Thermal testing of integrated circuits:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Boston
Kluwer Academic Publishers
2002
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| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | xiv, 204 p. ill. : 25 cm |
| ISBN: | 1402070764 |
Internformat
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| 245 | 1 | 0 | |a Thermal testing of integrated circuits |c by Josep Altet and Antonio Rubio |
| 264 | 1 | |a Boston |b Kluwer Academic Publishers |c 2002 | |
| 300 | |a xiv, 204 p. |b ill. : 25 cm | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 500 | |a Includes bibliographical references and index | ||
| 650 | 4 | |a Integrated circuits |x Testing | |
| 650 | 4 | |a Integrated circuits |x Thermal properties | |
| 650 | 4 | |a Temperature measurements | |
| 650 | 0 | 7 | |a Testen |0 (DE-588)4367264-4 |2 gnd |9 rswk-swf |
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| 700 | 1 | |a Rubio, Antonio |e Sonstige |4 oth | |
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Datensatz im Suchindex
| _version_ | 1804129409476591616 |
|---|---|
| adam_text | THERMAL TESTING OF INTEGRATED CIRCUITS BY JOSEP ALTET UNIVERSITY
POLITECNICA DE CATALUNYA AND ANTONIO RUBIO UNIVERSITY POLITECNICA DE
CATALUNYA FF* KLUWER ACADEMIC PUBLISHERS BOSTON / DORDRECHT / LONDON
CONTENTS ACKNOWLEDGEMENTS XI PREFACE HUE 1. INTRODUCTION TO THE TESTING
OF INTEGRATED CIRCUITS 1 1. INTRODUCTION 1 2. NATURE AND MODELLING OF
REALISTIC DEFECTS 3 2.1 CLASSIFICATION OFDEFECTS 3 2.2 REALISTIC DEFECT
MODEIS 5 2.2.1 DEFECT MODEL FOR A GOS 5 2.2.2 BRIDGING DEFECT MODEIS 6
2.2.3 OPEN DEFECT MODEIS 6 2.3 DEFECTIVE BEHAVIOURS AT THE ELECTRICAL
LEVEL 8 2.3.1 GATE OXIDE SHORT DEFECTS 8 2.3.2 BRIDGING DEFECT 8 2.3.3
OPEN DEFECTS 9 2.3.4 CONCLUSIONS 9 3. FAULT MODELS AND CONVENTIONAL
TESTING STRATEGIES 10 3.1 FAULT MODEIS 10 3.2 CONVENTIONAL TEST
STRATEGIES 11 4. PRACTICAL ASPECTS OF TESTING INTEGRATED CIRCUITS 12 4.1
TEST PATTERN GENERATION 1 3 4.2 DESIGN FOR TESTABILITY AND TEST
STANDARDS 13 4.3 BUILT-IN SELF-TESTING 14 4.4 THE COST OF TESTING 14 V
VI CONTENTS 5. FUTURE PERSPECTIVES OF CONVENTIONAL TEST STRATEGIES 15
5.1 IDDQ TESTING 15 5.2EVOLUTION OF SEMICONDUCTOR TECHNOLOGY AND ROLE
OFI DD Q TESTING IN DEEP SUBMICRON CIRCUITS 17 6. CONCLUSIONS AND SCOPE
OF THIS BOOK 18 7. REFERENCES 19 2. THERMAL TRANSFER AND THERMAL
COUPLING IN IC S 23 1. INTRODUCTION: HEAT TRANSFER AND ITS RELATION TO
THERMODYNAMICS 23 2. MECHANISMS OF HEAT TRANSFER 25 2.1 THE CONDUCTION
MECHANISM 25 2.1.1 THERMAL RESISTANCE 27 2.1.2 CONTACT RESISTANCE 29 2.2
THE CONVECTION MECHANISM 31 2.2.1 NATURAL CONVECTION 31 2.2.2 FORCED
CONVECTION 32 2.3 THE RADIATION MECHANISM 32 3. ENERGY BALANCE IN A
MEDIUM: HEAT TRANSFER EQUATION 35 4. THERMAL ELEMENTS IN IC S 37 4.1
HEAT SOURCES 37 4.1.1 PASSIVE COMPONENTS 38 4.1.2 ACTIVE DEVICES 38
4.1.3 POWER DISSIPATION DUE TO SWITCHING ACTIVITY 39 4.1.4 PELTIER
EFFECT 40 4.2 IC STRUCTURE: MATERIALS AND TRANSFER 41 5. EFFECTS OF
HEATER TRANSFER IN IC S 42 5.1 TEMPERATURE SENSITIVITY OF ELECTRONIC
DEVICES 42 5.1.1 TEMPERATURE EFFECTS IN MOS TRANSISTORS 42 5.1.2 P-N
JUNCTION DIODES 43 5.1.3 BJT DEVICES 44 5.2 AGEING MECHANISMS AND
CIRCUIT DEGRADATION 45 6. CONCLUSIONS 47 7. APPENDIX: UNITS AND
CONVERSION FACTORS 48 8. REFERENCES 49 3. THERMAL ANALYSIS IN INTEGRATED
CIRCUITS 53 1. INTRODUCTION 53 2. DEFINITIONS 54 2.1 THERMAL ANALYSIS
VERSUS ELECTRO-THERMAL ANALYSIS 54 CONTENTS VU 2.2 BOUNDARY CONDITIONS
55 2.2.1EXAMPLE 1: APPLICATION OF BOUNDARY CONDITIONS FOR AN IC ANALYSIS
56 3. THERMAL ANALYSIS OF INTEGRATED CIRCUITS 58 3.1 ANALYTICAL METHODS
59 3.1.1EXAMPLE 2: PRESENTATION OF THE METHOD. CALCULATION OF A STATIC
TWO-DIMENSIONAL TEMPERATURE MAP 60 3.1.2EXAMPLE 3: CALCULATION OF A
THREE-DIMENSIONAL TIME DEPENDENT TEMPERATURE MAP 64 3.1.3 EXAMPLE 4:
THERMAL ANALYSIS IN CYLINDRICAL COORDINATES 67 3.1.4 EXAMPLE 5: AC
THERMAL ANALYSIS 70 3.1.5 EXAMPLE 6: ANALYSIS OF MULTI-LAYER STRUCTURES
73 3.2 NUMERICAL METHODS 78 3.2.1 FINITE DIFFERENCE METHOD 78 3.2.1.1
NODAL EQUATION EXTRACTION 79 3.2.1.2 RC MODELLING OF HEAT TRANSFER 84
3.2.1.3 REDUCTION OF THE COMPLEXITY IN THERMAL ANALYSIS OF IC S 85 4.
ELECTRO-THERMAL ANALYSIS OF INTEGRATED DRCUITS 91 4.1.1 EXAMPLE 7:
DYNAMIC ELECTRO-THERMAL PROCEDURE 92 5. CONCLUSIONS AND SUMMARY 94 6.
REFERENCES 94 4. TEMPERATURE AS A TEST OBSERVABLE VARIABLE IN ICS 97 1.
INTRODUCTION 97 2. MODIFICATION OF THE THERMAL PATH BETWEEN THE HEAT
SOURCES AND THE HEAT SINK 99 2.1 EXAMPLE 1: THERMAL TESTING OFTHE
QUALITY OF SOLDER JOINTS. 100 2.2EXAMPLE 2: THERMAL TESTING OFTHE
QUALITY OFPACKAGES 102 3. MODIFICATION OF THE HEAT SOURCES PRESENT IN
THE IC 116 3.1 IDENTIFICATION OFDEFECTS AS HEAT SOURCES 117 3.1.1
EXAMPLE 1: POWER DISSIPATED IN DIFFERENT BRIDGE TOPOLOGIES 119 3.1.2
EXAMPLE 2: EFFECTS OF DEVICE SCALING AND DEGRADED LOGIC LEVELS. 121
3.1.3EXAMPLE 3: POWER DISSIPATED IN CMOS COMBINATIONAL CIRCUITS WITH A
GOS DEFECT. 123 3.1.4 CONCLUSIONS 124 3.2 THERMAL DISTURBANCES GENERATED
BY HEAT SOURCES 125 3.2.1 DYNAMIC THERMAL CHARACTERISATION 125 3.2.2
STATIC THERMAL CHARACTERISATION 129 VLLL CONTENTS 3.3 LOCATION OF THE
HEAT SOURCE 131 3.3.1 AMPLITUDE MEASUREMENTS 132 3.3.2 PHASE
MEASUREMENTS 132 3.3.3 RISE TIME AND DELAY MEASUREMENTS 134 4. SUMMARY
136 5. REFERENCES 136 5. THERMAL MONITORING OF IC S 139 1. INTRODUCTION
139 2. OPTICAL METHODS 141 2.1 CONTACT METHODS 141 2.1.1 LIQUID CRYSTAL
THERMOGRAPHY 141 2.1.1.1 PRINCIPLE OF OPERATION 141 2.1.1.2 TECHNIQUE
PERFORMANCE 143 2.1.2 FLUORESCENT MICROTHERMOGRAPHY 144 2.1.2.1
PRINCIPLE OF OPERATION 144 2.1.2.2 TECHNIQUE PERFORMANCE 144 2.2
NON-CONTACT METHODS 145 2.2.1 INFRARED EMISSION THERMOGRAPHY 145 2.2.1.1
PRINCIPLE OF OPERATION 146 2.2.1.2 TECHNIQUE PERFORMANCE 147 2.2.2
THERMOREFLECTOMETERS 148 2.2.3 INTERFEROMETERS 154 3. MECHANICAL METHODS
158 4. BUTLT-IN TEMPERATURE SENSORS 161 4.1 ABSOLUTE TEMPERATURE SENSORS
162 4.2 DIFFERENTIAL TEMPERATURE SENSORS 169 5. CONCLUSIONS 179 6.
REFERENCES 181 6. FEASIBILITY ANALYSIS AND CONCLUSIONS 185 1.
INTRODUCTION 185 2. FEASIBILITY ASPECTS OF THE THERMAL TESTING OF
CIRCUITS 187 2.1 COST ESTIMATION 187 2. 2 DISCRIMINABILITY ANALYSIS 19 0
2.2.1HEAT SOURCES IN FAULT-FREE CIRCUITS: GENERATION OF THERMAL
DISTURBANCES 190 2.2.2 DISCRIMINABILITY 195 2.2.3 STRATEGIES TO IMPROVE
THE FEASIBILITY OF THERMAL TESTING 195 2.2.4 GENERATION OF TEST VECTORS
196 3. GENERAL CONCLUSIONS 198 4. REFERENCES 199 CONTENTS IX INDEX 201
|
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| indexdate | 2024-07-09T19:04:41Z |
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| isbn | 1402070764 |
| language | English |
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| physical | xiv, 204 p. ill. : 25 cm |
| publishDate | 2002 |
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| spelling | Altet, Josep Verfasser aut Thermal testing of integrated circuits by Josep Altet and Antonio Rubio Boston Kluwer Academic Publishers 2002 xiv, 204 p. ill. : 25 cm txt rdacontent n rdamedia nc rdacarrier Includes bibliographical references and index Integrated circuits Testing Integrated circuits Thermal properties Temperature measurements Testen (DE-588)4367264-4 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Thermodynamische Eigenschaft (DE-588)4126056-9 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 s Thermodynamische Eigenschaft (DE-588)4126056-9 s Testen (DE-588)4367264-4 s DE-604 Rubio, Antonio Sonstige oth GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009945410&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Altet, Josep Thermal testing of integrated circuits Integrated circuits Testing Integrated circuits Thermal properties Temperature measurements Testen (DE-588)4367264-4 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Thermodynamische Eigenschaft (DE-588)4126056-9 gnd |
| subject_GND | (DE-588)4367264-4 (DE-588)4027242-4 (DE-588)4126056-9 |
| title | Thermal testing of integrated circuits |
| title_auth | Thermal testing of integrated circuits |
| title_exact_search | Thermal testing of integrated circuits |
| title_full | Thermal testing of integrated circuits by Josep Altet and Antonio Rubio |
| title_fullStr | Thermal testing of integrated circuits by Josep Altet and Antonio Rubio |
| title_full_unstemmed | Thermal testing of integrated circuits by Josep Altet and Antonio Rubio |
| title_short | Thermal testing of integrated circuits |
| title_sort | thermal testing of integrated circuits |
| topic | Integrated circuits Testing Integrated circuits Thermal properties Temperature measurements Testen (DE-588)4367264-4 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Thermodynamische Eigenschaft (DE-588)4126056-9 gnd |
| topic_facet | Integrated circuits Testing Integrated circuits Thermal properties Temperature measurements Testen Integrierte Schaltung Thermodynamische Eigenschaft |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009945410&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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