN / 384
10.1.2.1. KNOWLEDGE REPRESENTATION I 385 10.1.2.2. INFERENCE MECHANISM I
387 10.1.2.3. CASE STUDY I 390 10.2. EXPERT SYSTEMS / 391
10.2.1. PIES / 391 10.2.1.1. KNOWLEDGE BASE I 393 10.2.1.2. DIAGNOSTIC
REASONING I 394 10.2.1.3. EXAMPLES I 395 10.2.2. PEDX / 395
10.2.2.1. ARCHITECTURE I 396 10.2.2.2. RULE-BASED REASONING I 397
10.2.2.3. IMPLEMENTATION I 398 10.3. NEURAL NETWORK APPROACHES / 398
10.3.1. PROCESS CONTROL NEURAL NETWORK / 398 10.3.2. PATTERN RECOGNITION
IN CVD DIAGNOSIS / 400 10.4. HYBRID METHODS / 402
IMAGE 11
XVI CONTENTS
10.4.1. TIME-SERIES DIAGNOSIS / 402
10.4.2. HYBRID EXPERT SYSTEM / 403 10.4.2.1. DEMPSTER-SHAFER THEORY I
406 10.4.2.2. MAINTENANCE DIAGNOSIS I 408 10.4.2.3. ONLINE DIAGNOSIS I
409 10.4.2.4. INLINE DIAGNOSIS I 413 SUMMARY / 414 PROBLEMS / 414
REFERENCES / 415
APPENDIX A: SOME PROPERTIES OF THE ERROR FUNCTION 417
APPENDIX B: CUMULATIVE STANDARD NORMAL DISTRIBUTION 420
APPENDIX C: PERCENTAGE POINTS OF THE X 2 DISTRIBUTION 423
APPENDIX D: PERCENTAGE POINTS OF THE T DISTRIBUTION 425
APPENDIX E: PERCENTAGE POINTS OF THE F DISTRIBUTION 427
APPENDIX F: FACTORS FOR CONSTRUCTING VARIABLES CONTROL CHARTS 438
INDEX 441 |
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| id | DE-604.BV021605425 |
| illustrated | Not Illustrated |
| index_date | 2024-07-02T14:49:04Z |
| indexdate | 2024-07-09T20:39:44Z |
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| isbn | 0471784060 |
| language | English |
| lccn | 2005028448 |
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| spelling | May, Gary S. Verfasser aut Fundamentals of semiconductor manufacturing and process control Gary S. May, Costas J. Spanos Hoboken, NJ Wiley 2006 428 S. txt rdacontent n rdamedia nc rdacarrier "Wiley-Interscience." Includes bibliographical references and index Semiconductors Design and construction Integrated circuits Design and construction Process control Statistical methods Halbleiterbauelement (DE-588)4113826-0 gnd rswk-swf Halbleitertechnologie (DE-588)4158814-9 gnd rswk-swf Halbleitertechnologie (DE-588)4158814-9 s Halbleiterbauelement (DE-588)4113826-0 s DE-604 Spanos, Costas J. Sonstige (DE-588)14371371X oth http://www.loc.gov/catdir/toc/ecip061/2005028448.html Table of contents http://www.gbv.de/dms/ilmenau/toc/50062285X.PDF kostenfrei Inhaltsverzeichnis http://www.loc.gov/catdir/enhancements/fy0660/2005028448-d.html Publisher description kostenfrei http://www.loc.gov/catdir/enhancements/fy0740/2005028448-b.html Contributor biographical information kostenfrei GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014820715&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | May, Gary S. Fundamentals of semiconductor manufacturing and process control Semiconductors Design and construction Integrated circuits Design and construction Process control Statistical methods Halbleiterbauelement (DE-588)4113826-0 gnd Halbleitertechnologie (DE-588)4158814-9 gnd |
| subject_GND | (DE-588)4113826-0 (DE-588)4158814-9 |
| title | Fundamentals of semiconductor manufacturing and process control |
| title_auth | Fundamentals of semiconductor manufacturing and process control |
| title_exact_search | Fundamentals of semiconductor manufacturing and process control |
| title_exact_search_txtP | Fundamentals of semiconductor manufacturing and process control |
| title_full | Fundamentals of semiconductor manufacturing and process control Gary S. May, Costas J. Spanos |
| title_fullStr | Fundamentals of semiconductor manufacturing and process control Gary S. May, Costas J. Spanos |
| title_full_unstemmed | Fundamentals of semiconductor manufacturing and process control Gary S. May, Costas J. Spanos |
| title_short | Fundamentals of semiconductor manufacturing and process control |
| title_sort | fundamentals of semiconductor manufacturing and process control |
| topic | Semiconductors Design and construction Integrated circuits Design and construction Process control Statistical methods Halbleiterbauelement (DE-588)4113826-0 gnd Halbleitertechnologie (DE-588)4158814-9 gnd |
| topic_facet | Semiconductors Design and construction Integrated circuits Design and construction Process control Statistical methods Halbleiterbauelement Halbleitertechnologie |
| url | http://www.loc.gov/catdir/toc/ecip061/2005028448.html http://www.gbv.de/dms/ilmenau/toc/50062285X.PDF http://www.loc.gov/catdir/enhancements/fy0660/2005028448-d.html http://www.loc.gov/catdir/enhancements/fy0740/2005028448-b.html http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014820715&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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