Molded interconnect devices: 6th International congress, 22nd - 23rd September 2004, Erlangen, Germany
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Bibliographic Details
Format: Conference Proceeding Book
Language:English
Published: Bamberg Meisenbach 2004
Subjects:
Physical Description:287 S. Ill., graph. Darst.
ISBN:387525208x

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Interlibrary loan Place Request Caution: Not in THWS collection!