Materials for information technology: devices, interconnects and packaging
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
London
Springer
2005
|
| Schriftenreihe: | Engineering Materials and Processes
|
| Schlagworte: | |
| Beschreibung: | XIX, 508 S. |
| ISBN: | 1852339411 9781852339418 |
Internformat
MARC
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Datensatz im Suchindex
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| callnumber-subject | T - General Technology |
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| ctrlnum | (OCoLC)57638535 (DE-599)BVBBV021292834 |
| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815 |
| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Physik Informatik Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Physik Informatik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV021292834 |
| illustrated | Not Illustrated |
| index_date | 2024-07-02T13:50:21Z |
| indexdate | 2024-07-09T20:34:54Z |
| institution | BVB |
| isbn | 1852339411 9781852339418 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-014613655 |
| oclc_num | 57638535 |
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| physical | XIX, 508 S. |
| publishDate | 2005 |
| publishDateSearch | 2005 |
| publishDateSort | 2005 |
| publisher | Springer |
| record_format | marc |
| series2 | Engineering Materials and Processes |
| spelling | Materials for information technology devices, interconnects and packaging Ehrenfried Zschech (Ed.) ... London Springer 2005 XIX, 508 S. txt rdacontent n rdamedia nc rdacarrier Engineering Materials and Processes Information technology Congresses Microelectronics Materials Congresses Informationstechnik (DE-588)4026926-7 gnd rswk-swf Werkstoff (DE-588)4065579-9 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 2003 Lausanne gnd-content Werkstoff (DE-588)4065579-9 s Informationstechnik (DE-588)4026926-7 s DE-604 Zschech, Ehrenfried Sonstige oth |
| spellingShingle | Materials for information technology devices, interconnects and packaging Information technology Congresses Microelectronics Materials Congresses Informationstechnik (DE-588)4026926-7 gnd Werkstoff (DE-588)4065579-9 gnd |
| subject_GND | (DE-588)4026926-7 (DE-588)4065579-9 (DE-588)1071861417 |
| title | Materials for information technology devices, interconnects and packaging |
| title_auth | Materials for information technology devices, interconnects and packaging |
| title_exact_search | Materials for information technology devices, interconnects and packaging |
| title_exact_search_txtP | Materials for information technology devices, interconnects and packaging |
| title_full | Materials for information technology devices, interconnects and packaging Ehrenfried Zschech (Ed.) ... |
| title_fullStr | Materials for information technology devices, interconnects and packaging Ehrenfried Zschech (Ed.) ... |
| title_full_unstemmed | Materials for information technology devices, interconnects and packaging Ehrenfried Zschech (Ed.) ... |
| title_short | Materials for information technology |
| title_sort | materials for information technology devices interconnects and packaging |
| title_sub | devices, interconnects and packaging |
| topic | Information technology Congresses Microelectronics Materials Congresses Informationstechnik (DE-588)4026926-7 gnd Werkstoff (DE-588)4065579-9 gnd |
| topic_facet | Information technology Congresses Microelectronics Materials Congresses Informationstechnik Werkstoff Konferenzschrift 2003 Lausanne |
| work_keys_str_mv | AT zschechehrenfried materialsforinformationtechnologydevicesinterconnectsandpackaging |