Metal based thin films for electronics:
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | German |
| Veröffentlicht: |
Weinheim
Wiley-VCH
2003
|
| Ausgabe: | 1. ed. |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | X, 378 S. Ill., graph. Darst. |
| ISBN: | 3527403655 |
Internformat
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| 245 | 1 | 0 | |a Metal based thin films for electronics |c Klaus Wetzig ... (eds.) |
| 250 | |a 1. ed. | ||
| 264 | 1 | |a Weinheim |b Wiley-VCH |c 2003 | |
| 300 | |a X, 378 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 4 | |a Dünne Schicht - Metallschicht - Elektroniktechnologie - Mikroelektronik | |
| 650 | 4 | |a Metallic films | |
| 650 | 4 | |a Thin films | |
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Datensatz im Suchindex
| _version_ | 1806052680219492352 |
|---|---|
| adam_text |
Titel: Metal based thin films for electronics
Autor: Wetzig, Klaus
Jahr: 2003
Contents
1 Introduction.1
Klaus Wetzig, Claus M. Schneider
2 Thin Film Systems: Basic Aspects.7
2.1 Interconnects for Microelectronics.7
Ralph Spolenak, Ehrenfried Zschech
2.1.1 Introduction.7
2.1.2 Metallization Layers.8
2.1.3 Materials Science of Metallic Interconnects. 12
2.1.4 Function of Barrier and Nucleation Layers and Materials Selection.23
2.2 Metallization Structures in Acoustoelectronics.25
Manfred Weihnacht
2.2.1 Introduction.25
2.2.2 Fundamentals of Surface Acoustic Waves.26
2.2.3 Interdigital Transducers (IDTs).36
2.2.4 Reflector Gratings.40
2.2.5 Waveguides, Energy Trapping.41
2.2.6 Multistrip Couplers .41
2.3 Silicide Layers for Electronics.42
Joachim Schumann
2.3.1 Introduction.42
2.3.2 The Basic Chemical and Physical Properties.43
2.3.3 Preparation of Silicides .49
2.3.4 Silicides with Metallic Conductivity.56
2.3.5 Semiconducting Silicides.58
2.3.6 Heterogeneously Disordered Silicide Films.62
2.4 Complex Layered Systems for Magnetoelectronics.65
Claus M. Schneider
2.4.1 Introduction.65
2.4.2 Magnetism: A Primer.66
2.4.3 Magnetic Coupling Phenomena.68
2.4.4 Electric Transport in Layered Magnetic Systems.76
2.4.5 Functional Thin Film Systems.85
2.5 Multilayer and Single-Surface Reflectors for X-Ray Optics.93
Hermann Mai, Stefan Braun
2.5.1 Introduction.93
2.5.2 Refraction and Reflection at Single Boundaries.94
2.5.3 BRAGG Reflection at ID Lattice Systems.99
2.5.4 Multilayer Preparation.108
References.112
VIII
Contens
3 Thin Film Preparation and Characterization Techniques
Thin Film Prepa
Christian Wenzel
3.1 Thin Film Preparation Methods.121
121
3.1.1 Introduction.
3.1.2 Physical Vapor Deposition. ^
3.1.3 Chemical Vapor Deposition.
3.1.4 Non-Vacuum Based Deposition.136
3.1.5 Outlook.140
3.2 Electron Microscopy and Diffraction.'40
Klaus Wetzig, Jurgen Thomas
3.2.1 Transmission Electron Microscopy (TEM) - Imaging.140
3.2.2 TEM - Selected Area Electron Diffraction.148
3.2.3 In situ-SEM Methods.1^0
3.2.4 Electron Backscatter Diffraction.'55
3.3 X-Ray Scattering Techniques.'58
Michael I/ecker
3.3.1 Wide Angle Diffraction.159
3.3.2 Reflectometry.169
3.3.3 Soft X-Rays and Magnetic Scattering.122
3.4 Spectroscopic Techniques.175
Klaus Wetzig
3.4.1 Element Distribution Analysis.175
3.4.2 Element Depth Profile Analysis.183
3.5 Stress Measurement Techniques.189
Winfried Briickner
3.5.1 Stress and Strain.190
3.5.2 Substrate Curvature.193
3.5.3 Measurement Techniques.195
References.200
4 Challenges for Thin Film Systems Characterization and Optimization.205
4.1 Electromigration in Metallization Layers.205
Ralph Spalenak, Horst Wendrock, Klaus Wetzig
4.1.1 Fundamentals.205
4.1.2 Methods for Quantitative Damage Analysis.208
4.1.3 A1 Interconnects.211
4.1.4 Cu Interconnects.215
4.2 Barrier and Nucleation Layers for Interconnects.222
Ehrenfried Zschech
4.2.1 Introduction.222
4.2.2 PVD Barrier Layers for Copper Interconnects.223
4.2.3 Barrier/Seed Microstructure and Step Coverage.229
4.2.4 New Barrier/Seed Concepts using CVD and ALD.l.Z!!!!.[".".""".'.233
4.2.5 Atomic Layer Deposition (ALD).31""'.'.'.'.'."."'."".'.".".234
4.3 Acoustomigration in Surface Acoustic Waves Structures.235
Siegfried Menzel, Klaus Wetzig
Contens IX
4.3.1 General Remarks.235
4.3.2 Acoustomigration Mechanism.236
4.3.3 Metallization Concepts for Power SAW Structures.237
4.3.4 Experimental Set-up.240
4.3.5 Acoustomigration Experiments.243
4.4 Thermal Stability of Magnetoresistive Layer Stacks.251
Claus M. Schneider, Jiirgen Thomas
4.4.1 Metallic Multilayers as GMR Model Systems.252
4.4.2 Co/Cu Multilayers.252
4.4.3 Ni80Fe2o/Cu Multilayers.260
4.5 Functional Magnetic Layers for Sensors and MRAMs.263
Hartmut Vinzelberg, Dieter Elefant
4.5.1 Magnetic Multilayers: Layer Thickness Dependence of the GMR Parameters .263
4.5.2 Spin Valves.268
4.5.3 Magnetic Tunnel Junctions.273
4.6 M ultilayers for X-Ray Optical Purposes.277
Hermann Mai, Stefan Braun
4.6.1 Multilayers as Reflectors for X-Rays.277
4.6.2 Real Structure of nm-Multilayers.279
4.6.3 High-Resolution Multilayers.287
4.6.4 Multilayers with Uniform and Graded Period Thickness.291
4.7 Functional Electric Layers.292
Joachim Schumann, Jiirgen Thomas
4.7.1 Resistance Layers.292
4.7.2 Thermoelectic Thin Films.301
References.308
5 Devices.317
5.1 Devices Related Aspects for Si Based Electronics.317
Ehrenfried Zschech
5.1.1 Interconnect Technology and Materials Trends for Memory and Logic Products317
5.1.2 Copper Inlaid Process: Process Integration and Materials Related Topics.318
5.1.3 Wiring Hierarchy for Copper/Low-K on-Chip Interconnects.319
5.1.4 New Global Interconnect Concepts.321
5.2 SAW High Frequency Filters, Resonators and Delay Lines.321
Manfred Weihnacht
5.2.1 Introduction.321
5.2.2 Transversal Filters.322
5.2.3 Resonators.325
5.2.4 Filters with Spread Spectrum.328
5.2.5 Delay Lines.329
5.3 Sensor Devices.330
Christoph Treutler
5.3.1 Introduction.330
5.3.2 Requirements for Thin Films to be Used as Transducers.330
5.3.3 Thin Film Strain Gauges for Pressure Sensors and Force Meters.331
Contens
5.3.4 Thin Film Thermometer in a Micromachined Air-Mass Flow Meter for
Automotive Applications.333
5.3.5 Magnetic Thin Films for Measuring Position, Angle,
Rotational Speed and Torque.334
5.3.6 Conclusions and Outlook.341
5.4 X-Ray Optical Systems.342
Hermann Mai, Stefan Braun
5.4.1 Basic Properties of the Combination of X-Ray Optical Elements.342
5.4.2 X-Ray Astronomy.343
5.4.3 X-Ray Microscopy.345
5.4.4 Extreme Ultraviolet Lithography (EUVL).346
5.4.5 X-Ray Reflectometry and Diffractometry.348
5.5 Thermoelectric Sensors and Transducers.349
Joachim Schumann
5.5.1 Introduction.349
5.5.2 Thermoelectric Energy Conversion - Some Basic Considerations.350
5.5.3 Thermoelectric Sensors.350
5.5.4 Thermoelectric Transducers.356
5.5.5 Outlook.361
References.361
6 Outlook.365
Klaus Wetzig, Clans M. Schneider
'¦"lex. |
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| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
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| dewey-search | 621.38152 |
| dewey-sort | 3621.38152 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | 1. ed. |
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| illustrated | Illustrated |
| indexdate | 2024-07-31T00:34:14Z |
| institution | BVB |
| isbn | 3527403655 |
| language | German |
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| spelling | Metal based thin films for electronics Klaus Wetzig ... (eds.) 1. ed. Weinheim Wiley-VCH 2003 X, 378 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Dünne Schicht - Metallschicht - Elektroniktechnologie - Mikroelektronik Metallic films Thin films Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Dünne Schicht (DE-588)4136925-7 gnd rswk-swf Elektroniktechnologie (DE-588)4402723-0 gnd rswk-swf Metallschicht (DE-588)4252858-6 gnd rswk-swf Dünne Schicht (DE-588)4136925-7 s Metallschicht (DE-588)4252858-6 s Elektroniktechnologie (DE-588)4402723-0 s Mikroelektronik (DE-588)4039207-7 s DE-604 Wetzig, Klaus Sonstige oth HBZ Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=010344307&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Metal based thin films for electronics Dünne Schicht - Metallschicht - Elektroniktechnologie - Mikroelektronik Metallic films Thin films Mikroelektronik (DE-588)4039207-7 gnd Dünne Schicht (DE-588)4136925-7 gnd Elektroniktechnologie (DE-588)4402723-0 gnd Metallschicht (DE-588)4252858-6 gnd |
| subject_GND | (DE-588)4039207-7 (DE-588)4136925-7 (DE-588)4402723-0 (DE-588)4252858-6 |
| title | Metal based thin films for electronics |
| title_auth | Metal based thin films for electronics |
| title_exact_search | Metal based thin films for electronics |
| title_full | Metal based thin films for electronics Klaus Wetzig ... (eds.) |
| title_fullStr | Metal based thin films for electronics Klaus Wetzig ... (eds.) |
| title_full_unstemmed | Metal based thin films for electronics Klaus Wetzig ... (eds.) |
| title_short | Metal based thin films for electronics |
| title_sort | metal based thin films for electronics |
| topic | Dünne Schicht - Metallschicht - Elektroniktechnologie - Mikroelektronik Metallic films Thin films Mikroelektronik (DE-588)4039207-7 gnd Dünne Schicht (DE-588)4136925-7 gnd Elektroniktechnologie (DE-588)4402723-0 gnd Metallschicht (DE-588)4252858-6 gnd |
| topic_facet | Dünne Schicht - Metallschicht - Elektroniktechnologie - Mikroelektronik Metallic films Thin films Mikroelektronik Dünne Schicht Elektroniktechnologie Metallschicht |
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