Electronic materials and processes handbook: [engineering materials for thermal management ; full material breakdowns for high density packaging techniques ; materials for communications wiring and cabling]
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | Undetermined |
| Veröffentlicht: |
New York, NY u.a.
McGraw-Hill
2003
|
| Ausgabe: | 3. ed. |
| Schriftenreihe: | McGraw-Hill Handbooks
|
| Schlagworte: | |
| Beschreibung: | Getr. Zählung Ill., graph. Darst. |
| ISBN: | 0071402144 |
Internformat
MARC
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| 245 | 1 | 0 | |a Electronic materials and processes handbook |b [engineering materials for thermal management ; full material breakdowns for high density packaging techniques ; materials for communications wiring and cabling] |c Charles A. Harper, ed. in chief |
| 250 | |a 3. ed. | ||
| 264 | 1 | |a New York, NY u.a. |b McGraw-Hill |c 2003 | |
| 300 | |a Getr. Zählung |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
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| 338 | |b nc |2 rdacarrier | ||
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| 650 | 0 | 7 | |a Fertigung |0 (DE-588)4016899-2 |2 gnd |9 rswk-swf |
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Datensatz im Suchindex
| _version_ | 1804133535345278976 |
|---|---|
| any_adam_object | |
| author_GND | (DE-588)128924845 |
| building | Verbundindex |
| bvnumber | BV019989714 |
| classification_tum | ELT 270b |
| ctrlnum | (OCoLC)635090766 (DE-599)BVBBV019989714 |
| discipline | Elektrotechnik |
| edition | 3. ed. |
| format | Book |
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| id | DE-604.BV019989714 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T20:10:15Z |
| institution | BVB |
| isbn | 0071402144 |
| language | Undetermined |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-013311654 |
| oclc_num | 635090766 |
| open_access_boolean | |
| owner | DE-573 |
| owner_facet | DE-573 |
| physical | Getr. Zählung Ill., graph. Darst. |
| publishDate | 2003 |
| publishDateSearch | 2003 |
| publishDateSort | 2003 |
| publisher | McGraw-Hill |
| record_format | marc |
| series2 | McGraw-Hill Handbooks |
| spelling | Electronic materials and processes handbook [engineering materials for thermal management ; full material breakdowns for high density packaging techniques ; materials for communications wiring and cabling] Charles A. Harper, ed. in chief 3. ed. New York, NY u.a. McGraw-Hill 2003 Getr. Zählung Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier McGraw-Hill Handbooks Elektronik (DE-588)4014346-6 gnd rswk-swf Halbleitertechnologie (DE-588)4158814-9 gnd rswk-swf Elektronisches Gerät (DE-588)4127635-8 gnd rswk-swf Fertigung (DE-588)4016899-2 gnd rswk-swf Werkstoff (DE-588)4065579-9 gnd rswk-swf Verfahrenstechnik (DE-588)4062781-0 gnd rswk-swf Elektronik (DE-588)4014346-6 s Verfahrenstechnik (DE-588)4062781-0 s DE-604 Halbleitertechnologie (DE-588)4158814-9 s Werkstoff (DE-588)4065579-9 s Elektronisches Gerät (DE-588)4127635-8 s Fertigung (DE-588)4016899-2 s 1\p DE-604 Harper, Charles A. 1926- Sonstige (DE-588)128924845 oth 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Electronic materials and processes handbook [engineering materials for thermal management ; full material breakdowns for high density packaging techniques ; materials for communications wiring and cabling] Elektronik (DE-588)4014346-6 gnd Halbleitertechnologie (DE-588)4158814-9 gnd Elektronisches Gerät (DE-588)4127635-8 gnd Fertigung (DE-588)4016899-2 gnd Werkstoff (DE-588)4065579-9 gnd Verfahrenstechnik (DE-588)4062781-0 gnd |
| subject_GND | (DE-588)4014346-6 (DE-588)4158814-9 (DE-588)4127635-8 (DE-588)4016899-2 (DE-588)4065579-9 (DE-588)4062781-0 |
| title | Electronic materials and processes handbook [engineering materials for thermal management ; full material breakdowns for high density packaging techniques ; materials for communications wiring and cabling] |
| title_auth | Electronic materials and processes handbook [engineering materials for thermal management ; full material breakdowns for high density packaging techniques ; materials for communications wiring and cabling] |
| title_exact_search | Electronic materials and processes handbook [engineering materials for thermal management ; full material breakdowns for high density packaging techniques ; materials for communications wiring and cabling] |
| title_full | Electronic materials and processes handbook [engineering materials for thermal management ; full material breakdowns for high density packaging techniques ; materials for communications wiring and cabling] Charles A. Harper, ed. in chief |
| title_fullStr | Electronic materials and processes handbook [engineering materials for thermal management ; full material breakdowns for high density packaging techniques ; materials for communications wiring and cabling] Charles A. Harper, ed. in chief |
| title_full_unstemmed | Electronic materials and processes handbook [engineering materials for thermal management ; full material breakdowns for high density packaging techniques ; materials for communications wiring and cabling] Charles A. Harper, ed. in chief |
| title_short | Electronic materials and processes handbook |
| title_sort | electronic materials and processes handbook engineering materials for thermal management full material breakdowns for high density packaging techniques materials for communications wiring and cabling |
| title_sub | [engineering materials for thermal management ; full material breakdowns for high density packaging techniques ; materials for communications wiring and cabling] |
| topic | Elektronik (DE-588)4014346-6 gnd Halbleitertechnologie (DE-588)4158814-9 gnd Elektronisches Gerät (DE-588)4127635-8 gnd Fertigung (DE-588)4016899-2 gnd Werkstoff (DE-588)4065579-9 gnd Verfahrenstechnik (DE-588)4062781-0 gnd |
| topic_facet | Elektronik Halbleitertechnologie Elektronisches Gerät Fertigung Werkstoff Verfahrenstechnik |
| work_keys_str_mv | AT harpercharlesa electronicmaterialsandprocesseshandbookengineeringmaterialsforthermalmanagementfullmaterialbreakdownsforhighdensitypackagingtechniquesmaterialsforcommunicationswiringandcabling |