Proceedings: [IMAPS, 1998 proceedings CD-ROM]
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IMAPS, International Microelectronics and Packaging Society
1998
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Datensatz im Suchindex
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| adam_text | Table
of Contents
Session MAI
Wireless Applications
Session Chairs:
Susant
Patra,
Center
ţor
Wireless Communications UCSD
lohn Gipprich,
Xort/jrop Grumman Corporation
Embedded ^ aveguide Filters for Microwave and
Wireless Applications using Cotired Ceramic
Technologies
|nhn Gippnch, D. Stevens, M. Hageman,
Л.
Piioto,
Xort.Oroť
Grummet: Corporation , Kawthar A. Zakl, Y.
Rong, l. nilersil) of Maryland
Using Microcontrollers in Portable Systems
CamQuynh Nguyen, Motorola
Mechanical Redesign of a Commercial Filter-
Plate Component in a Transmit Amplifier Unit to
Assure Robust RF Performance Over Temperature
Robert . K-otlowitz, Wing S. Liu,
Lidia
Λί.
Ambroszkicwic?, lucent Technologies
Technological Aspects of Wafer Process and
Packaging Interconnections of Power MOSFKTs
for Low Voltage Applications
Y. Mohammed
bvasem,
Y. Ho. Î
ishap-Siticonix
Electronic Product Design System™ EPDeS™ A
N
FAX International Initiative
Don Brown, iniernationai Wireless Packaging
Consortium 1
Session MA2
Printed Wiring
&
Laminated Technology
Session Chairs:
[eftrev K. Kennedy, Mamifjcturers Services
Bill G. Pctensh,
li .
/.
Gore C> .Associates
A Method of Determining the [Equivalent Thermal
Conductivity of a Conductive Printed Wiring
Board
,ΤΛΧ Β,
Layer with a Quasi-Random
Circular Hole Pattern
Mark
Λ.
Pilic,
-jriii-r--
- .1
Ij.cf.fr-d
Martin Compatì)
Signa!
Integrít .
Considerations for High Speed
Data Transmission ;n a Printed Circuit Board
Svsten;
Gitarr
Ржі.
To-
Cohen, bó-cie Roth^rem.
Т гЛ.п-..
Thermal Analysis of Printed Circuit Boards for
Infrared Reflow Soldering
Hiroki Uchida, Seiki Sakuyama, Katsuhide Xaton,
Motonobu Kawaracia, [ujitsit I.aboratories iJd.: Reijiro
Akai, hiijitsu
Ltd.
Imprint Patterning of Organic and Inorganic
Substrates, an Advantageous New System
George
Grégoire,
Dimensionai
Cirants
Corp.
The Fabrication and Reliability of a Photovia Test
Vehicle for MCM-L Applications
Suixin Zhang, M. Yereeken, |. Dc Bacts. A. Van Calster;
t.l-ISITľCC-IMHC:
|. Peeters. K. .VJiaert. Alcatel-Rrll
Session MA3
Materials Characterizations
Session Chairs:
Susan X.
Bagen,
. it/ienniuw
Microtech,
bic.
Alvin
H.
Weinberg,
Pacesetter, Inc.
Creep Relaxation of Pb-Sn-ln Solder Alloys in
Soldered Assemblies
W.K. Jones, Milind P. Shah, Y.Q. Liu, Honda
Interna¬
tiona/
і
nirersit)
Alternate Safe Solvents in Hybrid Circuit Process¬
ing
Anthony
Riso. Rossi
Technolog)
Corp.
Stresses in LTCC Substrates Due to Glob Top
Encapsulation
Brett Goldstein. Kevin Donovan.
/:
I
1.
Inc.
Mold Compound Filler Induced Metal Crush in
Plastic Encapsulated Devices with Die Overcoat
Prasad
V. Yalamanchih, Yhel
Baltazar.
Analog D-i-icts
Inc.
Statistical Experimental Design for Optimizing
Integrated Capacitor Fabrication
Gary S. Mar. Thongchal Thongvigitm.uiec, Georgia
Institut
o] Technolog
Table
of Contents
Session MA4
Mfg. Optimization
&
Laser Processing
Session Chair
Stacey
Opp,
L,-J Communications
Laser Processing in the Microelectronics Industry
Steven M. Nagao, Todd R. Thacker, L-3 Communica¬
tions Systems
-
West
Laser Drilling and Pattern Processing for MCM-L
Prototyping
Zsolt Illyefalvi-Vitéz,
M.
Ruszinkó, J.
Pinkola,
Technical
University of
Budapest
Laser
Soldered High Density Cable Assemblies
for Portable Electronics
Mark Wojcicki, AMP Incorporated;
Ryszard J.
Pryputniewicz, Worcester Polytechnic Institute
Effective Recruiting and Training in Mexico
Doug Allday,
Kyocera
America, Inc.
Bonding on the Border: A case study in strategic
utilization of microelectronic capital assets
John Riley,
Vertek
International Inc.
Session MA5
Emerging Technologies
&
MEMs Devices
Session Chairs:
Alan P.
Genis,
Northern Illinois University
Ronald J. Jensen, Honeywell, Inc.
DMD™ Packaging
-
Evolution and Strategy
Jeff Fans, Thomas
Kocián,
Texas Instruments
Ultra-High Efficiency Light Emitting Diodes
Through Epitaxial Lift-off Packaging
Mike Sickmiller, Alex Pike, Luan Vo, Steve Jacobs, Eli
Yablonovitch,
ELO
Technologies, Inc.
High Density and Heterogeneous Packaging of
MCMs by Epitaxial Liftoff Technology
Mike Sickmiller, Alex Pike, Steve Jacobs, Eli
Yablonovitch,
ELO
Technologies, Inc.
Etching and Exfoliation Techniques for the
Fabrication of
3-D
Meso-Scales Structures on
LTCC Tapes
Jorge
Santiago-Aviles,
Jaiyung Park,
Patricio
Espinoza-
Vallejos, University of Pennsylvania; Luis Sola-Laguna,
DuPont Experimental Station
Developing a Material Set for High Temperature
Superconducting Multilayer Modules
Paul M. Anderson, A. W. Lindner, StratEdge Corp.;
P.M. Chau, University of California, San Diego;
A.D.
Smith, TRW Space
ύ
Electronics Group
Non-contact LSI-package Solder-joint Inspection
Method using an Electro-optic Probe
Masayuki Yojima, Hajime Kuzumi, Takeshi Nishiyama,
NEC Corporation
Session MA6
Advanced Technology Power Packaging
Session Chairs:
Fred D. Barlow, Virginia Polytechnic Institute
<&
State
University
Dave Kellerman, Material Solutions
A Compact Low Voltage High Current Power
Supply for Digital Applications
Fred D. Barlow, Aicha Elshabini, Virginia Polytechnic
Institute
&
State University
Ceramic Design and Reliability Issues in Assem¬
bly of RF
/
Microwave Power Packages
Philip M. Fabis, Norton Diamond Film
Power Electronics Packaging of Low Profile
Module Integrated Converters for Photovoltaic
Applications with Improved Reliability
Mike Meinhardt, H. Schneider, J. Flannery, PEI
Technologits-NMRC; Th.
Krieger,
P.
Zacharias,
¡SET
A Four-Dimensional Road-Mapping Framework
for Power Packaging Technology
Douglas C. Hopkins, Stale University of New York;
Sean
Cian
О
Mathuna, PEI
Technologier,
Arnold
N.
Alderman, International Rectifier
The Lincoln High Density Radar Receiver
Enclosure: Thermal and Power Systems Design
David Johnson, Jeffrey S. Palmer, Larry L.
Retherford,
MIT Lincoln Laboratory
Management of High Power Densities in Hybrid
Design
Glenn
Sýkora,
L.
Gleason, J. O Shea, R. Pabich,
Ohmite Manufacturing
Xl
Table
of
Contents
Session MPI
RF
&
Microwave Applications
Session Chairs:
Michael
A.
Stein,
Electro-Science Labs, Inc.
Aicha A.R. Elshabini, Virginia
Polytechnic Institute
<&
State
University
Microwave Characterization and Modeling of
Multilayered Cofired Ceramic Waveguides
Daniel Stevens, John Gipprich, Northrop Grumann
Corporation
New Microwave Applications for Thick Film
Thermistors
Alvin
Feingold, R.L. Wahlers,
P. Amstutz,
С
Huang,
S.J. Stein; Electro-Science Labs, Inc.; J. Mazzochette,
EMC Technology Inc.
Filled Via Hole Fences for Crosstalk Control of
Microstrip
lines in LTCC Packages
George E. Ponchak, NASA Lewis Research Center,
Donghoon Chen, Jong-Gwan Yook, Linda P.B. Katehi,
University of Michigan
Multi-layer Interconnections in Silicon MCMs
Charles E. Free, Middlesex University, Alan Hydes,
Andrew Grantham,
Melanie Blanfield,
Christine
Vizard, Defence Evaluation and Research Agency;
Colin S. Aitchison, Ming Chen, Brunei University
Integrated Passive Components Using Low
Temperature Cofired Ceramics
Wolfram Wersing, S. Gohlke, R.
Matz, W.
Eurskens, V.
Wannenmacher,
Siemens
AG
Session MP2
Flexible Tape Interconnects
Session Chairs:
Bruce M. Romenesko, The Johns Hopkins University/APL
Robert
С
Mason, DuPont Electronics
Transition of MCM-C Applications to MCM-L
Using Rigid Flex Substrates
James Keating, Teledynt Electronic Technologies
2-Metal Layer Tape: The Next Generation in BGA
and CSP Substrates
Gary R.
Weihe,
S
heldahl
Micro Products
Thermo-Mechanical Behaviors of Flexible
Substrates
Sheng Liu,
Minŕu
Lu,
Zhengfang Qian, Wayne State
University; Ron Li, Larry Poglitsch, Motorola Inc.
Development of 0.025mm Pitch
Anisotropie
Conductive Film
Fuyuki Eriguchi, Masako Macda, Fumiteru
Asai,
Yuji
Hotta, Nitto
Denko
Corporation
New Adhesives for High Density Flip-chip
Interconnections
Dominique
Wojciechowski,
Jan
Vìnfìeteten,Unipersity
of Gent, EUS/TFCG-IMEC; Elisabeth Reese, Hans-
Werner
Hagedorn,
W.
С.
Heraeus
Session MP3
Materials Technology
Session Chairs:
Robert H.
Heistand, AVX
Corp.
Craig Schuckert, DuPont Electronics
Evaluation of a Novel Polyimide for Use as a
Low-Loss, Low Dielectric Constant Interlayer in
Electronic Packaging Applications
Debra Dunson, M.S. Sankarapandian, H. Oyama, J.
Webster, F. D. Barlow III, A. Elshabini, J.E. McGrath,
Virginia Polytechnic and State University
Polybenzoxazole
(PBO)
Based Dielectrics for
MCM
and On-Chip Applications
R. Sezi, A. Maltenberger, W. Radiik, G.
Schmid,
A.
Weber, Siemens
AG;
К.
Buschick, Berlin Technical
University
RAD-COAT™: An Innovative Coating Technol¬
ogy for Space Microelectronics Applications
Michael Featherby, David J.
Strobel,
Raymond Grimes,
Phillip Layton, Space Electronics Inc.
Development of Ultra-low Fire COG and X7R
Dielectric Compositions for Multilayer Ceramic
Chip Capacitor and Integrated Passive Compo¬
nent Applications
Brian C. Foster, Walter J.
Symes,
Ferro
Corporation
A New Ag/Pd Conductor for Automotive
Applications
David J.
Malanga,
Mary Levitsky, Andy London, Brent
Smith, Heraeus Incorporated, Cermal/oy Division
Xli
Table
of
Contents
Session MP4
Advanced
Manufacturing Processes
Session Chairs:
Thomas
Green,
National
Training Center
for
Microelectronics
Sandy Boyd, Air Products and Chemicals, Inc.
The Gel Plating Process for Selective Gold
Metallization of Electronic Packages
Lynne
M.
Svedberg,
Kenneth
С.
Arndt, Michael
J.
Cima,
Massachusetts Institute
of
Technology
Screen Printing Process Design of Experiments for
Fine line Printing of Thick Film Ceramic
Substrates
Jianbiao Pan, Gregory L. Tonkay, Alejandro
Quintero,
Lebigb University
Extending the Capabilities of Existing Bonding
Equipment Through the Use of CAD
David L. Sultanik,
Kulicie
and
Soffa
Industries, Inc.
A Total Process Module Approach to Advanced
Flip-Chip Underfill Dispense
&
Cure
James Carbin, James W. Reilly, Robert H. Hoffman,
Asymtek
Low Cost Bumping by Stencil Printing: Process
Qualification for
200 um
Pitch
Joachim Kloeser,
Katrin
Heinricht, Erik Jung, Rolf
Aschenbrenner, Fraunhofer
IZM;
Liane
Lauter, Andreas
Ostmann,
Herbert Reichl, Technical University of Berlin
Planarizadon and Automation Issues in Large-
Area Material Deposition Using Meniscus
Coating
Alan Krauss, Edward W.
Kamen,
Georg/a
Institute of
Technology
Session MP5
BGA
Session Chairs:
Don Place, Scientific Sealing Technology
Rajen
Chanchani,
Sandia
National Laboratories
The Development of a Modular
32
Bit
Microcontroller
MCM
in Top Bottom BGA (TB-
BGA) Technique
Rudolf
Leutenbauer,
Kourosh
Amiri
Jam, Herbert
Reichl,
Fraunhofer
Institute FhG/lZM-Berlin
Modelling the Effect of Microstructure in BGA
Joints
Steve
Holden, E.R. Wallach,
Cambridge University
Design, Analysis, and Measurement of a Cost
Effective Plastic Ball Grid Array Package
-
NuBGA
John H.
Lau, Tony
Chen, Express Packaging Systems,
Inc.; Tai-Yu
Chou, Sun
Microsystems
Flux-Free Process for Placement and Attach of
Solder Balls to Wafers, Flip Chips and
AU BGA
Packages
Richard Ramos, Scientific Sealing Technology
Session MP6
High Density Power
&
Optoelectronic
Solutions
Session Chairs:
Heike
Thiede, MicroModule Systems
(MMS)
Andrew
Strandjord,
Doa
Chemical Co.
Multilayer Interconnects for a High Power
Packaging Strategy
Alex Lostetter, F. Barlow, A. Elshabini, Virginia
Polytechnic Institute and State University
Integrated Low Cost Power
MCM
Technology
Rolf Linden, Larry Duncan, ELMO Semiconductor/
Kimball Electronics Group, Inc.; Richard Fryhoff,
FutureCom
High Frequency Electrical Characterization of a
High Wiring Density Organic Substrate
ALIVH™ and a Stud Bump Bonding
SBB™
H.
Iwaki,
Y.
Taguchi,
T. Shiraishi, Y.
Bessho,
K. Eda,
Matsushita Electric Industrial Co., Ltd.
Multilayer Motherboard Technology in MCM-Si
with Opto-Electronic Features
Herbert
De Pauw,
H. De
Smet,
J. Vanfleteren, J.
Lernout,
A. Van
Calster,
EUS
-
TFCG
I 1MEC
Packaging
Technology
for Surface Mountable,
Low-profile Fiber Optic Transmitter and Receiver
Atsuhiro Kawatani, Kanji Shuke, Kazuhiko
Kuráta,
Ryouichi Nagaoka, NEC Corporation; Hiroyuki
Fujimi, NEC Engineering, Ltd.
Integration of 45-degree Micro-couplers in Guided-
wave Optical Clock Distribution System for
Supercomputer
Jianhua Gan, Linghui Wu, Hongfa Luan, Bipin
Bihari,
Ray T. Chen,
University
of Texas at Austin
ХШ
Table
of Contents
Session
TAI
RF
&
Microwave Materials
Session Chairs:
Ron Barnett, Lucent Technologies
Daniel I. Amey, E. I. DuPont
Modeling and Characterization of Multiple
Coupled lines in Multilayer Structures Using
FDTD
Yoonsuk Kim,
A. Tripartii,
R.K.
Settatori,
A.
Weisshaar, V.K.
Tripathi, Oregon State University
A New Thick-Film Technology for mm-Wave
MCM
and Microwave Devices
Charles E. Free, Middlesex University; Peter G.
Barnwell, Heraeus Inc.; Colin S. Aitchison, Brunei
University
MCM
plus Multilayer Printed Circuit Board at
12-
14
GHz
Claude
Drevôn,
Gilles Naudy,
Daniel
Roques,
Laurence
Albo,
Jean Luc Lacoste,
Bernard Cogo,
Francois Dubos,
Augustin Coello Vera, Akatei
Espàce
Insertion of CVD Diamond in GaAs and Si RF
/
Microwave Packages
Philip M. Fabis, Norton Company
Microwave Devices on
AIN
-
Ceramics for High
Frequencies
Günter Reppe,
Matthias
Große,
Kadeberger
Hybridelektronik GmbH; Christel
Kretzschmar,
Fraunhofer-Institute
for Ceramic Technologies and Sinter
Materials; Aribert
Scheffel, Rosenberger Meßtechnik
GmbH
Sachsen
Photoimageable Silver Cofireable Conductor
Compatible with
951
Green Tape™
Michael Skurski, Michael A. Smith, Richard R. Draudt,
Daniel I. Amey, Samuel J. Horowitz, Michael J.
Champ, DuPont
Microcircuit
Materials
Session TA2
Buildup Technology (Japanese Translated)
Session Chairs:
Fumio Miyashiro, Toshiba Chemical Corp.
Charles E. Bauer, TechLead Corporation
High Density MLB using Additive and Build-up
Process
Ryo Enomoto, Motoo
Asai,
Naohiro Hirose,
Ibiden
Co.,
Ud.
New High Density Substrates with Buried Bump
Interconnection Technology(B2it™)
Yoshitaka Fukuoka,
Toru Oguma,
Youichi Tahara,
Toshiba Corporation
Finer
Micro-via PWB
by Laser and Additive
Process
Ryo Maniwa, NEC Tqyama Corporation
Build-up PWB with Laser-Processed Via Holes
VIL
Keiji Segawa, Victor Company of Japan, Limited
PWB Using Mechanically Pre-drilled Metal Clad
Film for rVH and Build-up PWB with Laser Via
Hole for Semiconductor Package Substrate
Shigeharu Arike, Kazuhisa Otsuka, Naoyuki Urasaki,
Akishi Nakaso, Katsuji Shibata, Kazuhito Kobayashi,
Kouichi Tsuyama, Kuniji Suzuki, Hajime Nakayama,
Hitachi Chemical Co., Ltd.
Highly Accelerated Stress Test and Reliability
Analysis for Build-up Circuits
Yoshinori Miyazawa, Tsuneo Shirotsuki, Hisashi
Sugai,
Fujitsu Limited; Yasuhiro Yoneda, Fujitsu Laboratories
Limited
Session
ТАЗ
Integrated Passives
Session Chairs:
Timothy Lenihan, Sheldahl
Nicholas Biunno, Zycon Corporation
Routes to Embedded Inductors in MCM-L
Technology
-
Design, CAD and Manufacturing
Issues
Stephen O Reilly, Maeve Duffy, Sean
Cian O Mathuna,
PEÍ
Technologier,
Steve Payne,
Kam
Circuits
Fabrication and Performance of Integrated
Capacitors on Silicon and Flexible Substrates
David Nelms, Richard
Ulrich,
Leonard
Schaper, Ben
Bowen, University of Arkansas (HiDEC)
Multilayer Cofired RC s for Line Termination
Andrew
Ritter,
Allen
Templeton, Benjamin
Smith,
AVX Advanced Product
&
Technology Center
Metal-Containing Polymer-Based Composites for
Resistor and Thermistor Applications
Xiaomei
Xi, Lutz
Brandt, Goran Matijasevic, Sam
Fu,
Pradeep Gandhi, Dan Baxter, Greg Owings; Ormet
Corporation
XIV
Table
of Contents
Manufacture of Embedded Integrated Passive
Components into Low Temperature Co-Fired
Ceramic Systems
Ted Valentine, Steve Scrantom,
Greg Gravier, Scrantom
Engineering, Inc.; David Pehlke, Brian
Schiffer,
Rockwell Science Center
Thick Film Screen-Printable Buried Resistors
Robert C. Mason, Patrick J.
Bolton
,
DuPont Electronics
Session TA4
Thermo-Mechanical Modeling
Session Chair:
Paul K.U. Wang, Engineering Simulation Technology Inc.
Molecular Dynamics and Discrete Element
Modeling Studies of Underfill
Nancy E. Iwamoto, M. Li, Johnson Mattbey; S.J.
McCaffery, M. Nakagawa, G. Mustoe, Colorado School
of Mines
Highly Accurate Stress Analysis in Thin Film
Multi-layer Interconnections
Shinya Iijima, Masatoshi Takenouchi, Kishio Yokouchi,
Yasuhiro Yoneda, Fujitsu Laboratories Ltd.
Nonlinear Finite Element Modeling of Brazing a
Die to a Diamond Substrate
Yuchun Peng, R.P. Selvam,
W
F. Schmidt,
M.H.
Gordon,
К.
V.
Lohrmann, R.R. Reynolds,
University of
Arkansas
The Effect of
Metal
Vias
on the Mechanical
Properties of Cofired Ceramics: Three Dimen¬
sional Considerations
Kristen
M.
Hiñes,
Unic.
of Maryland /Nortbop
Grumman; Donald Barker, Univ. of Maryland
A Parametric Study of Flip Chip Reliability Based
on Solder Fatigue Modelling: Part II
-
Flip Chip
on Organic
Scott Popelar,
1С
Interconnect
An Analytical Comparison of the Thermal
Performance of Various Ball Grid Array Packaging
Technologies
Paul Harvey, 3M Electronic Products Division
Session TA5
CSP Reliability
Session Chairs:
Reza
Ghaffarian, Jet Propulsion Laboratory
Robert Crowley,
Redpoint
Research
Board Level Reliability of Chip Scale Packages
Z. P. Wang, Y.M. Tan,
K.M.
Chua, Gintic Institute of
Manufacturing Technology
Reliability Performance Assessment and Charac¬
terization of Fine Pitch Mold Array BGA
Trent A. Thompson,
Elisa
Huang, Jeannie Miller,
Chris Vargas, Motorola Semiconductor Products Sector
High Solder Joint Reliability; u*BGA Packages
with Polymer Die Attach Films
Masazumi
Amagai, Kiyoshi
Yajima, Texas Instruments-
Japan
Reliability and Fatigue life Prediction of
Mounted CSP
Tomotoshi Sato, Kazumi Tanaka, Masato Sumikawa,
Chiyoshi Yoshioka, Keiji Yamamura, Takashi Nukii,
Sharp Corp.
-
Production Technology Development Center
Real Time Warpage Measurement of a Plastic
BGA by Projected Grating Method
Sheng Liu, Xiaoyuan He, Wayne State University
Session TP1
Digital TV
&
Digital Display Developments
Session Chairs:
Paul M. Chau, University of California, San Diego (UCSDJ
Sati Banerjee,
Rockwell Semiconductor Systems
A Paper-white Chip-based Display
MCM
Package
for Portable IT Products
Geert
Van Doorselaer, Bert Dobbelaere,
Miroslav
Vrana,
Xiaohong Xie,
Nadine
Carchon, Jean Van den
Steen,
Jan Vanfleteren, Herbert
De Smet,
Dieter
Cuypers,
André
Van Calster,
EUS
-
TFCG
/
IMEC
Digitizing American Television
Gerald Clark, Tiernan Communications, Inc.
Digital Television Signal Processing and Display
Technology
David Ecdes, Yong Zhang, Sony
XV
Table
of
Contents
Brief Overview of the Evolution of and Technol¬
ogy for High Definition Television
Sati Banerjee,
Rockwell Semiconductor Systems
Legacy Television in an HDTV Environment
John
A. Eldon,
Faircbild Semiconductor
Materials Issues in Flat Panel Displays: Phosphor
Selection and Optimization
Joanna McKittrick,
M.E. Kassner,
University of
California at San Diego; L.E. Shea,
Sandia
National
Laboratory
Session TP2
Reliability
Session Chairs:
John R. Devaney, Hi-Re/ Laboratories
William Brockett, Lockheed Martin Electronics
<&
Missiles
Analyzing MCM-C Multilayer Defects by Using
Acoustic Micro Imaging
Gabor
Harsanyi, L.
Pércsi,
Technical University of
Budapest; J.E. Scmmens, S.R. Martell, Sonoscan Inc.; E.
Tóth, Elektroprint
Ltd.
The Effects of Heat Spreader Surface Treatment
and Adhesives on the Package Reliability of 304-
Pin High Power
BGA(L3BGA)
I. S. Park, I. S. Kang, J. S. Kim, S. J. Heo,
C. J.
Song,
LG
Semicon Co., Lid.
Reliability in Large Area Solder Joint Assemblies
and Effects of Thermal Expansion Mismatch and
Die Size
Jun
He, W. L. Morris, M.
С
Shaw,
N.
Sridhar,
Rockwell Science Center, J. C. Mather, Rockwell Collins
Inc.
Improvement in Thermal Reliability in Gold-
Aluminum Bonds Encapsulated in Bi-phenyl
Epoxy Resin
Tomahiro
Uno,
Shinichi Terashima,
Kozo
Onoue,
Kohei Tatsumi, Nippon Steel Corporation
The Effect of Ionic Impurities on Electrochemical
Migration Failure Reliability of
Microcircuits
Gabor
Harsanyi, Technical University of Budapest
Substrate Cleanliness Study in the Screen Printing
of Thick Film Ceramic Substrates
Gregory Tonkay, Jianbiao Pan, Kannachai Kanlayasiri,
Lebigh University
A Square Ring on Square Ring (SoS) Ceramic
Strength Testing Technique for VLSI Packaging
Angelo Villani,
Digital Equipment Corporation
Session
ТРЗ
Wirebonding
Session Chairs:
Lee R.
Levine,
КеУЅ
Packaging Materials Group
Leroy
Christie, Amkor Electronics
Wirebonding on Multilayer Circuits for Automo¬
tive Applications Using Robust Thick-film
Conductors
Adam
Schubring,
D. H. R.
Sarma,
M.
E.
Webster,
Delphi Delco Electronics Systems
Shear Testing
Large
Diameter Aluminum Wedge
Bonds: Its Importance and Lack of Standards
Michael McKeown, Gary
Silverberg,
Orthodyne
Electronics
Gold Bonding Wire
-
The Development of Low
Loop, Long Length Characteristics
Heiner Lichtenberger,
Henry Grohman,
Gery
Lovitz,
Michael Zasowski, Williams Advanced Materials
Single Chip Bumping
Matthias Klein, H. Oppermann, Technical
Univers^
of
Berlin;
Rolf Aschenbrenner,
H.
Reich!, Fraunhofer
Institute
for Reliability
and Microintegration IZM
Ber/in
Comparison of Stud Bump Bonding Technology
and Other Flip-Chip Technologies
Masahiro
Ono,
T. Shiraishi, Y.
Bessho,
K. Eda, T.
Ishida, Matsushita Electric
Industrial Co., Ltd.
Wirebonding:
Re-Inventing the Process for MCMs
H. K. Charles, Jr.,
K. J. Mach, R. L.
Edwards,
A. S.
Francomacaro, S. J. Lehtonen, J. S. DeBoy,
The Johns
Hopkins University
-
Applied Physics Laboratory
Session TP4
Thermal Materials
&
Substrates
Session Chairs:
Chris Schaffer,
Hughes Space eb Communications
David L.
Saums,
Power Devices, Inc.
Development, Evaluation, and Implementation of
Thermally Conductive Component Attach
Adhesives in Inline Curing SMT Assembly
Processes
Leonard R. Enlow, Dale W. Swanson, Boeing
XVI
Table
of Contents
Low Outgassing, High Thermal Conductivity
Greases
Ron Hunadi, Rich Wells, Tbermoset Plastics, Inc.
A Novel Composite Substrate with High Thermal
Conductivity for CSP,
MCM,
and Power Modules
Koichi Hirano, Seiichi Nakatani, Jun ichi
Kato,
Matsushita Electric Industrial Co.,
Ljd.
Development of Low Cost, Sintered Al-SiC
Composites
Shin-ichi Yamagata, Makoto
Imamura, Yoshiyuki
Hirose, Yugaku Abe, Yoshishigo
Takáno,
Aldra
Fukui,
Sumitomo Electric Industries, I^td.
Aluminum Matrix Composite Heat Sinks for
Microchips and
Microcircuits
Ranganath Saraswati, Frank J. Polese, Polese Company
Aluminum Silicon Carbide (AlSiQ for Thermal
Management Solutions and Functional Packaging
Designs
Mark Occhionero, Robert A. Hay, Richard W. Adams,
Kevin P. Fennessy, Ceramics Process Systems Corp.
Session TP5
Flip Chip
&
Underfill
Session Chairs:
Theodore G. Tessier, Microsystems Engineering
Corey Koehler, Motorola, Inc.
How to Select Underfill Materials for Solder
Bumped Flip Chips on Low Cost Substrates?
John H.
Lau,
Chris Chang, Express Packaging Systems,
Inc.
The Great Underfill Race
Ken Gilleo, David Blumel, Alpha Metals/ Cookson
Reworkable Flip Chip Underfill
-
Materials and
Processes
Luu T. Nguyen, P. Fine, B. Cobb, National Semiconduc¬
tor Corp.; Q.
Tong,
В.
Ma, A. Savoca, National Starcb
&
Chemical
Au-Al
Solid Phase Diffusion Flip Chip Bonding-
Desirable Composition of Au-Al Intermetallic
Compound for Stable Bonding
Miki
Mori, Yukio Kizaki, Yumi Fukuda, Atsuko Iida,
Masayuki
Saito,
Toshiba Corporation
Chip-on-Glass: An Economic Approach to High-
Density Chip Level Packaging
Jerry E.
Sergent,
Alvin
Wells, TCA, Inc.
Thermal Efficient Three Dimensional Semicon¬
ductor Packages for High Performance Processor
Modules
William Ahearn, The Panda Project, Inc.
Session WAI
Medical Electronics
Session Chairs:
Martin Greenfield,
AG
Technology
Frank Polese, Polese Company
Flip Chip Interconnection of
DNA Chip
Devices
Tim LeClair, Alan Harper, Scott Graham, Don Ackley,
Nanogen, Inc.
Stacked Packaging Techniques for Use in Hearing
Aid Applications
Ted Paczkowski, Mike Erickson,
HEI
Inc.
Developing
a Non
Hermetic
1С
Package Strategy
for Implantable Pacemakers
Lary
Larson, Jeff Galvin, Micro-Rel
Chip Size Package
-
The Option of Choice for
Miniaturized Medical Devices
Michael Toepper, C. Karduck,
С
Meinherz, L. Hoster,
P.
Coskina,
H.
Reichl, TU-Berlin/FhG-IZM;
M.
Schaldach, Micro Systems Engineering GmbH; S.
Fehlberg, K. Heinricht,
V.
Bader, A. Kloeser, O.
Ehrmann, Fraunhofer IZM Berlin
Deployment of
State-of-the-Art Technology
for
Implantable
Medical
Systems
Max Schaldach, Micro Systems Engineering GmbH; J.
Muller; M. Toepper, H. Reichl, Technical
University of
Berlin;
О.
Ehrmann, Fraunhofer IZM Berlin; M. Starke,
Biotronick GmbH; T. Tessier, Micro Systems Engineering,
Inc.
Thick
Film Sensors - New Trend in Hybrid
Technology
Jan Krejci,
Mikhail Primovich,
Krejci Engineering, Ivan
Szedndiuch, Miroslav Pradka, Technical
University of
Brno
xvii
Table
of
Contents
Session WA2
Thin/Thick FUm
Technologies
Session Chairs:
David
D Ambra, DuPont
Pbotopolymer
я!?
Electronic
Materials
Paul
V.
Galletta,
Teiedyne Electronic Technologies
Adhesion of Thick Film Copper Conductors
-
PartIV
Charles Y. Kuo, CTS Corporation
Small Thick Film Solder Pad Testing
Mike Erickson,
НЕЇ,
Inc.; Robert C. Mason, Patrick J.
Bolton,
DuPont Electronics
Fast Sinter Thick Film Resistor Compositions
M.E. Ellis, Delphi-Delco Electronics Systems
Processing of Photoimageable Thick Film
Materials
James
L
Wood, Chuck Sabo, Andy London, Peter
Barnwell, Heraeus
Incorporateti,
Cermalloy Division
High Density Thick Film Multilayers with Ag-
based Conductors
Miroslav Vrana, J.
De Baets, A.
Van
Calster, IMEC;
I.
Born,
D. Detemmerman,
C
-МАС
Electromag
Low Dielectric
Constant
Thick Film Silver and
Gold Systems Characterization for High Fre¬
quency Ceramic Substrates
Dave Kellerman, Material Solutions; David J. Nabatian,
Peter Bokalo, Feng He, EMCA-Ri/nex
Producir,
Larry
Retherford, MIT
Lincoln laboratory, Fred Barlow,
Aicha Elshabini, Virginia Tech
Session
W
A3
Reliability Testing/Evaluation
Session Chairs:
Mary McDonald, Individual Solution Options
I Quality Services
E. Bruce Hultmark
Mechanical Cycling Fatigue of PBGA Package
Interconnects
Larry
Leicht,
Andrew Skipor, Motorola, Inc.
The Effect of Solder Joint Geometry on Electronic
Package Reliability
Joy
Warde, E.R. Wallach,
Cambridge University
Extended Evaluations of Commercial Off-the-
Shelf (COTS) Plastic Encapsulated
Microcircuits
(PEMs) in Simulated SMT Soldering Processes,
Temperature Cycling, THB, and High-Temperature
Storage
Leonard R. Enlow, Dale W. Swanson, Boeing
A Study of Copper Migration in Simulated
Humidity Environments and Accelerated Testing
of Protective Coatings for Electronic Circuit
Boards
Pooja Shukla, Mass. Institute of Technology; Rashima
Shukla, AL-LH.X
Variable Leak Rate Phenomena in Glass to Metal
Seals
Robert Clarke, Teiedyne Electronic Technologies; Aaron
DerMarderosian, Raytheon
Session WA4
Thermal Design
&
Applications
Session Chain
Ajay P. Malshe, University of Arkansas (HiDEC-MEEG)
Pentium®
Π
Processor Packaging
-
Thermal
Management of SRAM s in a S.E.C. Cartridge
Chia-Pin
Chiu,
Ram Viswanath, Gary L. Solbrekken,
Intel Corporation
A 10-Gb/s Palm-size Optical Transceiver/
Receiver Set with Novel Cooling Structure for
WDM sub-Tb/s ATM Switch System
Ryuusuke Kawano, Naoaki Yamanaka, Seishou
Yasukawa, Katsuhiko Okazaki, Nl
1
Network Service
System Laboratories
Transient Thermal Analysis of a Power Amplifier
Module
Abdolreza Langari, Hassan Hashemi, Rockwell
Semiconductor
Thermal Management of Power Electronics
Modules Packaged by a Stacked-Plate Technique
Shad! Haque, William A. Stinnitt, Douglas J. Nelson,
Guo-Quan
Lu,
Virginia Tech
Compressible Gas-Cooled Micro-channel Heat
Sink Board (Substrates)
Maurice Marongiu, MJM Engineering; B. Kusha, G.S.
Fallon,
FLUENT, Inc.
XVIII
Table
of Contents
Session WA5
CSP Technologies
Session Chairs:
Robert L. Hubbard, Medtronic
-
Micro-Re/
Charles E. Bauer, TtctiLtad Corporation
Ceramic CSP
-
The Characteristics and the
Advantages
Shigeto Takeda, Masanao Kabumoto, Masahiro Fukui,
Kyocera
Corporation, Japan
Wafer Level Chip Scale Packaging
-
Solder Joint
Reliability
Luu T. Nguyen,
N.
Kelkar, T.
Kao,
A. Prabhu, H.
Takiar, National Semiconductor Corp.
A CSP Optoelectronic Package for Imaging and
Light Detection Applications
Avner Badihi, I. Shweky,
S
bt¡least, Ltd.
Development of Ultra Thin Package
Jiro
Nakano,
Katushi Yoshimitsu, Nobuhito Suzuya,
Yokoi Tetsuya, Morihiko Ikemizu, Seiichi Funakoshi,
Toshiba Corporation
Overload Fracture of Area-Array Package Solder
Joints
Roman Katchmar,
Norte/
Area-Array Interconnection Using Stud-Bump-
Bonding
Masahiro
Ono,
T. Shiraishi, Y.
Bessho,
K. Eda, T.
Ishida, Matsushita
Electric Industrial Co., Ltd.
Session WP1
Developments in Intelligent Transportation
Session Chair:
Nina
Babiarz,
Technology Management, Inc.
Engine Technology Advancements
Ronald W. Stence, Motorola
Enabling Semiconductor Technologies for
Automotive Systems
Ross Bannatyne, Motorola
Travel Behaviors and Remote Sensing
J. Arnold
Torma,
Bernard Arroyo,
Katţ
Okitsu
ó
Associates
Advanced Transportation Technologies Go to Bat
for Rural Transit
Joseph F.
Masso,
Maxwell Technologies, Inc.; Marc A.
Bernard, Howard E. Griffith,
£71;,
Inc.; Brian Albee,
Sonoma County Transit
Bringing Multiplex
Databus
Interface and other
ITS Technologies to Market
Kennedy Gammage, Directed Electronics, Inc.
Session WP2
Advanced Ceramic Substrate Technologies
Session Chairs:
Richard E. Sigliano,
Kyocera
America, Inc.
Harry Kellzi, Teledyne Electronic Technologies
Optimization of Via Connections between
Transmission Lines in Multilayer LTCC-Modules
Torsten Thelemann,
Heiko Thust,
Thomas Lingel,
Technical University of
Ilmenau
Effect of Processing Variables on the Co-Fired
Properties of Thick Film Resistors in LTCC
Michael Ehlert, Patrick S. Munoz; National Semicon¬
ductor Corporation
Properties of dc magnetron sputtered nickel-
chromium alloy thin films
Ronald S. Nowicki, Integrated Processing; James E.
Turlo, KLA-Tencor
New Laser Processing Techniques for Thick-
&
Thin-Film Circuit Manufacturing
Edward J. Swenson, Yunlong Sun, Electro Scientific
Industries, Inc.
Advances in Ceramic Substrate Technology for
Implantable Medical Electronics
Richard E. Sigliano, Edward Graddy,
Kyocera
America,
Inc.;
Alvin
Weinberg,
St.
Jude
Medical CRMD
Session WP3
Systems Reliability
Session Chairs:
Giulio DiGiacomo, IBM
Microelectronics
Craig Bourassa,
Kyocera
America
A Systems Approach to Specifying a High Reli¬
ability, High Quality Thick Film Passive Compo¬
nent for Hybrid,
Mulo-Chip
Module and Surface
Mount Applications
Paul T. Solan, Phillip Creter, Stephen H. Olster, Mini-
Systems, Inc.
XIX
Table
of Contents
System Reliability
Nihal Sinnadurai, TWi
Reliability Study of Conductive Interconnections
in Multilayer Hybrid Integrated Structures
Jan
Urbancik, Natasa Urbancikova,
Milos Somora,
Technical University of
Kosice
Moisture Absorption and Stress in Die Attach
Adhesives
James T. Huneke, Lauren Goebel, Deborah Forray,
Carl
E. Hoge,
Jack Zhang, DexterCorporation/
Quantum Materials
Several Reliability-Related Mechanics Problems
in Flip-Chip Packages
Sheng Liu, Jianjun Wang, Zhengfang Qian, Wayne State
University
Session WP4
Sensors
Session Chairs:
David W. Galipeau, South Dakota State University
John A. Olenick, Eastman Kodak Co.
Package Quality Testing Using Integrated
Pressure Sensor
Marc Waelti,
N.
Schneeberger,
H. Baltes,
ΕΤΗ
Hoenggerberg;
О.
Paul, University of Freiberg
Electronic Packaging of Imaging Modules
U
sama
К.
Abdali, Bryan Beaman, Terry
Clas,
John
Olenick, Eastman Kodak Company
Thick Film NTC Thermistor Series for Sensor
and Temperature Compensation Applications
Luis Sola-Laguna, Paul J. Moffett, John R. Larry,
DuPonl; Jacob Hormadaly, BenGurion University of the
Negev
Application of the Thick Film Technology to
Design of the
3
Dimensional Solid Steel Sensor
Boris Kamentser, Jane Kamentser,
Bokám
Engineering
Inc.
The New Thick
-
Film Intelligent Glucose
Biosensors Applied in some Medical Measurement
Devices
Janusz
Gondek, Private Research
Ú·
Development Centre
for Electronics; S. Hodorowicz, Jagicllonian University;
M. Ciez, W. Zaraska, R&D Centre for Hybrid Microelec¬
tronics and Resistors
Hot-Layer-Electrochemistry Sensor Realisation
using LTCC
Torsten Voss,
Peter
Gründler,
University of Rostock,
Department of Chemistry;
Torsten Thelemann,
Technical
University of
Ilmenau
Session WP5
Thermal Modeling
&
Processes
Session Chairs:
Vivek Mansingh, Applied Thermal Technologies, Inc.
Matt Gordon, University of Arkansas
Multi-Scale Thermal Modeling of MicroChannel
Cooled Laser Diode Arrays
Enchao Yu,
Andrzej Przekwas, CFD
Research Corp.
Accurate Ball Grid Array Thermal Performance
Prediction Utilizing Direct Numerical Simulation
William J. Marsh, Ohbin Kwon, Northrop Grumman
Corporation
Neural Network-Based Distributed Thermal
Calculators
Luu T. Nguyen, S. Vikram,
N.
Jeeves, H. Takiar,
National Semiconductor Corp.
Interfacial
Thermal Resistance
-
Method of
Measurement and Impact of Adhesive
Raymond L. Dietz, S. Anagnastopoulos, Diemat, Inc.;
D.P.H.
Hasselman,
Virginia Polytechnic Institute
A Testing Apparatus for Thermal Interface
Materials
Russell S. Aoki, Chia-Pin
Chiu,
Intel Corporation
Appendix
Organizational Members
XX
|
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