Introduction to nondestructive testing: a training guide
Gespeichert in:
| 1. Verfasser: | |
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| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Hoboken, NJ
Wiley-Interscience
2005
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| Ausgabe: | 2. ed. |
| Schlagworte: | |
| Online-Zugang: | Table of contents Inhaltsverzeichnis |
| Beschreibung: | Includes index. |
| Beschreibung: | XXVI, 681 S. |
| ISBN: | 0471420298 9780471420293 |
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| 100 | 1 | |a Mix, Paul E. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Introduction to nondestructive testing |b a training guide |c Paul E. Mix |
| 250 | |a 2. ed. | ||
| 264 | 1 | |a Hoboken, NJ |b Wiley-Interscience |c 2005 | |
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| 500 | |a Includes index. | ||
| 650 | 4 | |a Contrôle non destructif | |
| 650 | 4 | |a aNondestructive testing | |
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Datensatz im Suchindex
| _version_ | 1804133348147200000 |
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| adam_text | INTRODUCTION TO NONDESTRUCTIVE TESTING A TRAINING GUIDE SECOND EDITION
PAUL E. MIX WILEY- INTERSCIENCE A JOHN WILEY & SONS, INC., PUBLICATION
CONTENTS PREFACE 1 INTRODUCTION 1.1 DIGITAL TECHNOLOGY, 1 1.2 SMALLER IS
BETTER, 2 1.3 MEDICAL MARVELS, 5 1.4 IMPROVING SHUTTLE SAFETY, 6 1.5
AIRPORT SECURITY, 9 1.6 PROCESS CONTROL, 9 1.7 INSTRUMENT
SYNCHRONIZATION WITH PXI, 10 1.8 PCI VS. PXI, 11 1.9 60,000-MILE-HIGH
ELEVATOR, 11 1.10 PROLIFERATION OF INFORMATION, 12 2 ACOUSTIC EMISSIONS
2.1 PRINCIPLES AND THEORY, 15 2.2 SIGNAL PROPAGATION, 16 2.3 PHYSICAL
CONSIDERATIONS, 16 2.4 THE AE PROCESS CHAIN, 17 2.5 TIME CONSIDERATIONS,
18 2.6 AE PARAMETERS, 18 2.7 THE AE MEASUREMENT CHAIN, 20 2.7.1 COUPLING
AGENTS, 21 2.7.2 AE SENSORS, 21 VIII CONTENTS 2.7.3 SENSOR ATTACHMENT,
22 2.7.4 SENSOR TO PREAMPLIFIER CABLE, 22 2.7.5 AE PREAMPLIFIER, 23
2.7.6 PREAMPLIFIER TO SYSTEM CABLE, 23 2.8 VALIEN AMSY-5 HIGH-SPEED AE
SYSTEM, 24 2.8.1 FREQUENCY FILTER, 24 2.8.2 THE A/D CONVERTER, 25 2.8.3
FEATURE EXTRACTION, 25 2.8.4 TRANSIENT RECORDER, 25 2.8.5 DATA BUFFER,
26 2.8.6 PERSONAL COMPUTER AND SOFTWARE, 26 2.8.7 SENSOR COUPLING TEST
(AUTOCALIBRATION), 26 2.9 LOCATION CALCULATION AND CLUSTERING, 27 2.9.1
LOCATION CALCULATION BASED ON TIME DIFFERENCES, 27 2.9.2 CLUSTERING, 29
2.9.3 SAMPLE ANALYSIS SCREEN, 30 2.9.4 VISUALIZATION OF MEASUREMENT
RESULTS, 32 2.10 ADVANTAGES AND LIMITATIONS OF AE TESTING, 32 2.10.1
ADVANTAGES, 32 2.10.2 ADVANTAGES OF USING OPERATING MEDIUM (GAS OR
LIQUID), 32 2.10.3 ADVANTAGES COMPARED TO OTHER NDT METHODS, 33 2.10.4
LIMITATIONS, 33 2.10.5 LOCATION ERRORS, 33 2.11 AMSY-5 MAIN FEATURES, 34
2.12 AE TRANSDUCERS, 34 2.13 KISTLER PIEZOTRON ACOUSTIC EMISSION
SENSORS AND COUPLERS, 35 2.14 AE SENSOR CONSTRUCTION, 35 2.15 SUMMARY OF
AE SENSOR FEATURES, 36 2.16 TECHNICAL SPECIFICATIONS*8152B2 SENSOR, 36
2.17 AE COUPLER FEATURES, 36 2.18 TECHNICAL SPECIFICATIONS*5125B
COUPLER, 38 2.18.1 INPUT, 38 2.18.2 OUTPUT, 38 2.19 ACOUSTIC EMISSION
TECHNOLOGY, 38 2.20 AE APPLICATIONS, 39 2.21 AE THEORY, 39 2.22
APPLICATIONS, 41 2.22.1 BEHAVIOR OF MATERIALS*METALS, CERAMICS,
COMPOSITES, ROCKS, CONCRETE, 41 2.22.2 NONDESTRUCTIVE TESTING DURING
MANUFACTURING PROCESSES, 41 2.22.3 MONITORING STRUCTURES, 41 2.22.4
SPECIAL APPLICATIONS, 41 CONTENTS IX 2.23 ADVANCED EQUIPMENT, 42 2.23.1
PCI-2 AE UNIT, 42 2.23.2 KEY FEATURES, 42 2.23.3 PCI-8,16-BIT, 8-CHANNEL
AE UNIT, 43 2.23.4 MICROSAMOS*, BUDGET, COMPACT AE SYSTEM, 44 2.23.5
DISP SYSTEMS, 45 2.23.6 PCI/DSP-4 CARD, 45 2.23.7 FEATURES OF PCI/DSP-4
SYSTEM BOARD, 47 2.23.8 PCI/DSP-4 BOARD OPERATION AND FUNCTIONS, 47
2.23.9 DISP SYSTEM BLOCK DIAGRAM, 49 2.23.10 OTHER COMPANY PRODUCTS, 50
2.24 CODES, STANDARDS, PRACTICES, GUIDELINES, AND SOCIETIES, 50 2.24.1
SHEER NUMBERS, 52 2.24.2 TERMINOLOGY, 52 2.24.3 COMMON TERM DEFINITIONS,
52 2.24.4 GENERAL PRINCIPLES, 53 2.24.5 MEASUREMENT TECHNIQUES AND
CALIBRATION, 53 2.24.6 AREAS OF OPPORTUNITY, 53 2.25 APPLICATION AND
PRODUCT-SPECIFIC PROCEDURES, 54 2.26 IMPACT-ECHO METHOD, 54 2.26.1
BACKGROUND, 54 2.26.2 FINITE ELEMENT CODE, 55 2.26.3 BALL
BEARING-GENERATED STRESS, 55 2.26.4 IMPACT-ECHO TRANSDUCER DEVELOPMENT,
56 2.26.5 FREQUENCY DOMAIN ANALYSIS, 56 2.26.6 THEORY OF OPERATIONS, 56
2.26.7 PROPAGATION OF WAVES, 57 2.26.8 IMPACT-ECHO INSTRUMENTATION, 59
2.26.8.1 SYSTEM COMPONENTS, 59 2.26.8.2 HEAVY-DUTY CARRYING CASE, 60
2.26.8.3 COMPUTER RECOMMENDATIONS, 60 2.27 TECHNICAL SPECIFICATIONS, 61
2.27.1 HAND-HELD TRANSDUCER UNIT, 61 2.27.2 A/D DATA ACQUISITION SYSTEM,
62 2.27.3 WINDOWS-BASED SOFTWARE, 63 2.28 APPLICATIONS, 64 3
ELECTROMAGNETIC TESTING METHOD 65 3.1 EDDY CURRENT THEORY, 66 3.1.1
SURFACE MOUNTED COILS, 66 3.1.2 ENCIRCLING COILS, 71 3.2 MAGNETIC FLUX
LEAKAGE THEORY, 73 3.3 EDDY CURRENT SENSING PROBES, 79 3.4 FLUX LEAKAGE
SENSING PROBES, 83 3.4.1 INDUCTION COILS, 83 3.4.2 HALL EFFECT SENSORS,
84 3.5 FACTORS AFFECTING FLUX LEAKAGE, 87 3.6 SIGNAL-TO-NOISE RATIO, 88
3.7 TEST FREQUENCY, 88 3.8 MAGNETIZATION FOR FLUX LEAKAGE TESTING, 90
3.9 COUPLING, 95 3.10 EDDY CURRENT TECHNIQUES, 95 3.11 INSTRUMENT DESIGN
CONSIDERATIONS, 96 3.12 UNIWEST US-454 EDDYVIEW*, 98 3.12.1 E-LAB MODEL
US-450, 101 3.12.2 ETC-2000 SCANNER, 102 3.13 INSTITUT DR. FOERSTER, 103
3.14 MAGNETIC FLUX LEAKAGE TESTING, 106 3.15 APPLICATIONS, 108 3.15.1
GENERAL EDDY CURRENT APPLICATIONS, 108 3.15.2 SPECIFIC EDDY CURRENT
APPLICATIONS, 110 3.15.3 GENERAL FLUX LEAKAGE APPLICATIONS, 111 3.15.4
SPECIFIC LEAKAGE FLUX APPLICATIONS, 111 3.16 USE OF COMPUTERS, 112 3.17
BARKHAUSEN NOISE/MICROMAGNETIC TESTING, 112 3.17.1 INTRODUCTION, 112
3.18 EARLY APPLICATIONS, 113 3.19 PRINCIPLES OF MEASUREMENT, 114 3.20
EQUIPMENT, 115 3.21 TECHNICAL SPECIFICATIONS, 117 3.22 CALIBRATION AND
TESTING, 117 3.23 CURRENT APPLICATIONS, 120 3.23.1 APPLICATIONS IN
AIRCRAFT/AUTOMOTIVE/MARINE INDUSTRIES, 120 3.24 GENERAL APPLICATIONS,
121 3.24.1 PIPE/TUBING/SHEET/PLATE MANUFACTURING, 121 3.25
ELECTROMECHANICAL ACOUSTIC TRANSDUCERS (EMATS), 3.25.1 EMATS ADVANTAGES
OVER PIEZOELECTRIC TRANSDUCERS, 122 3.26 BASIC THEORY OF OPERATION, 122
3.27 RECENT APPLICATIONS AND DEVELOPMENTS, 123 3.28 ALTERNATING CURRENT
FIELD MEASUREMENT (ACFM) METHOD, 124 3.29 ACFM PRINCIPLES OF OPERATION,
125 3.29.1 BX AND BZ COMPONENTS, 126 3.29.2 BUTTERFLY PLOT, 127 3.30
PROBE DESIGN, 127 3.31 APPLICATIONS, 128 CONTENTS XI 4 LASER TESTING
METHODS 131 4.1 INTRODUCTION, 131 4.2 DISADVANTAGES, 132 4.3 MAIN
ADVANTAGES, 132 4.4 LASER THEORY, 132 4.5 LASER SAFETY, 133 4.6 LASER
CLASSIFICATION, 133 4.7 TRAINING, 134 4.8 PROFILOMETRY METHODS, 134
4.8.1 STYLUS PROFILOMETRY, 135 4.8.2 OPTICAL PROFILOMETRY, 135 4.8.3
WHITE LIGHT INTERFEROMETRY, 135 4.9 BASIC TV HOLOGRAPHY/ESPI
INTERFEROMETRY, 136 4.9.1 SINGLE LASER OPERATION, 136 4.9.2 CAMERA
OPERATION, 136 4.9.3 APPLICATIONS, 137 4.9.4 THERMAL STRESSES, 139 4.9.5
QUANTITATIVE ASPECTS OF MECHANICAL STRESS, 140 4.9.6 QUALITATIVE
ASPECTS, 141 4.10 NANOMETRIC PROFILING MEASUREMENTS, 141 4.10.1
INTRODUCTION, 141 4.10.2 AUTOFOCUS PRINCIPLE, 142 4.10.3 SPECIFICATIONS,
142 4.10.3.1 SENSOR, 142 4.10.3.2 CAMERA, 142 4.11 CONOSCOPIC
HOLOGRAPHY, 143 4.11.1 THEORY, 143 4.11.2 SPECIFICATIONS, 143 4.12
CONFOCAL MEASUREMENT, 144 4.12.1 SPECIFICATIONS, 144 4.12.1.1 SENSOR,
144 4.12.1.2 CAMERA, 144 4.13 NANOSURF CONFOCAL MICROSCOPY, 145 4.13.1
INTRODUCTION, 145 4.13.2 STANDARD COMPONENTS, 146 4.13.3 OPTIONS, 146
4.14 3D CONFOCAL MICROSCOPY, 146 4.14.1 PRINCIPLE OF OPERATION, 146
4.14.2 ADVANTAGES, 146 4.14.3 SPECIFICATIONS, 146 4.15 NANOMETRIC
PROFILING APPLICATIONS, 147 4.16 SCANNING LASER PROFILOMETRY, 147 4.16.1
OPTICAL PRINCIPLE, 148 4.16.2 PROBES, 149 4.16.3 3D PROFILER, 149 4.16.4
LP-2000* CONTROL UNIT, 150 4.17 LASER-SCANNED PENETRANT INSPECTION
(LSPI*-PATENT PENDING), 152 4.17.1 APPLICATIONS, 154 4.18 ADVANCED
TECHNIQUES, 154 4.19 NATURAL AND EXTERNAL EXCITATION, 154 4.20
STRAIN/STRESS MEASUREMENT, 155 4.20.1 THEORY OF OPERATION, 155 4.20.2
TECHNICAL DATA, 156 4.21 LONGER RANGE 3D SPECKLE INTERFEROMETRY SYSTEM,
157 4.21.1 TECHNICAL DATA, 158 4.21.2 HARDWARE AND SOFTWARE OPTIONS, 158
4.21.3 APPLICATIONS FOR 3D-ESPI SYSTEMS, 158 4.21.4 TECHNICAL DATA, 160
4.22 NONDESTRUCTIVE TESTING (NDT), 161 4.23 SHEAROGRAPHY, 161 4.23.1
PRINCIPLE OF LASER SHEAROGRAPHY, 161 4.23.2 COMPACT SHEAROGRAPHY SYSTEM,
162 4.23.3 TECHNICAL DATA, 163 4.24 PORTABLE SHEAROGRAPHY SYSTEM, 164
4.24.1 TECHNICAL DATA, 164 4.24.2 OTHER APPLICATIONS, 165 4.25 FELTMETAL
INSPECTION SYSTEM, 166 4.25.1 SETUP AND TECHNIQUE, 166 4.25.2 TECHNICAL
DATA, 166 4.26 OPTIONAL APPLICATIONS, 168 4.27 OPTICAL INSPECTION
SYSTEMS, 168 4.27.1 ARAMIS, 168 4.27.2 INDUSTRY-SPECIFIC APPLICATIONS,
170 4.27.3 MEASURING PROCEDURE, 170 4.27.4 MEASUREMENT RESULTS, 170
4.27.5 MEASUREMENT ADVANTAGES, 170 4.27.6 COMPARISON OF ESPI AND 3D
IMAGE CORRELATION, 171 4.27.7 ARAMIS HR SPECIFICATIONS, 172 4.28 ARGUS,
172 4.29 TRITOP, 174 4.29.1 PHOTOGRAMMETRIC OFFLINE SYSTEM, 174 4.29.2
MEASURABLE OBJECT SIZE, 174 4.29.3 DIGITAL PHOTOGRAMMETRY FUNCTIONALITY,
174 4.30 SYSTEM ADVANTAGES, 175 4.31 PORTABLE MEASURING SYSTEM
TECHNIQUE, 175 4.32 DYNAMIC TRITOP, 177 4.33 OTHER LASER METHODS, 177
4.33.1 MEASUREMENT OF HOT SPOTS IN METAL/SEMICONDUCTOR FIELD-EFFECT
TRANSISTORS, 177 CONTENTS XIII 5 LEAK TESTING METHODS 179 5.1
INTRODUCTION, 179 5.2 FUNDAMENTALS, 180 5.3 ULTRASONIC LEAK TESTING, 180
5.3.1 ULTRASONIC LEAK DETECTORS, 180 5.4 BUBBLE LEAK TESTING, 183 5.5
DYE PENETRANT LEAK TESTING, 183 5.6 PRESSURE CHANGE LEAK TESTING, 183
5.7 HELIUM MASS SPECTROMETER LEAK TESTING, 184 5.8 MASS SPECTROMETER
LEAK DETECTOR, 184 5.9 MSLD SUBSYSTEMS, 184 5.9.1 SPECTROMETER TUBE, 185
5.9.2 VACUUM SYSTEMS, 186 5.10 VACUUM SYSTEM CONFIGURATIONS, 186 5.10.1
CONVENTIONAL (DIRECT) FLOW, 186 5.10.2 CONTRAFLOW (REVERSE) FLOW, 187
5.10.3 MIDSTAGE FLOW, 188 5.10.4 MULTIPLE FLOW, 188 5.11 ELECTRONICS,
189 5.11.1 I/O FUNCTIONS, 190 5.12 METHODS OF LEAK DETECTION, 190 5.13
VACUUM TESTING METHOD (OUTSIDE-IN), 191 5.13.1 LOCATING LEAKS, 191
5.13.2 MEASURING LEAKS, 192 5.14 PRESSURE TEST METHOD (INSIDE-OUT), 192
5.14.1 LOCATING LEAKS, 192 5.14.2 MEASURING LEAKS, 193 5.15 ACCUMULATION
TESTING METHOD, 194 5.16 VACUUM SYSTEMS, 194 5.17 PRESSURIZED SYSTEMS,
195 5.18 MSLD CONFIGURATIONS, 196 5.18.1 WET OR DRY PUMPS, 196
5.18.2 CABINET OR WORKSTATION MODELS, 196 5.18.3 PORTABLE UNITS, 197
5.18.4 COMPONENT OR INTEGRATABLE UNITS, 197 5.19 CALIBRATION, 197 5.19.1
CALIBRATED LEAKS, 198 5.20 RADIOISOTOPE TRACER LEAK TESTING, 198 5.21
BUBBLE LEAK TESTING, 199 5.21.1 LEAK DETECTOR SOLUTION, 199 5.21.2
VACUUM BOX BUBBLE TRACER LEAK TESTING, 199 5.21.3 PRESSURE BUBBLE LEAK
TESTING, 200 5.21.4 INDICATIONS, 201 5.22 PRESSURE CHANGE LEAK TESTING,
202 5.22.1 PRINCIPLES, 202 5.22.2 TERMINOLOGY, 202 5.22.3 EQUIPMENT, 203
5.22.4 PRESSURIZING GASES, 204 5.23 PRESSURE CHANGE MEASUREMENT TESTING,
205 5.23.1 REFERENCE SYSTEM TECHNIQUE, 207 5.24 LEAKAGE RATE AND FLOW
MEASUREMENT TESTING, 207 5.25 NUCLEAR REACTOR SYSTEMS, 208 5.26 HALOGEN
DIODE LEAK TESTING, 209 5.26.1 PRINCIPLES, 209 5.26.2 TERMINOLOGY, 210
5.26.3 GASES AND EQUIPMENT, 210 5.26.4 CALIBRATION, 210 5.27 SNIFFER
TECHNIQUES, 212 5.27.1 EQUIPMENT OPERATION AND SERVICING, 212 5.27.2
NORMAL OPERATION, 212 5.28 VIC MSLD LEAK DETECTORS, 213 5.29 MSLD
SUBSYSTEMS, 216 5.29.1 SPECTROMETER TUBE, 217 5.29.2 VACUUM SYSTEM, 218
5.30 OPERATING SEQUENCE (MS-40 AND MS-40 DRY), 219 5.31 CALIBRATION
SEQUENCE (MS-40 AND MS-40 DRY), 220 6 LIQUID PENETRANT TESTS 221 6.1
INTRODUCTION, 221 6.2 PROCESSING, 222 6.3 TEST METHODS, 224 6.3.1 WATER
WASHABLE FLUORESCENT PENETRANT PROCESS, 224 6.3.2 POST-EMULSIFICATION
FLUORESCENT PROCESS, 226 6.3.3 REVERSE FLUORESCENT DYE PENETRANT
PROCESS, 227 6.3.4 VISIBLE DYE PENETRANT PROCESS, 227 6.3.5 WATER
EMULSIFIABLE VISIBLE DYE PENETRANT PROCESS, 228 6.3.6 WATER WASHABLE
VISIBLE DYE PENETRANT PROCESS, 228 6.3.7 POST-EMULSIFIABLE VISIBLE DYE
PENETRANT PROCESS, 229 6.3.8 SOLVENT CLEAN VISIBLE DYE PENETRANT
PROCESS, 229 6.4 ADVANTAGES AND DISADVANTAGES OF VARIOUS METHODS, 230
6.5 TEST EQUIPMENT, 231 6.6 PENETRANT MATERIALS, 236 6.7 SYSTEM
COMPARISONS, 238 6.8 APPLICATIONS, 239 6.9 MEASUREMENT OF UV AND VISIBLE
LIGHT, 242 6.10 AUTOMATIC AND SEMIAUTOMATIC PENETRANT TESTING METHODS,
245 CONTENTS CONTENTS XV 7 MAGNETIC PARTICLE TESTING 247 7.1 MAGNETIC
PRINCIPLES, 247 7.2 MAGNETS AND MAGNETIC FIELDS, 249 7.3 DISCONTINUITIES
AND DEFECTS, 252 7.4 INDUCED MAGNETIC FIELDS, 254 7.5 CIRCULAR AND
LONGITUDINAL FIELDS, 257 7.6 SELECTION OF MAGNETIZING METHOD, 262 7.7
COMMERCIAL EQUIPMENT, 263 7.8 WET AND DRY PARTICLE INSPECTION, 264 7.9
MT IMPROVEMENTS, 267 7.9.1 REMOTE MAGNETIC PARTICLE INSPECTION, 269
7.9.2 PROBE POWER, 269 7.9.3 LIGHTWEIGHT UV LAMPS, 270 7.9.4 DUAL LIGHT
(UV/VISIBLE AND VISIBLE) PARTICLE INDICATIONS, 270 7.10 APPLICATIONS,
270 7.11 RESIDUAL FIELDS AND DEMAGNETIZATION, 273 7.12 MAGNETIC FLUX
STRIPS, 275 7.13 HALL EFFECT GAUSSMETER, 276 7.14 THE HYSTERESIS CURVE,
277 7.15 SELECTION OF EQUIPMENT, 280 7.16 ADVANTAGES AND DISADVANTAGES
OF THE METHOD, 285 7.17 MAGNETIC RUBBER INSPECTION, 285 7.17.1
INTRODUCTION, 285 7.17.2 INSPECTION PRINCIPLES, 285 7.17.3 ADVANTAGES OF
MRI, 286 7.17.4 FORMULATIONS, 287 7.18 UNDERWATER MRI, 288 7.18.1
TECHNIQUE, 288 7.18.2 DISADVANTAGES, 288 7.19 MAGNETIC PENETRAMETERS,
289 7.20 AUTOMATIC AND SEMIAUTOMATIC INSPECTION, 289 7.21 MAGWERKS
INTEGRATED SYSTEM TRACKING TECHNOLOGY, 290 7.21.1 BASIC OPERATION, 290
7.21.1.1 BASIC OPERATION*AUTOMATIC MODE, 291 7.21.1.2 APPLICATIONS, 295
7.22 DISCONTINUITIES AND THEIR APPEARANCES, 296 7.23 NONRELEVANT
INDICATIONS, 297 8 NEUTRON RADIOGRAPHIC TESTING 301 8.1 INTRODUCTION,
301 8.2 PHYSICAL PRINCIPLES, 303 8.3 NEUTRON RADIATION SOURCES, 304 XVI
CONTENTS 8.4 NEUTRON ACTIVATION ANALYSIS, 304 8.5 WARD CENTER TRIGA
REACTOR, 307 8.6 RADIATION HAZARDS AND PERSONAL PROTECTION, 309 8.7
RADIATION DETECTION IMAGING, 311 8.7.1 CONVERSION SCREENS, 312 8.7.2
INDIRECT TRANSFER METHOD, 312 8.7.3 DIRECT TRANSFER METHOD, 312 8.7.4
FLUORESCENT SCREENS, 313 8.8 ELECTRONIC IMAGING, 313 8.9 NONIMAGING
DETECTORS, 313 8.10 NEUTRON RADIOGRAPHIC PROCESS, 313 8.11
INTERPRETATION OF RESULTS, 315 8.12 OTHER NEUTRON SOURCE APPLICATIONS,
316 8.13 NEUTRON LEVEL GAUGES, 320 8.14 CALIFORNIUM-252 SOURCES, 321
8.15 NEUTRON RADIOSCOPIC SYSTEMS, 321 8.15.1 INTRODUCTION, 321 8.15.2
NEUTRON IMAGING SYSTEM COMPONENTS, 322 8.15.3 ONLINE INSPECTION SYSTEMS,
323 8.15.4 CHARACTERISTICS OF ALUMINUM CORROSION, 323 8.15.5 THERMAL
NEUTRON INSPECTION SYSTEM REQUIREMENTS, 324 8.15.6 CONCLUSIONS, 324 9
RADIOGRAPHIC TESTING METHOD 325 9.1 INDUSTRIAL RADIOGRAPHY, 325 9.1.1
PERSONNEL MONITORING, 325 9.1.2 SELECTED DEFINITIONS, 326 9.1.3 SURVEY
INSTRUMENTS, 327 9.1.4 LEAK TESTING OF SEALED SOURCES, 329 9.1.5 SURVEY
REPORTS, 331 9.2 WORK PRACTICES, 331 9.3
TIME*DISTANCE*SHIELDING*CONTAINMENT, 332 9.4 REGULATORY REQUIREMENTS,
335 9.5 EXPOSURE DEVICES, 335 9.6 STATE AND FEDERAL REGULATIONS, 337 9.7
BASIC RADIOGRAPHIC PHYSICS, 338 9.7.1 INTRODUCTION*ISOTOPE PRODUCTION,
338 9.8 FUNDAMENTAL PROPERTIES OF MATTER, 339 9.9 RADIOACTIVE MATERIALS,
340 9.9.1 STABILITY AND DECAY, 341 9.9.2 ACTIVITY, 341 9.9.3 HALF-LIFE,
342 9.10 TYPES OF RADIATION, 343 9.11 INTERACTION OF RADIATION WITH
MATTER, 346 CONTENTS XVII 9.12 BIOLOGICAL EFFECTS, 348 9.13 RADIATION
DETECTION, 352 9.13.1 SURVEY INSTRUMENTS, 354 9.14 RADIATION SOURCES,
356 9.14.1 ISOTOPE SOURCES, 356 9.15 PORTABLE LINEAR ACCELERATORS, 359
9.16 SPECIAL RADIOGRAPHIC TECHNIQUES, 360 9.17 STANDARD RADIOGRAPHIC
TECHNIQUES, 361 9.17.1 INTRODUCTION, 361 9.17.2 BASIC PRINCIPLES, 363
9.17.3 SCREENS, 364 9.17.4 FILM COMPOSITION, 365 9.18 THE RADIOGRAPH,
365 9.18.1 IMAGE QUALITY, 370 9.18.2 FILM HANDLING, LOADING, AND
PROCESSING, 374 9.18.3 HIGH-INTENSITY ILLUMINATORS, 376 9.19 FLUOROSCOPY
TECHNIQUES, 377 9.20 FLAT PANEL DIGITAL IMAGING SYSTEMS, 378 9.21 FLAT
PANEL SYSTEMS VS. FUJI DYNAMIX CR IMAGING SYSTEM, 379 9.21.1 RESOLUTION,
379 9.21.2 GHOST IMAGES, 380 9.21.3 IMAGE LAG, 380 9.21.4 DARK CURRENT
NOISE, 381 9.21.5 PORTABILITY, 381 9.21.6 TEMPERATURE SENSITIVITY, 381
9.21.7 FLEXIBILITY, 381 9.21.8 FRAGILITY, 381 9.21.9 ADVANTAGES, 381
9.22 INDUSTRIAL COMPUTED TOMOGRAPHY, 382 9.22.1 SCAN PROCEDURE, 382
9.22.2 APPLICATIONS OF INDUSTRIAL COMPUTED TOMOGRAPHY, 383 9.22.3 CT
SYSTEM COMPONENTS, 384 9.23 AUTOMATIC DEFECT RECOGNITION, 387 9.23.1
IMAGING IMPROVEMENTS, 387 9.23.2 LDA DESIGN AND OPERATION, 389 9.23.3
ADR TECHNIQUES, 389 9.23.4 NEURAL NETWORK ARTIFICIAL INTELLIGENCE (AI),
390 9.23.5 RULE BASE USING SPECIFIC ALGORITHMS, 392 9.23.5.1 OPERATING
SEQUENCE, 392 9.23.6 ADR ADVANCES OF A PC PLATFORM OVER PROPRIETARY
HARDWARE, 392 9.23.7 ADR TECHNIQUES, 392 9.23.8 SADR, 392 9.23.9
CONCLUSIONS, 393 9.24 THE DIGITOME PROCESS, 393 CONTENTS 9.24.1
EXAMINATION CONCEPT, 394 9.24.2 DIGITAL FLAT PANEL DETECTOR, 395 9.24.3
IMAGE ACQUISITION, 396 9.24.4 FLAW LOCATION AND MEASUREMENT, 396 9.24.5
OTHER APPLICATIONS, 396 9.25 MANUFACTURING PROCESSES AND
DISCONTINUITIES, 397 9.26 OTHER ISOTOPE APPLICATIONS, 397 9.26.1
ELECTRON CAPTURE DETECTION, 397 9.26.2 MOISTURE GAUGING, 397 9.26.3 BONE
DENSITY, 400 9.26.4 GAMMA AND BETA THICKNESS GAUGING, 401 9.26.5 GAMMA
AND BETA BACKSCATTER THICKNESS GAUGING, 401 9.26.6 GAMMA LEVEL GAUGING,
402 9.26.7 GAMMA DENSITY MEASUREMENT, 402 9.26.8 POINT LEVEL SWITCH, 404
9.26.8.1 FEATURES AND BENEFITS, 405 9.26.9 OIL WELL LOGGING, 405
THERMAL/INFRARED TESTING METHOD 407 10.1 BASIC MODES OF HEAT TRANSFER,
407 10.2 THE NATURE OF HEAT FLOW, 408 10.2.1 EXOTHERMIC AND ENDOTHERMIC
REACTIONS, 408 10.2.1.1 EXOTHERMIC REACTIONS, 408 10.2.1.2 ENDOTHERMIC
REACTIONS, 409 10.3 TEMPERATURE MEASUREMENT, 409 10.4 COMMON TEMPERATURE
MEASUREMENTS, 410 10.4.1 MELTING POINT INDICATORS, 410 10.5 COLOR CHANGE
THERMOMETRY, 411 10.5.1 IRREVERSIBLE COLOR CHANGE INDICATORS, 411 10.5.2
THERMOCHROMIC LIQUID CRYSTAL INDICATORS, 413 10.5.3 LIQUID IN GLASS
THERMOMETERS, 415 10.6 TEMPERATURE SENSORS WITH EXTERNAL READOUTS, 416
10.6.1 THERMOCOUPLE SENSORS, 416 10.6.2 SPECIAL THERMOCOUPLE PRODUCTS,
418 10.6.3 RESISTANCE TEMPERATURE DEVICES (RTDS), 418 10.6.3.1 RTD
SENSING ELEMENTS AND TYPICAL TEMPERATURE RANGES, 418 10.6.4 RESISTANCE
TEMPERATURE ELEMENTS (RTES), 420 10.7 INFRARED IMAGING ENERGY, 420 10.8
HEAT AND LIGHT CONCEPTS, 421 10.9 PYROMETERS, 422 10.9.1 ERROR
CORRECTION, 422 10.9.2 PRINCIPLES OF OPERATION, 423 10.9.2.1 NARROW-BAND
OPTICAL PYROMETERS, 423 10.9.2.2 BROAD-BAND OPTICAL PYROMETERS, 424
10.9.3 DESIGN AND OPERATIONS OF OPTICAL PYROMETERS, 426 10.9.4
APPLICATIONS FOR BROAD-BAND OPTICAL PYROMETERS, 427 10.9.5 INSTALLATION
OF OPTICAL PYROMETERS, 427 10.10 INFRARED IMAGING SYSTEMS, 427 10.10.1
BLACKBODY CALIBRATION SOURCES, 427 10.11 SPACIAL RESOLUTION CONCEPTS,
428 10.11.1 FOV, IFOV, MIFOV, AND GIFOV, 428 10.11.2 ANGULAR RESOLVING
POWER, 428 10.11.3 ERROR POTENTIAL IN RADIANT MEASUREMENTS, 429 10.12
INFRARED TESTING METHOD, 429 10.12.1 PREVENTIVE AND PREDICTIVE
MAINTENANCE PROGRAMS, 429 10.12.2 ELECTRICAL PDM APPLICATIONS, 429
10.12.3 MECHANICAL PDM APPLICATIONS, 430 10.13 HIGH-PERFORMANCE THERMAL
IMAGER FOR PREDICTIVE MAINTENANCE, 430 10.13.1 PREDICTIVE MAINTENANCE
PROGRAM, 431 10.13.2 SPECIFICATIONS, 432 10.13.2.1 THERMAL, 432
10.13.2.2 CONTROLS, 433 10.13.2.3 OPTIONAL FEATURES, 433 10.13.2.4
OTHER, 433 10.14 HIGH-PERFORMANCE RADIOMETRIC IR SYSTEM, 433 10.14.1
INTRODUCTION, 433 10.14.2 APPLICATIONS, 434 10.14.3 THEORY OF OPERATION,
434 10.14.4 OPERATING TECHNIQUE, 436 10.14.5 TYPICAL SPECIFICATIONS, 438
10.15 MIKRON INSTRUMENT COMPANY, INC., 439 10.16 MIKRON 7200V THERMAL
IMAGER AND VISIBLE LIGHT CAMERA, 440 10.16.1 GENERAL FEATURES, 440
10.16.2 TECHNICAL DATA, 440 10.16.2.1 PERFORMANCE, 440 10.16.2.2
PRESENTATION, 441 10.16.2.3 MEASUREMENT, 441 10.16.2.4 INTERFACE, 442
10.17 HIGH-SPEED IR LINE CAMERAS, 442 10.17.1 GENERAL
INFORMATION*MIKROLINE SERIES 2128, 442 10.17.2 HIGH-SPEED TEMPERATURE
MEASUREMENT OF TIRES, 442 10.17.2.1 CAMERA SPECIFICATIONS, 443 10.18
OTHER THERMAL TESTING METHODS, 444 10.18.1 FOURIER TRANSFORM INFRARED
SPECTROMETER, 444 10.18.1.1 DLATGS PYROELECTRIC DETECTORS, 447 10.18.1.2
FTIR EVALUATION OF HARD DISK FLUORORESIN COATING, 447 10.18.1.3
MEASUREMENT OF FILM THICKNESS ON A SILICON WAFER, 448 XX CONTENTS *
10.18.2 ADVANCED MERCURY ANALYZER, 448 10.18.2.1 INTRODUCTION, 448
10.18.2.2 THEORY OF OPERATION, 449 10.18.2.3 SOFTWARE, 450 10.18.3
IDENTIFICATION OF MATERIALS, 450 10.18.3.1 THERMOELECTRIC ALLOY SORTING,
450 10.18.3.2 APPLICATIONS, 453 10.18.4 ADVANTAGES AND DISADVANTAGES,
454 10.18.4.1 ADVANTAGES, 454 10.18.4.2 DISADVANTAGES, 456 11 ULTRASONIC
TESTING 457 11.1 INTRODUCTION, 457 11.2 DEFINITION OF ACOUSTIC
PARAMETERS OF A TRANSDUCER, 458 11.3 NONCONTACTING ULTRASONIC TESTING,
458 11.3.1 NCU TRANSDUCERS, 460 11.3.2 INSTANT PICTURE ANALYSIS SYSTEM,
463 11.3.3 LIMITATIONS, 465 11.3.4 BIOTERRORISM, 466 11.4 ULTRASONIC
PULSERS/RECEIVERS, 466 11.5 MULTILAYER ULTRASONIC THICKNESS GAUGE, 470
11.6 CONVENTIONAL ULTRASOUND, 471 11.6.1 FLAW DETECTION, 473 11.6.2
FREQUENCY, 474 11.6.3 ULTRASONIC WAVE PROPAGATION, 476 11.6.4 ACOUSTIC
IMPEDANCE, 477 11.6.5 REFLECTION AND REFRACTION, 478 11.6.6 DIFFRACTION,
DISPERSION, AND ATTENUATION, 481 11.6.7 FRESNEL AND FRAUNHOFER FIELDS,
482 11.6.8 GENERATION OF ULTRASONIC WAVES, 483 11.6.9 SEARCH UNIT
CONSTRUCTION, 484 11.6.10 TEST METHODS, 489 11.7 ULTRASONIC TESTING
EQUIPMENT, 498 11.7.1 EQUIPMENT OPERATION, 507 11.7.2 FLAW TRANSDUCERS,
509 11.7.2.1 INSTRUMENT FEATURES, 509 11.7.2.2 ULTRASONIC
SPECIFICATIONS, 510 11.7.2.3 PHYSICAL DESCRIPTION AND POWER SUPPLY, 510
11.7.3 TESTING PROCEDURES, 512 11.7.3.1 VARIABLES AFFECTING RESULTS, 517
11.8 TIME-OF-FLIGHT DIFFRACTION (TOFD), 519 CONTENTS XXI 12 VIBRATION
ANALYSIS METHOD 521 12.1 INTRODUCTION, 521 12.2 PRINCIPLES/THEORY, 522
12.2.1 MODES OF VIBRATION, 522 12.2.2 RESONANCE, 523 12.2.3 DEGREES OF
FREEDOM, 524 12.3 SOURCES OF VIBRATION, 524 12.4 NOISE ANALYSIS, 525
12.5 STRESS ANALYSIS, 525 12.6 MODAL ANALYSIS, 526 12.7 VIBRATION
ANALYSIS/TROUBLESHOOTING, 527 12.7.1 ROTATING EQUIPMENT ANALYSIS, 527
12.7.2 ORDER ANALYSIS, 527 12.8 TRANSFER FUNCTIONS, 528 12.9 PREDICTIVE
MAINTENANCE, 528 12.10 FAILURE ANALYSIS, 529 12.11 IMPACT TESTING AND
FREQUENCY RESPONSE, 529 12.12 PASS AND FAIL TESTING, 530 12.13
CORRECTION METHODS, 530 12.13.1 ALIGNMENT AND BALANCE, 530 12.13.2 BEAT
FREQUENCY, 530 12.13.3 VIBRATION DAMPING, 532 12.13.4 DYNAMIC
ABSORBER/INCREASING MASS, 534 12.13.5 LOOSENESS/NONLINEAR MECHANICAL
SYSTEMS, 536 12.13.6 ISOLATION TREATMENTS, 536 12.13.7 SPEED CHANGE, 540
12.13.8 STIFFENING, 540 12.14 MACHINE DIAGNOSIS, 541 12.15 SENSORS, 543
12.15.1 STRAIN GAUGES, 543 12.15.2 ACCELEROMETERS, 544 12.15.3 VELOCITY
SENSORS, 545 12.15.4 DISPLACEMENT SENSORS, 545 12.16 ROLLING ELEMENT
BEARING FAILURES, 547 12.17 BEARING VIBRATION/NOISE, 548 12.18 BLOWERS
AND FANS, 550 12.19 VIBROTEST 60 VERSION 4, 550 12.20 SIGNAL
CONDITIONING, 555 12.20.1 ACOUSTIC FILTERS, 555 12.21 EQUIPMENT RESPONSE
TO ENVIRONMENTAL FACTORS, 555 12.21.1 TEMPERATURE/HUMIDITY, 555 12.22
DATA PRESENTATION, 555 12.22.1 ACCELERATION, VELOCITY, AND DISPLACEMENT,
555 12.22.2 FAST FOURIER TRANSFORM (FFT)/TIME WAVEFORM, 556 XXII
CONTENTS 12.22.3 CEPSTRUM ANALYSIS, 557 12.22.4 NYQUIST FREQUENCY/PLOT,
557 12.22.5 ORBIT, LISSAJOUS, X-Y, AND HYSTERESIS PLOTS, 559 12.23
ONLINE MONITORING, 560 12.23.1 TREND ANALYSIS, 560 12.24 PORTABLE NOISE
AND VIBRATION ANALYSIS SYSTEM, 560 12.24.1 TYPICAL APPLICATIONS, 562
12.24.2 SYSTEM REQUIREMENTS, 562 12.25 LASER METHODS, 562 12.25.1 THEORY
OF OPERATION, 563 12.25.2 APPLICATIONS, 565 12.25.3 SPECIFICATIONS, 566
12.26 TEC S AVIATION PRODUCTS, 567 12.26.1 ANALYZER PLUS MODEL 1700, 567
12.26.1.1 FLEXIBLE SYSTEM, 568 12.26.1.2 USER FRIENDLY, 568 12.26.1.3
EXPANDABILITY, 568 12.26.1.4 QUALITY COMMITMENT, 568 12.26.1.5 ENGINE
FAN BALANCING APPLICATION, 569 12.26.1.6 TECHNICAL SPECIFICATIONS, 569
12.26.2 PROBALANCER ANALYZER 2020, 570 12.26.2.1 SOFTWARE FEATURES, 571
12.26.2.2 TECHNICAL SPECIFICATIONS, 572 12.26.3 VIPER 4040, 572
12.26.3.1 AUTOMATED TRACK AND BALANCING, 572 12.26.3.2 VIBRATION
ANALYSIS, 574 12.26.3.3 ACOUSTIC ANALYSIS, 574 12.26.3.4 TECHNICAL
SPECIFICATIONS, 574 13 VISUAL AND OPTICAL TESTING 575 13.1 FUNDAMENTALS,
575 13.2 PRINCIPLES AND THEORY OF VISUAL TESTING, 576 13.3 SELECTION OF
CORRECT VISUAL TECHNIQUE, 576 13.4 EQUIPMENT, 578 13.4.1 BORESCOPES, 578
13.4.2 JET ENGINE INSPECTION, 581 13.4.3 NUCLEAR APPLICATIONS, 582
13.4.4 OTHER APPLICATIONS, 584 13.5 FIBERSCOPES AND VIDEOSCOPES, 584
13.5.1 APPLICATIONS, 585 13.6 SNAKEEYE* DIAGNOSTIC TOOL, 587 13.7
INDUSTRIAL VIDEOSCOPES, 589 13.7.1 EQUIPMENT AND FEATURES, 589 13.7.2
INSTRUMENT SETUP, 590 CONTENTS XXIII 13.7.3 3D VIEWING, 592 13.7.4
APPLICATIONS, 592 13.7.5 WORKING TOOLS, 592 13.8 PROJECTION MICROSCOPES,
593 13.8.1 LEICA FS4000 FORENSIC COMPARISON MICROSCOPE, 596 13.9 THE
LONG-DISTANCE MICROSCOPE, 600 13.9.1 NEW DEVELOPMENTS, 600 13.9.2 MODEL
K-2 LONG-DISTANCE MICROSCOPE, 601 13.9.2.1 NUMERICAL APERTURE (NA), 604
13.9.2.2 CARE AND CLEANING, 605 13.9.3 INFLNIVAR CFM-2 VIDEO INSPECTION
MICROSCOPE, 605 13.9.4 ACCORDION* MACHINE VISION, 607 13.9.5 INFOCUS
MICROSCOPE ENHANCEMENT SYSTEM, 607 13.9.5.1 SPHERICAL ABERRATIONS, 607
13.9.5.2 INFOCUS CORRECTIONS, 608 13.9.5.3 APPLICATIONS, 608 13.10
INFINIMAX* LONG-DISTANCE MICROSCOPE, 611 13.11 REMOTE VISUAL INSPECTION,
611 13.11.1 INDUSTRIES*APPLICATIONS, 614 13.11.2 CAMERA HEAD OPTIONS,
616 13.11.3 CAMERA PAN AND TILT FEATURES, 617 13.11.4 HAND-HELD
CONTROLLER, 618 13.11.5 CAMERA CONTROL UNIT, 619 13.11.6 HAND-HELD
CONTROLLER DETAILS, 620 13.11.7 APPLICATIONS, 622 13.12 ROBOTIC CRAWLER
UNITS, 623 13.12.1 CONTROL UNIT, 623 13.12.2 CABLE REELS, 623 13.12.3
CRAWLER AND CAMERA OPTIONS, 624 13.12.4 APPLICATIONS, 624 13.13 PIPE AND
VESSEL INSPECTIONS/METAL JOINING PROCESSES, 626 13.14 OCEAN OPTICS
PHOTOMETERS, 629 13.14.1 OPTICAL RESOLUTION, 630 13.14.2 SYSTEM
SENSITIVITY, 633 13.14.3 SPECIFICATIONS, 634 13.14.4 APPLICATIONS, 636
14 OVERVIEW OF RECOMMENDED PRACTICE NO. SNT-TC-IA, 2001 EDITION 639 14.1
PURPOSE, 639 14.1.1 PERSONNEL QUALIFICATION AND CERTIFICATION IN
NONDESTRUCTIVE TESTING 639 14.2 NDT LEVELS OF QUALIFICATION, 640 XXIV
CONTENTS 14.3 RECOMMENDED NDT LEVEL III EDUCATION, TRAINING, AND
EXPERIENCE, 640 14.4 WRITTEN PRACTICE, 641 14.5 CHARTS, 641 14.6
RECOMMENDED TRAINING COURSES, 641 14.6.1 ACOUSTIC EMISSIONS TESTING
METHOD, 641 14.6.2 ELECTROMAGNETIC TESTING METHOD, 643 14.6.3 LASER
TESTING METHODS*HOLOGRAPHY/SHEAROGRAPHY, 644 14.6.4 LASER TESTING
METHODS*PROFILOMETRY, 646 14.6.5 LEAK TESTING METHODS, 646 14.6.6 LIQUID
PENETRANT TESTING METHODS, 648 14.6.7 MAGNETIC PARTICLE TESTING METHOD,
648 14.6.8 NEUTRON RADIOGRAPHIC TESTING METHOD, 649 14.6.9 RADIOGRAPHIC
TESTING METHOD, 651 14.6.10 THERMAL/INFRARED TESTING METHOD, 653 14.6.11
ULTRASONIC TESTING METHOD, 654 14.6.12 VIBRATION ANALYSIS METHOD, 655
14.6.13 VISUAL TESTING METHOD, 656 14.6.14 APPENDIX, 657 14.6.14.1
EXAMPLE QUESTIONS, 657 14.6.14.2 ANSWERS TO EXAMPLE QUESTIONS, 658
14.6.15 A DYNAMIC DOCUMENT, 658 14.6.16 SPECIAL DISCLAIMER, 659 APPENDIX
1: BIBLIOGRAPHY OF CREDITS 661 APPENDIX 2: COMPANY CONTRIBUTORS 667
INDEX 671
|
| any_adam_object | 1 |
| author | Mix, Paul E. |
| author_facet | Mix, Paul E. |
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| discipline | Physik Werkstoffwissenschaften / Fertigungstechnik |
| edition | 2. ed. |
| format | Book |
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| illustrated | Not Illustrated |
| indexdate | 2024-07-09T20:07:17Z |
| institution | BVB |
| isbn | 0471420298 9780471420293 |
| language | English |
| lccn | 2004020584 |
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| publisher | Wiley-Interscience |
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| spelling | Mix, Paul E. Verfasser aut Introduction to nondestructive testing a training guide Paul E. Mix 2. ed. Hoboken, NJ Wiley-Interscience 2005 XXVI, 681 S. txt rdacontent n rdamedia nc rdacarrier Includes index. Contrôle non destructif aNondestructive testing Zerstörungsfreie Werkstoffprüfung (DE-588)4067689-4 gnd rswk-swf Zerstörungsfreie Werkstoffprüfung (DE-588)4067689-4 s DE-604 http://www.loc.gov/catdir/toc/ecip0422/2004020584.html Table of contents GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=013163383&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Mix, Paul E. Introduction to nondestructive testing a training guide Contrôle non destructif aNondestructive testing Zerstörungsfreie Werkstoffprüfung (DE-588)4067689-4 gnd |
| subject_GND | (DE-588)4067689-4 |
| title | Introduction to nondestructive testing a training guide |
| title_auth | Introduction to nondestructive testing a training guide |
| title_exact_search | Introduction to nondestructive testing a training guide |
| title_full | Introduction to nondestructive testing a training guide Paul E. Mix |
| title_fullStr | Introduction to nondestructive testing a training guide Paul E. Mix |
| title_full_unstemmed | Introduction to nondestructive testing a training guide Paul E. Mix |
| title_short | Introduction to nondestructive testing |
| title_sort | introduction to nondestructive testing a training guide |
| title_sub | a training guide |
| topic | Contrôle non destructif aNondestructive testing Zerstörungsfreie Werkstoffprüfung (DE-588)4067689-4 gnd |
| topic_facet | Contrôle non destructif aNondestructive testing Zerstörungsfreie Werkstoffprüfung |
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