Thermal management of microelectronic equipment: heat transfer theory, analysis methods and design practices
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
New York
ASME Press
2002
|
| Schriftenreihe: | ASME Press book series on electronic packaging
|
| Schlagworte: | |
| Beschreibung: | Erscheint: Juli 2002 |
| Beschreibung: | XXI, 414 S. graph. Darst. |
| ISBN: | 0791801683 |
Internformat
MARC
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| 100 | 1 | |a Yeh, Lian-Tuu |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Thermal management of microelectronic equipment |b heat transfer theory, analysis methods and design practices |c L. T. Yeh ; R. C. Chu |
| 264 | 1 | |a New York |b ASME Press |c 2002 | |
| 300 | |a XXI, 414 S. |b graph. Darst. | ||
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| 490 | 0 | |a ASME Press book series on electronic packaging | |
| 500 | |a Erscheint: Juli 2002 | ||
| 650 | 4 | |a Electronic apparatus and appliances |x Cooling | |
| 650 | 4 | |a Electronic apparatus and appliances |x Thermal properties | |
| 650 | 4 | |a Heat |x Transmission | |
| 650 | 0 | 7 | |a Wärmeabgabe |0 (DE-588)4188840-6 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Kühlung |0 (DE-588)4132435-3 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
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| 689 | 0 | 2 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
| 689 | 0 | 3 | |a Wärmeabgabe |0 (DE-588)4188840-6 |D s |
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| 700 | 1 | |a Chu, Richard C. |e Sonstige |4 oth | |
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Datensatz im Suchindex
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| author | Yeh, Lian-Tuu |
| author_facet | Yeh, Lian-Tuu |
| author_role | aut |
| author_sort | Yeh, Lian-Tuu |
| author_variant | l t y lty |
| building | Verbundindex |
| bvnumber | BV014593984 |
| callnumber-first | T - Technology |
| callnumber-label | TK7870 |
| callnumber-raw | TK7870.25 |
| callnumber-search | TK7870.25 |
| callnumber-sort | TK 47870.25 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4020 |
| ctrlnum | (OCoLC)47136475 (DE-599)BVBBV014593984 |
| dewey-full | 621.381/04 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/04 |
| dewey-search | 621.381/04 |
| dewey-sort | 3621.381 14 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV014593984 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T19:57:03Z |
| institution | BVB |
| isbn | 0791801683 |
| language | English |
| lccn | 2001034086 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-012766188 |
| oclc_num | 47136475 |
| open_access_boolean | |
| owner | DE-703 |
| owner_facet | DE-703 |
| physical | XXI, 414 S. graph. Darst. |
| publishDate | 2002 |
| publishDateSearch | 2002 |
| publishDateSort | 2002 |
| publisher | ASME Press |
| record_format | marc |
| series2 | ASME Press book series on electronic packaging |
| spelling | Yeh, Lian-Tuu Verfasser aut Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices L. T. Yeh ; R. C. Chu New York ASME Press 2002 XXI, 414 S. graph. Darst. txt rdacontent n rdamedia nc rdacarrier ASME Press book series on electronic packaging Erscheint: Juli 2002 Electronic apparatus and appliances Cooling Electronic apparatus and appliances Thermal properties Heat Transmission Wärmeabgabe (DE-588)4188840-6 gnd rswk-swf Kühlung (DE-588)4132435-3 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 s Kühlung (DE-588)4132435-3 s Elektronisches Bauelement (DE-588)4014360-0 s Wärmeabgabe (DE-588)4188840-6 s DE-604 Chu, Richard C. Sonstige oth |
| spellingShingle | Yeh, Lian-Tuu Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices Electronic apparatus and appliances Cooling Electronic apparatus and appliances Thermal properties Heat Transmission Wärmeabgabe (DE-588)4188840-6 gnd Kühlung (DE-588)4132435-3 gnd Mikroelektronik (DE-588)4039207-7 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| subject_GND | (DE-588)4188840-6 (DE-588)4132435-3 (DE-588)4039207-7 (DE-588)4014360-0 |
| title | Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices |
| title_auth | Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices |
| title_exact_search | Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices |
| title_full | Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices L. T. Yeh ; R. C. Chu |
| title_fullStr | Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices L. T. Yeh ; R. C. Chu |
| title_full_unstemmed | Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices L. T. Yeh ; R. C. Chu |
| title_short | Thermal management of microelectronic equipment |
| title_sort | thermal management of microelectronic equipment heat transfer theory analysis methods and design practices |
| title_sub | heat transfer theory, analysis methods and design practices |
| topic | Electronic apparatus and appliances Cooling Electronic apparatus and appliances Thermal properties Heat Transmission Wärmeabgabe (DE-588)4188840-6 gnd Kühlung (DE-588)4132435-3 gnd Mikroelektronik (DE-588)4039207-7 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| topic_facet | Electronic apparatus and appliances Cooling Electronic apparatus and appliances Thermal properties Heat Transmission Wärmeabgabe Kühlung Mikroelektronik Elektronisches Bauelement |
| work_keys_str_mv | AT yehliantuu thermalmanagementofmicroelectronicequipmentheattransfertheoryanalysismethodsanddesignpractices AT churichardc thermalmanagementofmicroelectronicequipmentheattransfertheoryanalysismethodsanddesignpractices |