Modelling and optimization of broadband electrical interconnects and housings for optical communication systems:
Gespeichert in:
| 1. Verfasser: | |
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| Format: | Abschlussarbeit Buch |
| Sprache: | English |
| Veröffentlicht: |
2005
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| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | XXIV, 185 S. Ill., graph. Darst. |
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Datensatz im Suchindex
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| adam_text | MODELLING AND OPTIMIZATION OF BROADBAND ELECTRICAL INTERCONNECTS AND
HOUSINGS FOR OPTICAL COMMUNICATION SYSTEMS SUBMITTED TO THE FACULTY OF
ENGINEERING SCIENCES OF PRIEDRICH-ALEXANDER UNIVERSITY
ERLANGEN-NUREMBERG IN FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF
DOKTOR-INGENIEUR FROM MARTIN NISZNANSKY ERLANGEN 2005 ULB DARMSTADT
16323063 CONTENTS 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 THESIS OVERVIEW
3 2 BASICS OF OPTICAL FIBER COMMUNICATION SYSTEMS 9 2.1 ARCHITECTURE OF
OPTICAL 40GB/S COMMUNICATION SYSTEMS ... 9 2.2 MULTI-CHIP MODULES AND
ELECTRICAL INTERCONNECTS 11 2.3 SIGNALS IN OPTICAL COMMUNICATION SYSTEMS
12 2.3.1 MODULATION FORMATS 14 2.3.2 SPECTRAL PROPERTIES OF MODULATED
SIGNALS 15 3 MATERIALS AND ASSEMBLY TECHNOLOGIES 21 3.1 CERAMIC
SUBSTRATES AND INTERCONNECT TECHNOLOGIES 21 3.1.1 CLASSIC THIN-FILM
TECHNOLOGY 21 3.1.2 LTCC TECHNOLOGY 22 3.1.3 LTCC PROCESS 23 3.1.4
MANUFACTURING TOLERANCES AND TECHNOLOGICAL LIMITATIONS 26 3.2 SUBSTRATE
TO CHIP INTERCONNECTS 29 3.2.1 WIRE-BONDING 29 3.2.2 FLIP-CHIP
INTERCONNECTS 30 4 MODELLING OF HIGH SPEED INTERCONNECTS 33 4.1
FIELD-BASED MODELLING OF INTERCONNECTS 33 4.1.1 MODELLING TECHNIQUES IN
ELECTROMAGNETISM 33 4.1.2 HFSS IMPLEMENTATION OVERVIEW 34 4.1.3 FINITE
ELEMENT METHOD 35 4.1.4 ENTRY OF SIMULATION MODEL 38 4.1.5 SIMULATION
ACCURACY AND ADAPTIVE SOLUTION 40 4.1.6 EXTRACTION OF CIRCUIT PARAMETERS
41 4.2 DIFFERENTIAL STIMULUS AND COUPLED INTERCONNECTS 41 4.3 NODAL AND
MIXED-MODE S-PARAMETERS 43 VII 4.4 EQUIVALENT CIRCUIT MODELS 45 4.5
DIGITAL SIGNALS AND TIME DOMAIN ANALYSIS 46 4.5.1 EYE DIAGRAM AND
DIGITAL SIGNAL CHARACTERISTICS . . . . 47 4.5.2 CRITERIA FOR MINIMAL
SIGNAL DISTORTION 49 MICROWAVE MEASUREMENT TECHNIQUES ON INTERCONNECTS
51 5.1 ON NETWORK ANALYZER BASED MEASUREMENTS 51 5.1.1 ON-WAFER
MEASUREMENTS 52 5.1.2 CALIBRATION TECHNIQUES 54 5.2 CHARACTERIZATION OF
DIFFERENTIAL INTERCONNECTS 56 5.2.1 4-PORT NETWORK ANALYZER 57 5.2.2
S-PARAMETERS TRANSFORMATION 58 5.3 TIME DOMAIN MEASUREMENT TECHNIQUES 58
5.3.1 TIME DOMAIN REFLECTOMETRY 58 5.3.2 TIME DOMAIN GATING 60 5.4
TRANSMISSION LINE CHARACTERIZATION 61 MATERIAL CHARACTERIZATION FOR
MICROWAVE CHIP MODULES 65 6.1 DEFINITION OF MATERIAL PARAMETERS 65 6.1.1
DIELECTRIC MATERIALS 65 6.1.2 CONDUCTIVE MATERIALS 66 6.2
CHARACTERIZATION OF THIN CERAMIC SUBSTRATES 67 6.2.1 DISK RESONATOR
METHOD 67 6.2.2 MEASURED RESULTS ON LTCC SUBSTRATES 72 6.3
CHARACTERIZATION OF CONDUCTIVE MATERIALS 73 6.3.1 CAVITY RESONATOR
METHOD 73 6.3.2 MEASURED RESULTS ON LTCC CONDUCTOR SYSTEMS . . . . 76
6.4 UNDERFILL CHARACTERIZATION 78 6.4.1 TRANSMISSION/REFLECTION METHOD
79 6.4.2 MEASURED RESULTS ON UNDERFILL MATERIAL 80 TRANSMISSION LINES 83
7.1 THEORY OF TRANSMISSION LINES 83 7.1.1 FIELD BASED APPROACH 84 7.1.2
LUMPED-ELEMENT APPROACH 86 7.1.3 COUPLED TRANSMISSION LINES 88 7.2
PLANAR TRANSMISSION LINES FOR BROADBAND CHIP MODULES . . . 90 7.2.1
QUASI-TEM LINES AND QUASI-STATIC APPROACH 90 VIII 7.2.2 TRANSMISSION
LINES IN MICROWAVE MODULES 92 7.3 GROUNDED COPLANAR WAVEGUIDE 94 7.3.1
SIGNAL PROPAGATION ON GCPW 95 7.3.2 SPURIOUS MODES ON GCPW LINES 100 7.4
MEASUREMENT OF REALIZED TRANSMISSION LINES ON LTCC . . . . 105 7.4.1
INVESTIGATION OF TECHNOLOGICAL IMPERFECTIONS 105 7.4.2 MEASUREMENT OF
ELECTRICAL PERFORMANCE 108 8 MODULE AND SUBSTRATE INTERCONNECTS 113 8.1
COAXIAL CONNECTORS AND STRUCTURES 113 8.1.1 MINIATURE COAXIAL CONNECTORS
113 8.1.2 DESIGN OF LAUNCH STRUCTURES 115 8.1.3 MEASURED RESULTS ON TEST
SETUPS 117 8.1.4 ALTERNATIVE CONNECTORS AND LAUNCH INTERFACES 120 8.2
CERAMIC WALL FEEDTHROUGH 122 8.3 BENDS AND TAPERS ON LINES 126 9
SUBSTRATE TO CHIP INTERCONNECTS 129 9.1 WIRE-BOND INTERCONNECTS 129
9.1.1 INVESTIGATION OF SINGLE-ENDED CONFIGURATION 130 9.1.2 IMPROVEMENT
OF SINGLE-ENDED CONFIGURATION 134 9.1.3 INVESTIGATION OF DIFFERENTIAL
CONFIGURATION 136 9.2 FLIP-CHIP INTERCONNECTS 141 9.2.1 DIFFERENTIAL
CONFIGURATION 141 9.2.2 PARASITIC RESONANT MODES 145 9.2.3 UNDERFILL
INFLUENCE 148 10 LTCC TEST HOUSINGS FOR 40GB/S APPLICATIONS 151 10.1
STRUCTURE OF LTCC TEST HOUSINGS 151 10.2 MODELLING OF LTCC HOUSINGS WITH
PASSIVE CHIPS 154 10.3 MEASUREMENT OF LTCC HOUSINGS WITH PASSIVE CHIPS
156 10.4 MEASUREMENT OF LTCC HOUSINGS WITH ACTIVE CHIPS 157 11
INTERCONNECTS FOR FUTURE 80GB/S SYSTEMS 161 11.1 DESIGN OF INTERCONNECTS
FOR TEST FIXTURE 161 11.2 ACHIEVED RESULTS AND CONCLUSIONS 164 12
SUMMARY 167 IX
|
| adam_txt |
MODELLING AND OPTIMIZATION OF BROADBAND ELECTRICAL INTERCONNECTS AND
HOUSINGS FOR OPTICAL COMMUNICATION SYSTEMS SUBMITTED TO THE FACULTY OF
ENGINEERING SCIENCES OF PRIEDRICH-ALEXANDER UNIVERSITY
ERLANGEN-NUREMBERG IN FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF
DOKTOR-INGENIEUR FROM MARTIN NISZNANSKY ERLANGEN 2005 ULB DARMSTADT
16323063 CONTENTS 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 THESIS OVERVIEW
3 2 BASICS OF OPTICAL FIBER COMMUNICATION SYSTEMS 9 2.1 ARCHITECTURE OF
OPTICAL 40GB/S COMMUNICATION SYSTEMS . 9 2.2 MULTI-CHIP MODULES AND
ELECTRICAL INTERCONNECTS 11 2.3 SIGNALS IN OPTICAL COMMUNICATION SYSTEMS
12 2.3.1 MODULATION FORMATS 14 2.3.2 SPECTRAL PROPERTIES OF MODULATED
SIGNALS 15 3 MATERIALS AND ASSEMBLY TECHNOLOGIES 21 3.1 CERAMIC
SUBSTRATES AND INTERCONNECT TECHNOLOGIES 21 3.1.1 CLASSIC THIN-FILM
TECHNOLOGY 21 3.1.2 LTCC TECHNOLOGY 22 3.1.3 LTCC PROCESS 23 3.1.4
MANUFACTURING TOLERANCES AND TECHNOLOGICAL LIMITATIONS 26 3.2 SUBSTRATE
TO CHIP INTERCONNECTS 29 3.2.1 WIRE-BONDING 29 3.2.2 FLIP-CHIP
INTERCONNECTS 30 4 MODELLING OF HIGH SPEED INTERCONNECTS 33 4.1
FIELD-BASED MODELLING OF INTERCONNECTS 33 4.1.1 MODELLING TECHNIQUES IN
ELECTROMAGNETISM 33 4.1.2 HFSS IMPLEMENTATION OVERVIEW 34 4.1.3 FINITE
ELEMENT METHOD 35 4.1.4 ENTRY OF SIMULATION MODEL 38 4.1.5 SIMULATION
ACCURACY AND ADAPTIVE SOLUTION 40 4.1.6 EXTRACTION OF CIRCUIT PARAMETERS
41 4.2 DIFFERENTIAL STIMULUS AND COUPLED INTERCONNECTS 41 4.3 NODAL AND
MIXED-MODE S-PARAMETERS 43 VII 4.4 EQUIVALENT CIRCUIT MODELS 45 4.5
DIGITAL SIGNALS AND TIME DOMAIN ANALYSIS 46 4.5.1 EYE DIAGRAM AND
DIGITAL SIGNAL CHARACTERISTICS . . . . 47 4.5.2 CRITERIA FOR MINIMAL
SIGNAL DISTORTION 49 MICROWAVE MEASUREMENT TECHNIQUES ON INTERCONNECTS
51 5.1 ON NETWORK ANALYZER BASED MEASUREMENTS 51 5.1.1 ON-WAFER
MEASUREMENTS 52 5.1.2 CALIBRATION TECHNIQUES 54 5.2 CHARACTERIZATION OF
DIFFERENTIAL INTERCONNECTS 56 5.2.1 4-PORT NETWORK ANALYZER 57 5.2.2
S-PARAMETERS TRANSFORMATION 58 5.3 TIME DOMAIN MEASUREMENT TECHNIQUES 58
5.3.1 TIME DOMAIN REFLECTOMETRY 58 5.3.2 TIME DOMAIN GATING 60 5.4
TRANSMISSION LINE CHARACTERIZATION 61 MATERIAL CHARACTERIZATION FOR
MICROWAVE CHIP MODULES 65 6.1 DEFINITION OF MATERIAL PARAMETERS 65 6.1.1
DIELECTRIC MATERIALS 65 6.1.2 CONDUCTIVE MATERIALS 66 6.2
CHARACTERIZATION OF THIN CERAMIC SUBSTRATES 67 6.2.1 DISK RESONATOR
METHOD 67 6.2.2 MEASURED RESULTS ON LTCC SUBSTRATES 72 6.3
CHARACTERIZATION OF CONDUCTIVE MATERIALS 73 6.3.1 CAVITY RESONATOR
METHOD 73 6.3.2 MEASURED RESULTS ON LTCC CONDUCTOR SYSTEMS . . . . 76
6.4 UNDERFILL CHARACTERIZATION 78 6.4.1 TRANSMISSION/REFLECTION METHOD
79 6.4.2 MEASURED RESULTS ON UNDERFILL MATERIAL 80 TRANSMISSION LINES 83
7.1 THEORY OF TRANSMISSION LINES 83 7.1.1 FIELD BASED APPROACH 84 7.1.2
LUMPED-ELEMENT APPROACH 86 7.1.3 COUPLED TRANSMISSION LINES 88 7.2
PLANAR TRANSMISSION LINES FOR BROADBAND CHIP MODULES . . . 90 7.2.1
QUASI-TEM LINES AND QUASI-STATIC APPROACH 90 VIII 7.2.2 TRANSMISSION
LINES IN MICROWAVE MODULES 92 7.3 GROUNDED COPLANAR WAVEGUIDE 94 7.3.1
SIGNAL PROPAGATION ON GCPW 95 7.3.2 SPURIOUS MODES ON GCPW LINES 100 7.4
MEASUREMENT OF REALIZED TRANSMISSION LINES ON LTCC . . . . 105 7.4.1
INVESTIGATION OF TECHNOLOGICAL IMPERFECTIONS 105 7.4.2 MEASUREMENT OF
ELECTRICAL PERFORMANCE 108 8 MODULE AND SUBSTRATE INTERCONNECTS 113 8.1
COAXIAL CONNECTORS AND STRUCTURES 113 8.1.1 MINIATURE COAXIAL CONNECTORS
113 8.1.2 DESIGN OF LAUNCH STRUCTURES 115 8.1.3 MEASURED RESULTS ON TEST
SETUPS 117 8.1.4 ALTERNATIVE CONNECTORS AND LAUNCH INTERFACES 120 8.2
CERAMIC WALL FEEDTHROUGH 122 8.3 BENDS AND TAPERS ON LINES 126 9
SUBSTRATE TO CHIP INTERCONNECTS 129 9.1 WIRE-BOND INTERCONNECTS 129
9.1.1 INVESTIGATION OF SINGLE-ENDED CONFIGURATION 130 9.1.2 IMPROVEMENT
OF SINGLE-ENDED CONFIGURATION 134 9.1.3 INVESTIGATION OF DIFFERENTIAL
CONFIGURATION 136 9.2 FLIP-CHIP INTERCONNECTS 141 9.2.1 DIFFERENTIAL
CONFIGURATION 141 9.2.2 PARASITIC RESONANT MODES 145 9.2.3 UNDERFILL
INFLUENCE 148 10 LTCC TEST HOUSINGS FOR 40GB/S APPLICATIONS 151 10.1
STRUCTURE OF LTCC TEST HOUSINGS 151 10.2 MODELLING OF LTCC HOUSINGS WITH
PASSIVE CHIPS 154 10.3 MEASUREMENT OF LTCC HOUSINGS WITH PASSIVE CHIPS
156 10.4 MEASUREMENT OF LTCC HOUSINGS WITH ACTIVE CHIPS 157 11
INTERCONNECTS FOR FUTURE 80GB/S SYSTEMS 161 11.1 DESIGN OF INTERCONNECTS
FOR TEST FIXTURE 161 11.2 ACHIEVED RESULTS AND CONCLUSIONS 164 12
SUMMARY 167 IX |
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| author | Nisznanský, Martin 1975- |
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
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| genre | (DE-588)4113937-9 Hochschulschrift gnd-content |
| genre_facet | Hochschulschrift |
| id | DE-604.BV021515815 |
| illustrated | Illustrated |
| index_date | 2024-07-02T14:20:41Z |
| indexdate | 2024-07-09T20:37:35Z |
| institution | BVB |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-014732376 |
| oclc_num | 162238002 |
| open_access_boolean | |
| owner | DE-29 DE-29T DE-12 DE-83 |
| owner_facet | DE-29 DE-29T DE-12 DE-83 |
| physical | XXIV, 185 S. Ill., graph. Darst. |
| publishDate | 2005 |
| publishDateSearch | 2005 |
| publishDateSort | 2005 |
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| spelling | Nisznanský, Martin 1975- Verfasser (DE-588)131487221 aut Modelling and optimization of broadband electrical interconnects and housings for optical communication systems from Martin Nisznanský 2005 XXIV, 185 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Erlangen-Nürnberg, Univ., Diss., 2005 Optisches Nachrichtenübertragungssystem (DE-588)4172686-8 gnd rswk-swf Breitbandübertragung (DE-588)4146534-9 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf (DE-588)4113937-9 Hochschulschrift gnd-content Optisches Nachrichtenübertragungssystem (DE-588)4172686-8 s Breitbandübertragung (DE-588)4146534-9 s Gehäuse (DE-588)4156307-4 s DE-604 HEBIS Datenaustausch Darmstadt application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014732376&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Nisznanský, Martin 1975- Modelling and optimization of broadband electrical interconnects and housings for optical communication systems Optisches Nachrichtenübertragungssystem (DE-588)4172686-8 gnd Breitbandübertragung (DE-588)4146534-9 gnd Gehäuse (DE-588)4156307-4 gnd |
| subject_GND | (DE-588)4172686-8 (DE-588)4146534-9 (DE-588)4156307-4 (DE-588)4113937-9 |
| title | Modelling and optimization of broadband electrical interconnects and housings for optical communication systems |
| title_auth | Modelling and optimization of broadband electrical interconnects and housings for optical communication systems |
| title_exact_search | Modelling and optimization of broadband electrical interconnects and housings for optical communication systems |
| title_exact_search_txtP | Modelling and optimization of broadband electrical interconnects and housings for optical communication systems |
| title_full | Modelling and optimization of broadband electrical interconnects and housings for optical communication systems from Martin Nisznanský |
| title_fullStr | Modelling and optimization of broadband electrical interconnects and housings for optical communication systems from Martin Nisznanský |
| title_full_unstemmed | Modelling and optimization of broadband electrical interconnects and housings for optical communication systems from Martin Nisznanský |
| title_short | Modelling and optimization of broadband electrical interconnects and housings for optical communication systems |
| title_sort | modelling and optimization of broadband electrical interconnects and housings for optical communication systems |
| topic | Optisches Nachrichtenübertragungssystem (DE-588)4172686-8 gnd Breitbandübertragung (DE-588)4146534-9 gnd Gehäuse (DE-588)4156307-4 gnd |
| topic_facet | Optisches Nachrichtenübertragungssystem Breitbandübertragung Gehäuse Hochschulschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=014732376&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT nisznanskymartin modellingandoptimizationofbroadbandelectricalinterconnectsandhousingsforopticalcommunicationsystems |