Force sensors for microelectronic packaging applications:
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Berlin [u.a.]
Springer
2005
|
| Schriftenreihe: | Microtechnology and MEMS
|
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | VIII, 178 S. zahlr. Ill. |
| ISBN: | 3540221875 |
Internformat
MARC
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Datensatz im Suchindex
| _version_ | 1804132978342756352 |
|---|---|
| adam_text | J. SCHWIZER M. MAYER O. BRAND FORCE SENSORS FOR MICROELECTRONIC
PACKAGING APPLICATIONS WITH 149 FIGURES ^_J SPRINGER CONTENTS
INTRODUCTION 1 1.1 ELECTRICAL INTERCONNECTION METHODS 1 1.2 THE WIRE
BONDING PROCESS 3 1.3 MEASUREMENT APPROACHES FOR BONDING PROCESS
INVESTIGATION .... 10 SENSOR DESIGN 13 2.1 DESIGN CONCEPT 13 2.1.1
PIEZORESISTIVITY 14 2.1.2 SYMMETRY CONSIDERATIONS 18 2.1.3 STRESS FIELDS
28 2.1.4 INTRINSIC STRESS FIELDS 35 2.2 BALL BOND SENSOR : 36 2.2.1
XYZ-FORCE SENSOR 38 2.3 WEDGE BOND SENSOR 46 MEASUREMENT SYSTEM 49 3.1
TEST CHIP 49 3.2 WIRE BONDING SIGNALS AND MEASUREMENT SYSTEM 53 3.2.1
ULTRASONIC SYSTEM 61 CHARACTERIZATION 67 4.1 GENERAL DATA 68 4.2 SENSOR
CALIBRATION 68 4.2.1 CALIBRATION WITH SHEAR TESTER 69 4.2.2 CALIBRATION
WITH GAUGE WEIGHTS 69 4.2.3 CALIBRATION WITH ULTRASOUND FORCE
MEASUREMENTS 70 4.2.4 NOISE / 76 4.2.5 SENSOR TO SENSOR VARIATIONS 76
4.2.6 TEMPERATURE DEPENDENCE OF SENSITIVITY 78 4.3 LINEARITY 79 4.4
PLACEMENT SENSITIVITY 80 4.5 OFFSET 82 4.5.1 TEMPERATURE COEFFICIENT OF
OFFSET 85 4.6 SUMMARY OF TECHNICAL DATA OF THE TEST CHIP 92 VIII
CONTENTS 5 APPLICATIONS 93 5.1 WIRE BONDER DEVELOPMENT 94 5.1.1 PROCESS
MODULE CALIBRATION 95 5.1.2 BONDING SPEED CHARACTERIZATION 107 5.1.3
LONG-TERM STABILITY 112 5.2 BALL BOND PROCESS KNOWLEDGE 115 5.2.1
FRICTION AT CONTACT ZONE 116 5.2.2 FRICTION BETWEEN BALL AND CAPILLARY
117 5.2.3 DEFORMATION 122 5.2.4 COMPARISON WITH OTHER MEASUREMENT
METHODS 127 5.2.5 BOND PROCESS PARAMETER WINDOW 129 5.2.6 COMPARISON
BETWEEN AU-AL AND AU-AU CONTACTS 137 5.3 WEDGE BONDING PROCESS KNOWLEDGE
139 5.3.1 TAIL BREAKING FORCE 140 5.3.2 GOLD - GOLD CONTACT BOND 141
5.3.3 GOLD - ALUMINUM CONTACT BOND 151 5.4 FLIP-CHIP APPLICATION 154
5.4.1 THERMAL CYCLING 155 6 CONCLUSIONS AND OUTLOOK 159 ABBREVIATIONS,
SYMBOLS, AND DEFINITIONS 161 REFERENCES 165 SUBJECT INDEX 175
|
| any_adam_object | 1 |
| author | Schwizer, Jürg Mayer, Michael Brand, Oliver 1964- |
| author_GND | (DE-588)123279216 |
| author_facet | Schwizer, Jürg Mayer, Michael Brand, Oliver 1964- |
| author_role | aut aut aut |
| author_sort | Schwizer, Jürg |
| author_variant | j s js m m mm o b ob |
| building | Verbundindex |
| bvnumber | BV019616457 |
| callnumber-first | T - Technology |
| callnumber-label | TK7874 |
| callnumber-raw | TK7874 |
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| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4100 ZQ 3120 |
| ctrlnum | (OCoLC)249654136 (DE-599)BVBBV019616457 |
| dewey-full | 621.381046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Physik Elektrotechnik / Elektronik / Nachrichtentechnik Mess-/Steuerungs-/Regelungs-/Automatisierungstechnik / Mechatronik |
| format | Book |
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| id | DE-604.BV019616457 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T20:01:24Z |
| institution | BVB |
| isbn | 3540221875 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-012945950 |
| oclc_num | 249654136 |
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| owner | DE-898 DE-BY-UBR DE-83 |
| owner_facet | DE-898 DE-BY-UBR DE-83 |
| physical | VIII, 178 S. zahlr. Ill. |
| publishDate | 2005 |
| publishDateSearch | 2005 |
| publishDateSort | 2005 |
| publisher | Springer |
| record_format | marc |
| series2 | Microtechnology and MEMS |
| spelling | Schwizer, Jürg Verfasser aut Force sensors for microelectronic packaging applications J. Schwizer ; M. Mayer ; O. Brand Berlin [u.a.] Springer 2005 VIII, 178 S. zahlr. Ill. txt rdacontent n rdamedia nc rdacarrier Microtechnology and MEMS Prozessüberwachung - Kraftsensor - Drahtbonden - Flip-Chip-Technologie Microelectronic packaging Wire bonding (Electronic packaging) Drahtbonden (DE-588)4232596-1 gnd rswk-swf Flip-Chip-Technologie (DE-588)4427284-4 gnd rswk-swf Kraftsensor (DE-588)4165452-3 gnd rswk-swf Prozessüberwachung (DE-588)4133922-8 gnd rswk-swf Prozessüberwachung (DE-588)4133922-8 s Kraftsensor (DE-588)4165452-3 s Drahtbonden (DE-588)4232596-1 s Flip-Chip-Technologie (DE-588)4427284-4 s DE-604 Mayer, Michael Verfasser aut Brand, Oliver 1964- Verfasser (DE-588)123279216 aut HEBIS Datenaustausch Darmstadt application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=012945950&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Schwizer, Jürg Mayer, Michael Brand, Oliver 1964- Force sensors for microelectronic packaging applications Prozessüberwachung - Kraftsensor - Drahtbonden - Flip-Chip-Technologie Microelectronic packaging Wire bonding (Electronic packaging) Drahtbonden (DE-588)4232596-1 gnd Flip-Chip-Technologie (DE-588)4427284-4 gnd Kraftsensor (DE-588)4165452-3 gnd Prozessüberwachung (DE-588)4133922-8 gnd |
| subject_GND | (DE-588)4232596-1 (DE-588)4427284-4 (DE-588)4165452-3 (DE-588)4133922-8 |
| title | Force sensors for microelectronic packaging applications |
| title_auth | Force sensors for microelectronic packaging applications |
| title_exact_search | Force sensors for microelectronic packaging applications |
| title_full | Force sensors for microelectronic packaging applications J. Schwizer ; M. Mayer ; O. Brand |
| title_fullStr | Force sensors for microelectronic packaging applications J. Schwizer ; M. Mayer ; O. Brand |
| title_full_unstemmed | Force sensors for microelectronic packaging applications J. Schwizer ; M. Mayer ; O. Brand |
| title_short | Force sensors for microelectronic packaging applications |
| title_sort | force sensors for microelectronic packaging applications |
| topic | Prozessüberwachung - Kraftsensor - Drahtbonden - Flip-Chip-Technologie Microelectronic packaging Wire bonding (Electronic packaging) Drahtbonden (DE-588)4232596-1 gnd Flip-Chip-Technologie (DE-588)4427284-4 gnd Kraftsensor (DE-588)4165452-3 gnd Prozessüberwachung (DE-588)4133922-8 gnd |
| topic_facet | Prozessüberwachung - Kraftsensor - Drahtbonden - Flip-Chip-Technologie Microelectronic packaging Wire bonding (Electronic packaging) Drahtbonden Flip-Chip-Technologie Kraftsensor Prozessüberwachung |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=012945950&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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