APA (7th ed.) Citation

(2004). Molded interconnect devices: 6th International congress, 22nd - 23rd September 2004, Erlangen, Germany. Meisenbach.

Chicago Style (17th ed.) Citation

Molded Interconnect Devices: 6th International Congress, 22nd - 23rd September 2004, Erlangen, Germany. Bamberg: Meisenbach, 2004.

MLA (9th ed.) Citation

Molded Interconnect Devices: 6th International Congress, 22nd - 23rd September 2004, Erlangen, Germany. Meisenbach, 2004.

Warning: These citations may not always be 100% accurate.