Fundamentals of microsystems packaging:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
New York, NY. [u.a.]
McGraw-Hill
2001
|
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | VII, 967 S. graph. Darst. |
| ISBN: | 9780071371698 |
Internformat
MARC
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| 245 | 1 | 0 | |a Fundamentals of microsystems packaging |c Rao R. Tummala |
| 264 | 1 | |a New York, NY. [u.a.] |b McGraw-Hill |c 2001 | |
| 300 | |a VII, 967 S. |b graph. Darst. | ||
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| 650 | 0 | 7 | |a Mikrosystemtechnik |0 (DE-588)4221617-5 |2 gnd |9 rswk-swf |
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Datensatz im Suchindex
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| adam_text |
IMAGE 1
FUNDAMENTALS OF
MICROSYSTEMS PACKAGING
RAO R. TUMMALA GEORGIA INSTITUTE OF TECHNOLOGY EDITOR
ANGIE HUGHES NANCY TRENT MAHESH VARADARAJAN MANAGING STAFF
OLATUNJI CUNNINGHAM TRAVIS GARY MAURICE NOVEMBRE ALYSSA POOLE
SALLEY THEODORE ILLUSTRATORS
KRISTY D'ARCY MELISSA SHERRER ADMINISTRATIVE ASSISTANCE
MCGRAW-HILL
NEW YORK CHICAGO SAN FRANCISCO LISBON LONDON MADRID MEXICO CITY MILAN
NEW DELHI SAN JUAN SEOUL SINGAPORE SYDNEY TORONTO
IMAGE 2
C O N T E N TS
1 INTRODUCTION TO MICROSYSTEMS PACKAGING 2 1.1 WHAT ARE MICROSYSTEMS? 4
1.2 MICROSYSTEM TECHNOLOGIES 5
1.3 WHAT IS MICROSYSTEMS PACKAGING (MSP)? 12
1.4 WHY IS MICROSYSTEMS PACKAGING IMPORTANT? 20
1.5 SYSTEM-LEVEL MICROSYSTEMS TECHNOLOGIES 21
1.6 WHAT IS EXPECTED OF YOU AS A MICROSYSTEMS ENGINEER? 24
1.7 SUMMARY AND FUTURE TRENDS 24
1.8 WHO INVENTED MICROSYSTEMS AND PACKAGING TECHNOLOGIES? 26
1.9 HOMEWORK PROBLEMS 41
1.10 SUGGESTED READING 41
2 THE ROLE OF PACKAGING IN MICROELECTRONICS 44
2.1 WHAT IS MICROELECTRONICS? 46
2.2 CHARACTERISTICS OF SEMICONDUCTORS 47
2.3 MICROELECTRONIC DEVICES 53
2.4 INTEGRATED CIRCUITS 59
2.5 IC PACKAGING 65
2.6 SEMICONDUCTOR ROADMAP 68
2.7 IC PACKAGING CHALLENGES 73
2.8 SUMMARY AND FUTURE TRENDS 74
2.9 HOMEWORK PROBLEMS 77
2.10 SUGGESTED READING 79
3 THE ROLE OF PACKAGING IN MICROSYSTEMS 80
3.1 WHAT IS AN ELECTRONIC PRODUCT? 82
3.2 ANATOMY OF A MICROSYSTEM 82
3.3 COMPUTERS AND THE INTERNET 84
3.4 WHAT IS THE ROLE OF PACKAGING IN THE COMPUTER INDUSTRY? 89
3.5 WHAT IS THE ROLE OF PACKAGING IN THE TELECOMMUNICATION INDUSTRY 95
3.6 WHAT IS THE ROLE OF PACKAGING IN AUTOMOTIVE SYSTEMS 101
3.7 WHAT IS THE ROLE OF PACKAGING IN MEDICAL ELECTRONICS 109
3.8 WHAT IS THE ROLE OF PACKAGING IN CONSUMER ELECTRONICS 111
3.9 WHAT IS THE ROLE OF PACKAGING IN MICRO-ELECTROMECHANICAL SYSTEMS
(MEMS) PRODUCTS 113
3.10 SUMMARY AND FUTURE TRENDS 116
3.11 HOMEWORK PROBLEMS 118
3.12 SUGGESTED READING 119
4 FUNDAMENTALS OF ELECTRICAL PACKAGE DESIGN 120
4.1 WHAT IS ELECTRICAL PACKAGE DESIGN? 122
4.2 FUNDAMENTALS OF ELECTRICAL PACKAGE DESIGN 124
4.3 ELECTRICAL ANATOMY OF SYSTEMS PACKAGING 127
4.4 SIGNAL DISTRIBUTION 131
4.5 POWER DISTRIBUTION 156
4.6 ELECTROMAGNETIC INTERFERENCE 172
4.7 DESIGN PROCESS 176
4.8 SUMMARY AND FUTURE TRENDS 179
4.9 HOMEWORK PROBLEMS 180
4.10 SUGGESTED READING 182
5 FUNDAMENTALS OF DESIGN FOR REUABILITY 184
5.1 WHAT IS DESIGN FOR RELIABILITY? 186
5.2 MICROSYSTEMS FAILURES AND FAILURE MECHANISMS 186
5.3 FUNDAMENTALS OF DESIGN FOR RELIABILITY 187
5.4 THERMOMECHANICALLY-INDUCED FAILURES 188
5.5 ELECTRICALLY-INDUCED FAILURES 203
5.6 CHEMICALLY-INDUCED FAILURES 206
5.7 SUMMARY AND FUTURE TRENDS 208
5.8 HOMEWORK PROBLEMS 209
5.9 SUGGESTED READING 210
6 FUNDAMENTALS OF THERMAL MANAGEMENT 212
6.1 WHAT IS THERMAL MANAGEMENT? 214
6.2 WHY THERMAL MANAGEMENT? 214
6.3 COOLING REQUIREMENTS FOR MICROSYSTEMS 217
6.4 THERMAL MANAGEMENT FUNDAMENTALS 220
6.5 THERMAL MANAGEMENT OF IC AND PWB PACKAGES 239
6.6 ELECTRONIC COOLING METHODS 246
6.7 SUMMARY AND FUTURE TRENDS 261
6.8 HOMEWORK PROBLEMS 262
6.9 SUGGESTED READING 262
7 FUNDAMENTALS OF SINGLE CHIP PACKAGING 264
7.1 WHAT IS A SINGLE CHIP PACKAGE? 266
7.2 FUNCTIONS OF SINGLE CHIP PACKAGES 267
7.3 TYPES OF SINGLE CHIP PACKAGES 268
7.4 FUNDAMENTALS OF SINGLE CHIP PACKAGING 271
7.5 MATERIALS, PROCESSES, AND PROPERTIES 284
7.6 CHARACTERISTICS OF SINGLE CHIP PACKAGES 287
7.7 SUMMARY AND FUTURE TRENDS 291
7.8 HOMEWORK PROBLEMS 292
V
IMAGE 3
VI
CONTENTS
7.9 SUGGESTED READING 293
8 FUNDAMENTALS OF MULTICHIP PACKAGING 296
8.1 WHAT ARE MULTICHIP MODULES? 298
8.2 MULTICHIP MODULE FUNCTIONALITY 299
8.3 MULTICHIP MODULE ADVANTAGES 300
8.4 MULTICHIP MODULES AT THE SYSTEM LEVEL 307
8.5 TYPES OF MULTICHIP MODULE SUBSTRATES 315
8.6 MULTICHIP MODULE DESIGN 329
8.7 MULTICHIP MODULE TECHNOLOGY COMPARISONS 333
8.8 ALTERNATIVES TO MULTICHIP MODULES 335
8.9 SUMMARY AND FUTURE TRENDS 336
8.10 HOMEWORK PROBLEMS 338
8.11 SUGGESTED READING 338
9 FUNDAMENTALS OF IC ASSEMBLY 342
9.1 WHAT IS IC ASSEMBLY? 344
9.2 PURPOSE OF IC ASSEMBLY 345
9.3 REQUIREMENTS FOR IC ASSEMBLY 345
9.4 IC ASSEMBLY TECHNOLOGIES 346
9.5 WIREBONDING 346
9.6 TAPE AUTOMATED BONDING 353
9.7 FLIP CHIP 361
9.8 SUMMARY AND FUTURE TRENDS 391
9.9 HOMEWORK PROBLEMS 392
9.10 SUGGESTED READING 397
10 FUNDAMENTALS OF WAFER-LEVEL PACKAGING 398
10.1 WHAT IS WAFER-IEVEL PACKAGING? 400
10.2 WHY WAFER-IEVEL PACKAGING? 401
10.3 WLP TECHNOLOGIES 405
10.4 WLP RELIABILITY 412
10.5 WAFER-IEVEL BURN-IN AND TEST 415
10.6 SUMMARY AND FUTURE TRENDS 417
10.7 HOMEWORK PROBLEMS 417
10.8 SUGGESTED READING 417
11 FUNDAMENTALS OF PASSIVES: DISCRETE, INTEGRATED, AND EMBEDDED 420
11.1 WHAT ARE PASSIVE COMPONENTS? 422
11.2 ROLE OF PASSIVE COMPONENTS IN ELECTRONIC PRODUCTS 422
11.3 FUNDAMENTALS OF PASSIVE COMPONENTS 426
11.4 PHYSICAL REPRESENTATIONS OF PASSIVE COMPONENTS 437
11.5 DISCRETE PASSIVES 440
11.6 INTEGRATED PASSIVES 452
11.7 EMBEDDED (INTEGRAL) PASSIVES 454
11.8 SUMMARY AND FUTURE TRENDS 463
11.9 HOMEWORK PROBLEMS 464
11.10 SUGGESTED READING 464
12 FUNDAMENTALS OF OPTOELECTRONICS 466
12.1 WHAT IS OPTOELECTRONICS PACKAGING? 468
12.2 WHY IS OPTOELECTRONICS IMPORTANT? 468
12.3 OPTOELECTRONICS MARKET 470
12.4 ANATOMY OF AN OPTOELECTRONIC SYSTEM 470
12.5 FUNDAMENTALS OF OPTOELECTRONICS 471
12.6 OPTICAL INTERCONNECTION SYSTEM CONFIGURATIONS 489
12.7 SUMMARY AND FUTURE TRENDS 494
12.8 HOMEWORK PROBLEMS 496
12.9 SUGGESTED READING 498
13 FUNDAMENTALS OF RF PACKAGING 500
13.1 WHAT IS RF? 502
13.2 RF APPLICATIONS AND MARKETS 503
13.3 ANATOMY OF RF SYSTEMS 504
13.4 FUNDAMENTALS OF RF 513
13.5 RF PACKAGING 534
13.6 RF MEASUREMENT TECHNIQUES 537
13.7 SUMMARY AND FUTURE TRENDS 538
13.8 HOMEWORK PROBLEMS 540
13.9 SUGGESTED READING 540
14 FUNDAMENTALS OF MICROELECTROMECHANICAL SYSTEMS 542
14.1 WHAT ARE MEMS? 544
14.2 WHAT ARE MEMS APPLICATIONS? 544
14.3 FUNDAMENTALS OF MEMS DEVICES 547
14.4 TYPES OF MEMS PACKAGING SOLUTIONS 560
14.5 TYPICAL MEMS DEVICES 561
14.6 KEY FAILURE MECHANISMS OF MEMS 565
14.7 MEMS INERTIAL SENSORS: A CASE STUDY 566
14.8 SUMMARY AND FUTURE TRENDS 576
14.9 HOMEWORK PROBLEMS 576
14.10 SUGGESTED READING 578
15 FUNDAMENTALS OF SEALING AND ENCAPSULATION 580
15.1 WHAT IS ENCAPSULATION? WHAT IS SEALING? 582
15.2 WHY IS ENCAPSULATION NECESSARY? 582
15.3 FUNDAMENTALS OF ENCAPSULATION AND SEALING 585
15.4 ENCAPSULATION REQUIREMENTS 589
15.5 ENCAPSULANT MATERIALS 593
15.6 ENCAPSULATION PROCESSES 599
15.7 HERMETIC SEALING 603
15.8 SUMMARY AND FUTURE TRENDS 607
15.9 HOMEWORK PROBLEMS 608
IMAGE 4
CONTENTS VII
15.10 SUGGESTED READING 609
16 FUNDAMENTALS OF SYSTEM-LEVEL PWB TECHNOLOGIES 612
16.1 WHAT IS A SYSTEM-LEVEL PRINTED WIRING BOARD? 614
16.2 TYPES OF PRINTED WIRING BOARDS 615
16.3 ANATOMY OF A PRINTED WIRING BOARD 616
16.4 FUNDAMENTALS OF PRINTED WIRING BOARDS 618
16.5 CAD TOOLS FOR PRINTED WIRING BOARD DESIGN 623
16.6 PRINTED WIRING BOARD MATERIALS 628
16.7 STANDARD PRINTED WIRING BOARD FABRICATION 635
16.8 LIMITATIONS IN STANDARD PRINTED WIRING BOARD PROCESS 644
16.9 MICROVIA BOARDS 650
16.10 PRINTED WIRING BOARD MARKET 653
16.11 SUMMARY AND FUTURE TRENDS 655
16.12 HOMEWORK PROBLEMS 655
16.13 SUGGESTED READING 656
17 FUNDAMENTALS OF BOARD ASSEMBLY 658
17.1 WHAT IS A PRINTED WIRING BOARD ASSEMBLY? 660
17.2 SURFACE MOUNT TECHNOLOGY 660
17.3 THROUGH-HOLE ASSEMBLY 683
17.4 GENERIC ASSEMBLY ISSUES 688
17.5 PROCESS CONTROL 691
17.6 DESIGN CHALLENGES 691
17.7 SUMMARY AND FUTURE TRENDS 692
17.8 HOMEWORK PROBLEMS 693
17.9 SUGGESTED READING 693
18 FUNDAMENTALS OF PACKAGING MATERIALS AND PROCESSES 694
18.1 THE ROLE OF MATERIALS IN MICROSYSTEMS PACKAGING 696
18.2 PACKAGING MATERIALS AND PROPERTIES 700
18.3 MATERIALS PROCESSES 717
18.4 SUMMARY AND FUTURE TRENDS 735
18.5 HOMEWORK PROBLEMS 744
18.6 SUGGESTED READING 746
19 FUNDAMENTALS OF ELECTRICAL TESTING 748
19.1 WHAT IS ELECTRICAL TESTING? 750
19.2 WHY IS ELECTRICAL TESTING NECESSARY? 750
19.3 ANATOMY OF SYSTEM-LEVEL ELECTRICAL TESTING 751
19.4 FUNDAMENTALS OF ELECTRICAL TESTS 753
19.5 INTERCONNECTION TESTS 759
19.6 ACTIVE CIRCUIT TESTING 765
19.7 DESIGN FOR TESTABILITY 769
19.8 SUMMARY AND FUTURE TRENDS 774
19.9 HOMEWORK PROBLEMS 777
19.10 SUGGESTED READING 778
20 FUNDAMENTALS OF PACKAGE MANUFACTURING 780
20.1 WHAT IS MANUFACTURING? 782
20.2 GOALS OF MANUFACTURING 782
20.3 FUNDAMENTALS OF MANUFACTURING 783
20.4 STATISTICAL FUNDAMENTALS 785
20.5 PROCESS CONTROL 803
20.6 STATISTICAL EXPERIMENTAL DESIGN 814
20.7 PROCESS MODELING 825
20.8 YIELD MODELING 831
20.9 CIM SYSTEMS 839
20.10 SUMMARY AND FUTURE TRENDS 840
20.11 HOMEWORK PROBLEMS 841
20.12 SUGGESTED READING 844
21 FUNDAMENTALS OF MICROSYSTEMS DESIGN FOR ENVIRONMENT 846
21.1 WHAT ARE THE ENVIRONMENTAL CONCEMS OF MICROSYSTEMS? 848
21.2 HOW ELECTRONICS PRODUCTION INFLUENCES THE ENVIRONMENT 851
21.3 LIFE-CYCLE ASSESSMENT 868
21.4 SUMMARY AND FUTURE TRENDS 874
21.5 HOMEWORK PROBLEMS 876
21.6 SUGGESTED READING 876
22 FUNDAMENTALS OF MICROSYSTEMS REUABIUTY 878
22.1 WHAT IS THERMOMECHANICAL RELIABILITY? 880
22.2 FUNDAMENTALS OF THERMOMECHANICAL RELIABILITY 880
22.3 WHY IS RELIABILITY IMPORTANT? 883
22.4 RELIABILITY METROLOGY 885
22.5 FAILURE MODES AND MECHANISMS 889
22.6 RELIABILITY QUALIFICATIONS 896
22.7 THERMOMECHANICAL FAILURE ANALYSIS 897
22.8 EXPERIMENTAL METHODS AND TOOLS FOR RELIABILITY ANALYSIS 902
22.9 INTEGRATED VIRTUAL RELIABILITY PREDICTION 918
22.10 SUMMARY AND FUTURE TRENDS 919
22.11 HOMEWORK PROBLEMS 921
22.12 SUGGESTED READING 923
GLOSSARY 924
APPENDICES 945
INDEX 955 |
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| id | DE-604.BV014554841 |
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| indexdate | 2024-09-06T00:13:28Z |
| institution | BVB |
| isbn | 9780071371698 |
| language | English |
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| spelling | Tummala, Rao Verfasser aut Fundamentals of microsystems packaging Rao R. Tummala New York, NY. [u.a.] McGraw-Hill 2001 VII, 967 S. graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electronic packaging Handbooks, manuals, etc Microelectronic packaging Handbooks, manuals, etc Miniature electronic equipment Packaging Handbooks, manuals, etc Mikrosystemtechnik (DE-588)4221617-5 gnd rswk-swf Mikrosystemtechnik (DE-588)4221617-5 s DE-604 GBV Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009897574&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Tummala, Rao Fundamentals of microsystems packaging Electronic packaging Handbooks, manuals, etc Microelectronic packaging Handbooks, manuals, etc Miniature electronic equipment Packaging Handbooks, manuals, etc Mikrosystemtechnik (DE-588)4221617-5 gnd |
| subject_GND | (DE-588)4221617-5 |
| title | Fundamentals of microsystems packaging |
| title_auth | Fundamentals of microsystems packaging |
| title_exact_search | Fundamentals of microsystems packaging |
| title_full | Fundamentals of microsystems packaging Rao R. Tummala |
| title_fullStr | Fundamentals of microsystems packaging Rao R. Tummala |
| title_full_unstemmed | Fundamentals of microsystems packaging Rao R. Tummala |
| title_short | Fundamentals of microsystems packaging |
| title_sort | fundamentals of microsystems packaging |
| topic | Electronic packaging Handbooks, manuals, etc Microelectronic packaging Handbooks, manuals, etc Miniature electronic equipment Packaging Handbooks, manuals, etc Mikrosystemtechnik (DE-588)4221617-5 gnd |
| topic_facet | Electronic packaging Handbooks, manuals, etc Microelectronic packaging Handbooks, manuals, etc Miniature electronic equipment Packaging Handbooks, manuals, etc Mikrosystemtechnik |
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