Proceedings of the International Conference on Materials for Advanced Technologies (ICMAT 2005) Symposium H: Silicon Microelectronics: Processing to Packaging: Singapore, July 3 - 8, 2005
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Bibliographic Details
Corporate Authors: Symposium Silicon Microelectronics: Processing to Packaging Singapur (Author), International Conference on Materials for Advanced Technologies (Author)
Format: Conference Proceeding Book
Language:English
Published: Amsterdam [u.a.] Elsevier 2006
Series:Thin solid films 504,1/2
Subjects:
Item Description:Einzelaufnahme eines Zeitschr.-Heftes
Physical Description:X, 455 S. Ill., graph. Darst.

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