Electronic assembly fabrication: chips, circuit boards, packages, and components
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York
McGraw-Hill
2002
|
| Ausgabe: | 1st ed. |
| Schriftenreihe: | McGraw-Hill professional engineering
Electronic packaging and interconnection series |
| Schlagworte: | |
| Online-Zugang: | Publisher description Table of contents |
| Beschreibung: | xv, 672 p. ill. : 24 cm |
| ISBN: | 0071378820 |
Internformat
MARC
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| 035 | |a (OCoLC)48534655 | ||
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| 245 | 1 | 0 | |a Electronic assembly fabrication |b chips, circuit boards, packages, and components |c Charles A. Harper, editor-in-chief |
| 250 | |a 1st ed. | ||
| 264 | 1 | |a New York |b McGraw-Hill |c 2002 | |
| 300 | |a xv, 672 p. |b ill. : 24 cm | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a McGraw-Hill professional engineering | |
| 490 | 0 | |a Electronic packaging and interconnection series | |
| 650 | 4 | |a Electronic apparatus and appliances |x Design and construction | |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Fertigung |0 (DE-588)4016899-2 |2 gnd |9 rswk-swf |
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| 856 | 4 | |u http://www.loc.gov/catdir/description/mh024/2002022737.html |3 Publisher description | |
| 856 | 4 | |u http://www.loc.gov/catdir/toc/mh023/2002022737.html |3 Table of contents | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-009884398 | ||
Datensatz im Suchindex
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| building | Verbundindex |
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| callnumber-label | TK7870 |
| callnumber-raw | TK7870 |
| callnumber-search | TK7870 |
| callnumber-sort | TK 47870 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4100 |
| ctrlnum | (OCoLC)48534655 (DE-599)BVBBV014509332 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | 1st ed. |
| format | Book |
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| id | DE-604.BV014509332 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T19:03:09Z |
| institution | BVB |
| isbn | 0071378820 |
| language | English |
| lccn | 2002022737 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009884398 |
| oclc_num | 48534655 |
| open_access_boolean | |
| owner | DE-703 |
| owner_facet | DE-703 |
| physical | xv, 672 p. ill. : 24 cm |
| publishDate | 2002 |
| publishDateSearch | 2002 |
| publishDateSort | 2002 |
| publisher | McGraw-Hill |
| record_format | marc |
| series2 | McGraw-Hill professional engineering Electronic packaging and interconnection series |
| spelling | Electronic assembly fabrication chips, circuit boards, packages, and components Charles A. Harper, editor-in-chief 1st ed. New York McGraw-Hill 2002 xv, 672 p. ill. : 24 cm txt rdacontent n rdamedia nc rdacarrier McGraw-Hill professional engineering Electronic packaging and interconnection series Electronic apparatus and appliances Design and construction Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Fertigung (DE-588)4016899-2 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 s Fertigung (DE-588)4016899-2 s DE-604 Harper, Charles A. 1926- Sonstige (DE-588)128924845 oth http://www.loc.gov/catdir/description/mh024/2002022737.html Publisher description http://www.loc.gov/catdir/toc/mh023/2002022737.html Table of contents |
| spellingShingle | Electronic assembly fabrication chips, circuit boards, packages, and components Electronic apparatus and appliances Design and construction Elektronisches Bauelement (DE-588)4014360-0 gnd Fertigung (DE-588)4016899-2 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4016899-2 |
| title | Electronic assembly fabrication chips, circuit boards, packages, and components |
| title_auth | Electronic assembly fabrication chips, circuit boards, packages, and components |
| title_exact_search | Electronic assembly fabrication chips, circuit boards, packages, and components |
| title_full | Electronic assembly fabrication chips, circuit boards, packages, and components Charles A. Harper, editor-in-chief |
| title_fullStr | Electronic assembly fabrication chips, circuit boards, packages, and components Charles A. Harper, editor-in-chief |
| title_full_unstemmed | Electronic assembly fabrication chips, circuit boards, packages, and components Charles A. Harper, editor-in-chief |
| title_short | Electronic assembly fabrication |
| title_sort | electronic assembly fabrication chips circuit boards packages and components |
| title_sub | chips, circuit boards, packages, and components |
| topic | Electronic apparatus and appliances Design and construction Elektronisches Bauelement (DE-588)4014360-0 gnd Fertigung (DE-588)4016899-2 gnd |
| topic_facet | Electronic apparatus and appliances Design and construction Elektronisches Bauelement Fertigung |
| url | http://www.loc.gov/catdir/description/mh024/2002022737.html http://www.loc.gov/catdir/toc/mh023/2002022737.html |
| work_keys_str_mv | AT harpercharlesa electronicassemblyfabricationchipscircuitboardspackagesandcomponents |