Foundations of MEMS:
Gespeichert in:
| 1. Verfasser: | |
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| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Upper Saddle River, NJ
Pearson Prentice Hall
2006
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| Schriftenreihe: | Illinois ECE series
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| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis Inhaltsverzeichnis |
| Beschreibung: | Includes index. |
| Beschreibung: | XXII, 530 S. zahlr. Ill. |
| ISBN: | 0131472860 |
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| adam_text | FOUNDATIONS OF MEMS CHANG LIU ELECTRICAL AND COMPUTER ENGINEERING
DEPARTMENT UNIVERSITY OF ILLINOIS AT URBANA-CHAMPAIGN PEARSON PRENTICE
HALL UPPER SADDLE RIVER, NJ 07458 CONTENTS PREFACE XIII A NOTE TO
INSTRUCTORS XVII ABOUT THE AUTHOR XIX NOTATIONAL CONVENTIONS XXI CHAPTER
1 INTRODUCTION 1 1.0 PREVIEW 1 1.1 THE HISTORY OF MEMS DEVELOPMENT 1 1.2
THE INTRINSIC CHARACTERISTICS OF MEMS 11 1.2.1 MINIATURIZATION 12 1.2.2
MICROELECTRONICS INTEGRATION 14 1.2.3 MASS FABRICATION WITH PRECISION 14
1.3 DEVICES: SENSORS AND ACTUATORS 14 1.3.1 ENERGY DOMAINS AND
TRANSDUCERS 14 1.3.2 SENSORS 17 1.3.3 ACTUATORS 19 SUMMARY 20 PROBLEMS
21 REFERENCES 23 CHAPTER 2 INTRODUCTION TO MICROFABRICATION 28 2.0
PREVIEW 28 2.1 OVERVIEW OF MICROFABRICATION 28 2.2 THE MICROELECTRONICS
FABRICATION PROCESS 30 2.3 SILICON-BASED MEMS PROCESSES 33 2.4 NEW
MATERIALS AND FABRICATION PROCESSES 39 2.5 POINTS OF CONSIDERATION FOR
PROCESSING 40 SUMMARY 43 PROBLEMS 43 REFERENCES 44 CHAPTER 3 REVIEW OF
ESSENTIAL ELECTRICAL AND MECHANICAL CONCEPTS 48 3.0 . PREVIEW 48 3.1
CONDUCTIVITY OF SEMICONDUCTORS 49 3.1.1 SEMICONDUCTOR MATERIALS 49 3.1.2
CALCULATION OF CHARGE CARRIER CONCENTRATION 50 3.1.3 CONDUCTIVITY AND
RESISTIVITY 54 VI CONTENTS 3.2 CRYSTAL PLANES AND ORIENTATION 58 3.3
STRESS AND STRAIN 61 3.3.1 INTERNAL FORCE ANALYSIS: NEWTON S LAWS OF
MOTION 61 3.3.2 DEFINITIONS OF STRESS AND STRAIN 63 3.3.3 GENERAL SCALAR
RELATION BETWEEN TENSILE STRESS AND STRAIN 66 3.3.4 MECHANICAL
PROPERTIES OF SILICON AND RELATED THIN FILMS 68 3.3.5 GENERAL
STRESS-STRAIN RELATIONS 70 3.4 FLEXURAL BEAM BENDING ANALYSIS UNDER
SIMPLE LOADING CONDITIONS 73 3.4.1 TYPES OF BEAMS 73 3.4.2 LONGITUDINAL
STRAIN UNDER PURE BENDING 75 3.4.3 DEFLECTION OF BEAMS 77 3.4.4 FINDING
THE SPRING CONSTANTS 78 3.5 TORSIONAL DEFLECTIONS 83 3.6 INTRINSIC
STRESS 86 3.7 RESONANT FREQUENCY AND QUALITY FACTOR 91 3.8 ACTIVE TUNING
OF THE SPRING CONSTANT AND RESONANT FREQUENCY 93 3.9 A LIST OF SUGGESTED
COURSES AND BOOKS 94 SUMMARY 95 PROBLEMS 95 REFERENCES 99 CHAPTER 4
ELECTROSTATIC SENSING AND ACTUATION 103 4.0 PREVIEW 103 4.1 INTRODUCTION
TO ELECTROSTATIC SENSORS AND ACTUATORS 103 4.2 PARALLEL-PLATE CAPACITORS
105 4.2.1 CAPACITANCE OF PARALLEL PLATES 105 4.2.2 EQUILIBRIUM POSITION
OF ELECTROSTATIC ACTUATOR UNDER BIAS 108 4.2.3 PULL-IN EFFECT OF
PARALLEL-PLATE ACTUATORS 110 4.3 APPLICATIONS OF PARALLEL-PLATE
CAPACITORS 116 4.3.1 INERTIA SENSOR 116 4.3.2 PRESSURE SENSOR 122 4.3.3
FLOW SENSOR 127 4.3.4 TACTILE SENSOR 130 4.3.5 PARALLEL-PLATE ACTUATORS
131 4.4 INTERDIGITATED FINGER CAPACITORS 133 4.5 APPLICATIONS OF
COMB-DRIVE DEVICES 139 4.5.1 INERTIA SENSORS 139 4.5.2 ACTUATORS 143
SUMMARY 145 PROBLEMS 145 REFERENCES 149 CONTENTS VII CHAPTER 5 THERMAL
SENSING AND ACTUATION 5.0 PREVIEW 153 5.1 INTRODUCTION 153 5.1.1 THERMAL
SENSORS 153 5.1.2 THERMAL ACTUATORS 154 5.1.3 FUNDAMENTALS OF THERMAL
TRANSFER 154 5.2 SENSORS AND ACTUATORS BASED ON THERMAL EXPANSION 159
5.2.1 THERMAL BIMORPH PRINCIPLE 161 5.2.2 THERMAL ACTUATORS WITH A
SINGLE MATERIAL 168 5.3 THERMAL COUPLES 170 5.4 THERMAL RESISTORS 173
5.5 APPLICATIONS 175 5.5.1 INERTIA SENSORS 175 5.5.2 FLOW SENSORS 178
5.5.3 INFRARED SENSORS 191 5.5.4 OTHER SENSORS 194 SUMMARY 199 PROBLEMS
200 REFERENCES 204 CHAPTER 6 PIEZORESISTIVE SENSORS 6.0 PREVIEW 207
ORIGIN AND EXPRESSION OF PIEZORESISTIVITY 207 153 207 6.1 6.2 6.3 6.4
PIEZORESISTIVE SENSOR MATERIALS 211 6.2.1 METAL STRAIN GAUGES 211 6.2.2
SINGLE-CRYSTAL SILICON 211 6.2.3 POLYCRYSTALLINE SILICON 215 STRESS
ANALYSIS OF MECHANICAL ELEMENTS 215 6.3.1 STRESS IN FLEXURAL CANTILEVERS
216 6.3.2 STRESS IN THE MEMBRANE 221 APPLICATIONS OF PIEZORESISTIVE
SENSORS 223 6.4.1 INERTIA SENSORS 224 6.4.2 PRESSURE SENSORS 229 6.4.3
TACTILE SENSORS 232 6.4.4 FLOW SENSORS 235 SUMMARY 239 PROBLEMS 240
REFERENCES 243 VIII CONTENTS CHAPTER 7 PIEZOELECTRIC SENSING AND
ACTUATION 245 7.0 PREVIEW 245 7.1 INTRODUCTION 245 7.1.1 BACKGROUND 245
7.1.2 MATHEMATICAL DESCRIPTION OF PIEZOELECTRIC EFFECTS 247 7.1.3
CANTILEVER PIEZOELECTRIC ACTUATOR MODEL 249 7.2 PROPERTIES OF
PIEZOELECTRIC MATERIALS 252 7.2.1 QUARTZ 253 7.2.2 PZT 254 7.2.3 PVDF
256 7.2.4 ZNO 256 7.2.5 OTHER MATERIALS 261 7.3 APPLICATIONS 262 7.3.1
INERTIA SENSORS 262 7.3.2 ACOUSTIC SENSORS 265 7.3.3 TACTILE SENSORS 268
7.3.4 FLOW SENSORS 269 7.3.5 SURFACE ELASTIC WAVES 271 SUMMARY 273
PROBLEMS 273 REFERENCES 276 CHAPTER 8 MAGNETIC ACTUATION 279 8.0 PREVIEW
279 8.1 ESSENTIAL CONCEPTS AND PRINCIPLES 279 8.1.1 MAGNETIZATION AND
NOMENCLATURE 279 8.1.3 SELECTED PRINCIPLES OF MICROMAGNETIC ACTUATORS
282 8.2 FABRICATION OF MICROMAGNETIC COMPONENTS 287 8.2.1 DEPOSITION OF
MAGNETIC MATERIALS 287 8.2.2 DESIGN AND FABRICATION OF MAGNETIC COIL 288
8.3 CASE STUDIES OF MEMS MAGNETIC ACTUATORS 292 SUMMARY 303 PROBLEMS 304
REFERENCES 305 CHAPTER 9 SUMMARY OF SENSING AND ACTUATION 307 9.0
PREVIEW 307 9.1 COMPARISON OF MAJOR SENSING AND ACTUATION METHODS 308
9.2 TUNNELING SENSING 309 9.3 OPTICAL SENSING 311 9.3.1 SENSING WITH
WAVEGUIDES 311 9.3.2 SENSING WITH FREE-SPACE LIGHT BEAMS 312 9.3.3
POSITION SENSING WITH OPTICAL INTERFEROMETRY 313 CONTENTS IX 9.4
FIELD-EFFECT TRANSISTORS 317 9.5 RADIO FREQUENCY RESONANCE SENSING
SUMMARY 321 PROBLEMS 322 REFERENCES 323 320 CHAPTER 10 BULK
MICROMACHINING AND SILICON ANISOTROPIC ETCHING 10.0 PREVIEW 326 10.1
INTRODUCTION 326 10.2 ANISOTROPIC WET ETCHING 328 10.2.1 INTRODUCTION
328 10.2.2 RULES OF ANISOTROPIC ETCHING*SIMPLEST CASE 330 10.2.3 RULES
OF ANISOTROPIC ETCHING*COMPLEX STRUCTURES 335 10.2.4 INTERACTION OF
ETCHING PROFILES FROM ISOLATED PATTERNS 345 10.2.5 SUMMARY OF DESIGN
METHODOLOGY 345 10.2.6 CHEMICALS FOR WET ANISOTROPIC ETCHING 346 10.3
DRY ETCHING OF SILICON*PLASMA ETCHING 349 10.4 DEEP REACTIVE ION ETCHING
(DRIE) 352 10.5 ISOTROPIC WET ETCHING 353 10.6 GAS-PHASE ETCHANTS 353
10.7 NATIVE OXIDE 354 10.8 WAFER BONDING 354 10.9 CASE STUDIES 356
10.9.1 SUSPENDED BEAMS AND PLATES 356 10.9.2 SUSPENDED MEMBRANES 357
SUMMARY 360 PROBLEMS 361 REFERENCES 368 326 CHAPTER 11 SURFACE
MICROMACHINING 371 11.0 PREVIEW 371 11.1 BASIC SURFACE MICROMACHINING
PROCESSES 371 11.1.1 SACRIFICIAL ETCHING PROCESS 371 11.1.2 MICROMOTOR
FABRICATION PROCESS*A FIRST PASS 372 11.1.3 MICROMOTOR FABRICATION
PROCESS*A SECOND PASS 374 11.1.4 MICROMOTOR FABRICATION PROCESS*THIRD
PASS 375 11.2 STRUCTURAL AND SACRIFICIAL MATERIALS 376 11.2.1 MATERIAL
SELECTION CRITERIA 376 11.2.2 THIN FILMS BY LOW-PRESSURE CHEMICAL VAPOR
DEPOSITION 11.2.3 OTHER SURFACE MICROMACHINING MATERIALS AND PROCESSES
11.3 ACCELERATION OF SACRIFICIAL ETCH 381 11.4 STICTION AND ANTISTICTION
METHODS 383 378 380 CONTENTS 11.5 ASSEMBLY OF 3D MEMS 385 11.6 FOUNDRY
PROCESS 389 SUMMARY 390 PROBLEMS 391 REFERENCES 394 CHAPTER 12 POLYMER
MEMS 397 12.0 PREVIEW 397 12.1 INTRODUCTION 397 12.2 POLYMERS IN MEMS
399 12.2.1 POLYIMIDE 399 12.2.2 SU-8 401 12.2.3 LIQUID CRYSTAL POLYMER
(LCP) 402 12.2.4 PDMS 403 12.2.5 PMMA 405 12.2.6 PARYLENE 405 12.2.7
FLUOROCARBON 406 12.2.8 OTHER POLYMERS 406 12.3 REPRESENTATIVE
APPLICATIONS 407 12.3.1 ACCELERATION SENSORS 407 12.3.2 PRESSURE SENSORS
409 12.3.3 FLOW SENSORS 413 12.3.4 TACTILE SENSORS 415 SUMMARY 417
PROBLEMS 418 REFERENCES 419 CHAPTER 13 MICROFLUIDICS APPLICATIONS 422
13.0 PREVIEW 422 13.1 MOTIVATION FOR MICROFLUIDICS 422 13.2 ESSENTIAL
BIOLOGY CONCEPTS 423 13.3 BASIC FLUID MECHANICS CONCEPTS 426 13.3.1 THE
REYNOLDS NUMBER AND VISCOSITY 426 13.3.2 METHODS FOR FLUID MOVEMENT IN
CHANNELS 427 13.3.3 PRESSURE DRIVEN FLOW 428 13.3.4 ELECTROKINETIC FLOW
430 13.3.5 ELECTROPHORESIS AND DIELECTROPHORESIS 431 13.4 DESIGN AND
FABRICATION OF SELECTIVE COMPONENTS 434 13.4.1 CHANNELS 434 13.4.2
VALVES 445 SUMMARY 448 PROBLEMS 448 REFERENCES 450 CONTENTS XI CHAPTER
14 INSTRUMENTS FOR SCANNING PROBE MICROSCOPY 455 14.0 PREVIEW 455 14.1
INTRODUCTION 455 14.1.1 SPM TECHNOLOGIES 455 14.1.2 THE VERSATILE SPM
FAMILY 457 14.1.3 EXTENSION OF SPM TECHNOLOGIES 459 14.2 GENERAL
FABRICATION METHODS FOR TIPS 460 14.3 CANTILEVERS WITH INTEGRATED TIPS
462 14.3.1 GENERAL DESIGN CONSIDERATIONS 462 14.3.2 GENERAL FABRICATION
STRATEGIES 463 14.3.3 ALTERNATIVE TECHNIQUES 466 14.4 SPM PROBES WITH
SENSORS AND ACTUATORS 470 14.4.1 SPM PROBES WITH SENSORS 471 14.4.2 SPM
PROBES WITH ACTUATORS 476 SUMMARY 481 PROBLEMS 481 REFERENCES 482
CHAPTER 15 OPTICAL MEMS 486 15.0 PREVIEW 486 15.1 PASSIVE MEMS OPTICAL
COMPONENTS 487 15.1.1 LENSES 488 15.1.2 MIRRORS 492 15.2 ACTUATORS FOR
ACTIVE OPTICAL MEMS 495 15.2.1 ACTUATORS FOR SMALL OUT-OF-PLANE
TRANSLATION 496 15.2.2 ACTUATORS FOR LARGE IN-PLANE TRANSLATION MOTION
498 15.2.3 ACTUATORS FOR OUT-OF-PLANE ROTATION 499 SUMMARY 502 PROBLEMS
502 REFERENCES 505 CHAPTER 16 MEMS TECHNOLOGY MANAGEMENT 509 16.0
PREVIEW 509 16.1 R&D STRATEGIES 509 PROBLEMS 515 REFERENCES 516 APPENDIX
A MATERIAL PROPERTIES 517 APPENDIX B FREQUENTLY USED FORMULAS FOR BEAMS
AND MEMBRANES 520 INDEX 522
|
| adam_txt |
FOUNDATIONS OF MEMS CHANG LIU ELECTRICAL AND COMPUTER ENGINEERING
DEPARTMENT UNIVERSITY OF ILLINOIS AT URBANA-CHAMPAIGN PEARSON PRENTICE
HALL UPPER SADDLE RIVER, NJ 07458 CONTENTS PREFACE XIII A NOTE TO
INSTRUCTORS XVII ABOUT THE AUTHOR XIX NOTATIONAL CONVENTIONS XXI CHAPTER
1 INTRODUCTION 1 1.0 PREVIEW 1 1.1 THE HISTORY OF MEMS DEVELOPMENT 1 1.2
THE INTRINSIC CHARACTERISTICS OF MEMS 11 1.2.1 MINIATURIZATION 12 1.2.2
MICROELECTRONICS INTEGRATION 14 1.2.3 MASS FABRICATION WITH PRECISION 14
1.3 DEVICES: SENSORS AND ACTUATORS 14 1.3.1 ENERGY DOMAINS AND
TRANSDUCERS 14 1.3.2 SENSORS 17 1.3.3 ACTUATORS 19 SUMMARY 20 PROBLEMS
21 REFERENCES 23 CHAPTER 2 INTRODUCTION TO MICROFABRICATION 28 2.0
PREVIEW 28 2.1 OVERVIEW OF MICROFABRICATION 28 2.2 THE MICROELECTRONICS
FABRICATION PROCESS 30 2.3 SILICON-BASED MEMS PROCESSES 33 2.4 NEW
MATERIALS AND FABRICATION PROCESSES 39 2.5 POINTS OF CONSIDERATION FOR
PROCESSING 40 SUMMARY 43 PROBLEMS 43 REFERENCES 44 CHAPTER 3 REVIEW OF
ESSENTIAL ELECTRICAL AND MECHANICAL CONCEPTS 48 3.0 . PREVIEW 48 3.1
CONDUCTIVITY OF SEMICONDUCTORS 49 3.1.1 SEMICONDUCTOR MATERIALS 49 3.1.2
CALCULATION OF CHARGE CARRIER CONCENTRATION 50 3.1.3 CONDUCTIVITY AND
RESISTIVITY 54 VI CONTENTS 3.2 CRYSTAL PLANES AND ORIENTATION 58 3.3
STRESS AND STRAIN 61 3.3.1 INTERNAL FORCE ANALYSIS: NEWTON'S LAWS OF
MOTION 61 3.3.2 DEFINITIONS OF STRESS AND STRAIN 63 3.3.3 GENERAL SCALAR
RELATION BETWEEN TENSILE STRESS AND STRAIN 66 3.3.4 MECHANICAL
PROPERTIES OF SILICON AND RELATED THIN FILMS 68 3.3.5 GENERAL
STRESS-STRAIN RELATIONS 70 3.4 FLEXURAL BEAM BENDING ANALYSIS UNDER
SIMPLE LOADING CONDITIONS 73 3.4.1 TYPES OF BEAMS 73 3.4.2 LONGITUDINAL
STRAIN UNDER PURE BENDING 75 3.4.3 DEFLECTION OF BEAMS 77 3.4.4 FINDING
THE SPRING CONSTANTS 78 3.5 TORSIONAL DEFLECTIONS 83 3.6 INTRINSIC
STRESS 86 3.7 RESONANT FREQUENCY AND QUALITY FACTOR 91 3.8 ACTIVE TUNING
OF THE SPRING CONSTANT AND RESONANT FREQUENCY 93 3.9 A LIST OF SUGGESTED
COURSES AND BOOKS 94 SUMMARY 95 PROBLEMS 95 REFERENCES 99 CHAPTER 4
ELECTROSTATIC SENSING AND ACTUATION 103 4.0 PREVIEW 103 4.1 INTRODUCTION
TO ELECTROSTATIC SENSORS AND ACTUATORS 103 4.2 PARALLEL-PLATE CAPACITORS
105 4.2.1 CAPACITANCE OF PARALLEL PLATES 105 4.2.2 EQUILIBRIUM POSITION
OF ELECTROSTATIC ACTUATOR UNDER BIAS 108 4.2.3 PULL-IN EFFECT OF
PARALLEL-PLATE ACTUATORS 110 4.3 APPLICATIONS OF PARALLEL-PLATE
CAPACITORS 116 4.3.1 INERTIA SENSOR 116 4.3.2 PRESSURE SENSOR 122 4.3.3
FLOW SENSOR 127 4.3.4 TACTILE SENSOR 130 4.3.5 PARALLEL-PLATE ACTUATORS
131 4.4 INTERDIGITATED FINGER CAPACITORS 133 4.5 APPLICATIONS OF
COMB-DRIVE DEVICES 139 4.5.1 INERTIA SENSORS 139 4.5.2 ACTUATORS 143
SUMMARY 145 PROBLEMS 145 REFERENCES 149 CONTENTS VII CHAPTER 5 THERMAL
SENSING AND ACTUATION 5.0 PREVIEW 153 5.1 INTRODUCTION 153 5.1.1 THERMAL
SENSORS 153 5.1.2 THERMAL ACTUATORS 154 5.1.3 FUNDAMENTALS OF THERMAL
TRANSFER 154 5.2 SENSORS AND ACTUATORS BASED ON THERMAL EXPANSION 159
5.2.1 THERMAL BIMORPH PRINCIPLE 161 5.2.2 THERMAL ACTUATORS WITH A
SINGLE MATERIAL 168 5.3 THERMAL COUPLES 170 5.4 THERMAL RESISTORS 173
5.5 APPLICATIONS 175 5.5.1 INERTIA SENSORS 175 5.5.2 FLOW SENSORS 178
5.5.3 INFRARED SENSORS 191 5.5.4 OTHER SENSORS 194 SUMMARY 199 PROBLEMS
200 REFERENCES 204 CHAPTER 6 PIEZORESISTIVE SENSORS 6.0 PREVIEW 207
ORIGIN AND EXPRESSION OF PIEZORESISTIVITY 207 153 207 6.1 6.2 6.3 6.4
PIEZORESISTIVE SENSOR MATERIALS 211 6.2.1 METAL STRAIN GAUGES 211 6.2.2
SINGLE-CRYSTAL SILICON 211 6.2.3 POLYCRYSTALLINE SILICON 215 STRESS
ANALYSIS OF MECHANICAL ELEMENTS 215 6.3.1 STRESS IN FLEXURAL CANTILEVERS
216 6.3.2 STRESS IN THE MEMBRANE 221 APPLICATIONS OF PIEZORESISTIVE
SENSORS 223 6.4.1 INERTIA SENSORS 224 6.4.2 PRESSURE SENSORS 229 6.4.3
TACTILE SENSORS 232 6.4.4 FLOW SENSORS 235 SUMMARY 239 PROBLEMS 240
REFERENCES 243 VIII CONTENTS CHAPTER 7 PIEZOELECTRIC SENSING AND
ACTUATION 245 7.0 PREVIEW 245 7.1 INTRODUCTION 245 7.1.1 BACKGROUND 245
7.1.2 MATHEMATICAL DESCRIPTION OF PIEZOELECTRIC EFFECTS 247 7.1.3
CANTILEVER PIEZOELECTRIC ACTUATOR MODEL 249 7.2 PROPERTIES OF
PIEZOELECTRIC MATERIALS 252 7.2.1 QUARTZ 253 7.2.2 PZT 254 7.2.3 PVDF
256 7.2.4 ZNO 256 7.2.5 OTHER MATERIALS 261 7.3 APPLICATIONS 262 7.3.1
INERTIA SENSORS 262 7.3.2 ACOUSTIC SENSORS 265 7.3.3 TACTILE SENSORS 268
7.3.4 FLOW SENSORS 269 7.3.5 SURFACE ELASTIC WAVES 271 SUMMARY 273
PROBLEMS 273 REFERENCES 276 CHAPTER 8 MAGNETIC ACTUATION 279 8.0 PREVIEW
279 8.1 ESSENTIAL CONCEPTS AND PRINCIPLES 279 8.1.1 MAGNETIZATION AND
NOMENCLATURE 279 8.1.3 SELECTED PRINCIPLES OF MICROMAGNETIC ACTUATORS
282 8.2 FABRICATION OF MICROMAGNETIC COMPONENTS 287 8.2.1 DEPOSITION OF
MAGNETIC MATERIALS 287 8.2.2 DESIGN AND FABRICATION OF MAGNETIC COIL 288
8.3 CASE STUDIES OF MEMS MAGNETIC ACTUATORS 292 SUMMARY 303 PROBLEMS 304
REFERENCES 305 CHAPTER 9 SUMMARY OF SENSING AND ACTUATION 307 9.0
PREVIEW 307 9.1 COMPARISON OF MAJOR SENSING AND ACTUATION METHODS 308
9.2 TUNNELING SENSING 309 9.3 OPTICAL SENSING 311 9.3.1 SENSING WITH
WAVEGUIDES 311 9.3.2 SENSING WITH FREE-SPACE LIGHT BEAMS 312 9.3.3
POSITION SENSING WITH OPTICAL INTERFEROMETRY 313 CONTENTS IX 9.4
FIELD-EFFECT TRANSISTORS 317 9.5 RADIO FREQUENCY RESONANCE SENSING
SUMMARY 321 PROBLEMS 322 REFERENCES 323 320 CHAPTER 10 BULK
MICROMACHINING AND SILICON ANISOTROPIC ETCHING 10.0 PREVIEW 326 10.1
INTRODUCTION 326 10.2 ANISOTROPIC WET ETCHING 328 10.2.1 INTRODUCTION
328 10.2.2 RULES OF ANISOTROPIC ETCHING*SIMPLEST CASE 330 10.2.3 RULES
OF ANISOTROPIC ETCHING*COMPLEX STRUCTURES 335 10.2.4 INTERACTION OF
ETCHING PROFILES FROM ISOLATED PATTERNS 345 10.2.5 SUMMARY OF DESIGN
METHODOLOGY 345 10.2.6 CHEMICALS FOR WET ANISOTROPIC ETCHING 346 10.3
DRY ETCHING OF SILICON*PLASMA ETCHING 349 10.4 DEEP REACTIVE ION ETCHING
(DRIE) 352 10.5 ISOTROPIC WET ETCHING 353 10.6 GAS-PHASE ETCHANTS 353
10.7 NATIVE OXIDE 354 10.8 WAFER BONDING 354 10.9 CASE STUDIES 356
10.9.1 SUSPENDED BEAMS AND PLATES 356 10.9.2 SUSPENDED MEMBRANES 357
SUMMARY 360 PROBLEMS 361 REFERENCES 368 326 CHAPTER 11 SURFACE
MICROMACHINING 371 11.0 PREVIEW 371 11.1 BASIC SURFACE MICROMACHINING
PROCESSES 371 11.1.1 SACRIFICIAL ETCHING PROCESS 371 11.1.2 MICROMOTOR
FABRICATION PROCESS*A FIRST PASS 372 11.1.3 MICROMOTOR FABRICATION
PROCESS*A SECOND PASS 374 11.1.4 MICROMOTOR FABRICATION PROCESS*THIRD
PASS 375 11.2 STRUCTURAL AND SACRIFICIAL MATERIALS 376 11.2.1 MATERIAL
SELECTION CRITERIA 376 11.2.2 THIN FILMS BY LOW-PRESSURE CHEMICAL VAPOR
DEPOSITION 11.2.3 OTHER SURFACE MICROMACHINING MATERIALS AND PROCESSES
11.3 ACCELERATION OF SACRIFICIAL ETCH 381 11.4 STICTION AND ANTISTICTION
METHODS 383 378 380 CONTENTS 11.5 ASSEMBLY OF 3D MEMS 385 11.6 FOUNDRY
PROCESS 389 SUMMARY 390 PROBLEMS 391 REFERENCES 394 CHAPTER 12 POLYMER
MEMS 397 12.0 PREVIEW 397 ' 12.1 INTRODUCTION 397 12.2 POLYMERS IN MEMS
399 12.2.1 POLYIMIDE 399 12.2.2 SU-8 401 12.2.3 LIQUID CRYSTAL POLYMER
(LCP) 402 12.2.4 PDMS 403 12.2.5 PMMA 405 12.2.6 PARYLENE 405 12.2.7
FLUOROCARBON 406 12.2.8 OTHER POLYMERS 406 12.3 REPRESENTATIVE
APPLICATIONS 407 12.3.1 ACCELERATION SENSORS 407 12.3.2 PRESSURE SENSORS
409 12.3.3 FLOW SENSORS 413 12.3.4 TACTILE SENSORS 415 SUMMARY 417
PROBLEMS 418 REFERENCES 419 CHAPTER 13 MICROFLUIDICS APPLICATIONS 422
13.0 PREVIEW 422 13.1 MOTIVATION FOR MICROFLUIDICS 422 13.2 ESSENTIAL
BIOLOGY CONCEPTS 423 13.3 BASIC FLUID MECHANICS CONCEPTS 426 13.3.1 THE
REYNOLDS NUMBER AND VISCOSITY 426 13.3.2 METHODS FOR FLUID MOVEMENT IN
CHANNELS 427 13.3.3 PRESSURE DRIVEN FLOW 428 13.3.4 ELECTROKINETIC FLOW
430 13.3.5 ELECTROPHORESIS AND DIELECTROPHORESIS 431 13.4 DESIGN AND
FABRICATION OF SELECTIVE COMPONENTS 434 13.4.1 CHANNELS 434 13.4.2
VALVES 445 SUMMARY 448 PROBLEMS 448 REFERENCES 450 CONTENTS XI CHAPTER
14 INSTRUMENTS FOR SCANNING PROBE MICROSCOPY 455 14.0 PREVIEW 455 14.1
INTRODUCTION 455 14.1.1 SPM TECHNOLOGIES 455 14.1.2 THE VERSATILE SPM
FAMILY 457 14.1.3 EXTENSION OF SPM TECHNOLOGIES 459 14.2 GENERAL
FABRICATION METHODS FOR TIPS 460 14.3 CANTILEVERS WITH INTEGRATED TIPS
462 14.3.1 GENERAL DESIGN CONSIDERATIONS 462 14.3.2 GENERAL FABRICATION
STRATEGIES 463 14.3.3 ALTERNATIVE TECHNIQUES 466 14.4 SPM PROBES WITH
SENSORS AND ACTUATORS 470 14.4.1 SPM PROBES WITH SENSORS 471 14.4.2 SPM
PROBES WITH ACTUATORS 476 SUMMARY 481 PROBLEMS 481 REFERENCES 482
CHAPTER 15 OPTICAL MEMS 486 15.0 PREVIEW 486 15.1 PASSIVE MEMS OPTICAL
COMPONENTS 487 15.1.1 LENSES 488 15.1.2 MIRRORS 492 15.2 ACTUATORS FOR
ACTIVE OPTICAL MEMS 495 15.2.1 ACTUATORS FOR SMALL OUT-OF-PLANE
TRANSLATION 496 15.2.2 ACTUATORS FOR LARGE IN-PLANE TRANSLATION MOTION
498 15.2.3 ACTUATORS FOR OUT-OF-PLANE ROTATION 499 SUMMARY 502 PROBLEMS
502 REFERENCES 505 CHAPTER 16 MEMS TECHNOLOGY MANAGEMENT 509 16.0
PREVIEW 509 16.1 R&D STRATEGIES 509 PROBLEMS 515 REFERENCES 516 APPENDIX
A MATERIAL PROPERTIES 517 APPENDIX B FREQUENTLY USED FORMULAS FOR BEAMS
AND MEMBRANES 520 INDEX 522 |
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| author | Liu, Chang |
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| discipline | Technik Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Technik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| illustrated | Illustrated |
| index_date | 2024-07-02T14:31:16Z |
| indexdate | 2024-07-09T20:38:24Z |
| institution | BVB |
| isbn | 0131472860 |
| language | English |
| lccn | 2005048932 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-014766204 |
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| physical | XXII, 530 S. zahlr. Ill. |
| publishDate | 2006 |
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| publisher | Pearson Prentice Hall |
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| series2 | Illinois ECE series |
| spelling | Liu, Chang Verfasser aut Foundations of MEMS Chang Liu Upper Saddle River, NJ Pearson Prentice Hall 2006 XXII, 530 S. zahlr. Ill. txt rdacontent n rdamedia nc rdacarrier Illinois ECE series Includes index. Microelectromechanical systems MEMS (DE-588)4824724-8 gnd rswk-swf MEMS (DE-588)4824724-8 s DE-604 http://www.ulb.tu-darmstadt.de/tocs/175823928.pdf Inhaltsverzeichnis HEBIS Datenaustausch Darmstadt application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014766204&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Liu, Chang Foundations of MEMS Microelectromechanical systems MEMS (DE-588)4824724-8 gnd |
| subject_GND | (DE-588)4824724-8 |
| title | Foundations of MEMS |
| title_auth | Foundations of MEMS |
| title_exact_search | Foundations of MEMS |
| title_exact_search_txtP | Foundations of MEMS |
| title_full | Foundations of MEMS Chang Liu |
| title_fullStr | Foundations of MEMS Chang Liu |
| title_full_unstemmed | Foundations of MEMS Chang Liu |
| title_short | Foundations of MEMS |
| title_sort | foundations of mems |
| topic | Microelectromechanical systems MEMS (DE-588)4824724-8 gnd |
| topic_facet | Microelectromechanical systems MEMS |
| url | http://www.ulb.tu-darmstadt.de/tocs/175823928.pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014766204&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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