ESIME 2001: proceedings of the conference EuroSimE 2001, Paris, France, April 2001
Gespeichert in:
| Format: | Elektronisch Tagungsbericht Software E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
[New York, NY]
IEEE
2001
|
| Schlagworte: | |
| Beschreibung: | 1 CD-ROM 12 cm. - 12 cm |
| ISBN: | 0780398076 |
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Datensatz im Suchindex
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| genre | (DE-588)1071861417 Konferenzschrift 2001 Paris gnd-content |
| genre_facet | Konferenzschrift 2001 Paris |
| id | DE-604.BV014442065 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-09T19:02:49Z |
| institution | BVB |
| institution_GND | (DE-588)1902516-6 |
| isbn | 0780398076 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009871720 |
| oclc_num | 634149325 |
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| owner | DE-29T |
| owner_facet | DE-29T |
| physical | 1 CD-ROM 12 cm. - 12 cm |
| publishDate | 2001 |
| publishDateSearch | 2001 |
| publishDateSort | 2001 |
| publisher | IEEE |
| record_format | marc |
| spelling | ESIME 2001 proceedings of the conference EuroSimE 2001, Paris, France, April 2001 EUROSIME 2001 Benefiting from thermal and mechanical simulation in (micro)-electronics [New York, NY] IEEE 2001 1 CD-ROM 12 cm. - 12 cm c rdamedia cd rdacarrier Simulation (DE-588)4055072-2 gnd rswk-swf Mechanische Beanspruchung (DE-588)4196812-8 gnd rswk-swf Thermische Belastung (DE-588)4059816-0 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf (DE-588)1071861417 Konferenzschrift 2001 Paris gnd-content Mikroelektronik (DE-588)4039207-7 s Thermische Belastung (DE-588)4059816-0 s Mechanische Beanspruchung (DE-588)4196812-8 s Simulation (DE-588)4055072-2 s DE-604 EuroSimE 2 2001 Paris Sonstige (DE-588)1902516-6 oth |
| spellingShingle | ESIME 2001 proceedings of the conference EuroSimE 2001, Paris, France, April 2001 Simulation (DE-588)4055072-2 gnd Mechanische Beanspruchung (DE-588)4196812-8 gnd Thermische Belastung (DE-588)4059816-0 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| subject_GND | (DE-588)4055072-2 (DE-588)4196812-8 (DE-588)4059816-0 (DE-588)4039207-7 (DE-588)1071861417 |
| title | ESIME 2001 proceedings of the conference EuroSimE 2001, Paris, France, April 2001 |
| title_alt | EUROSIME 2001 Benefiting from thermal and mechanical simulation in (micro)-electronics |
| title_auth | ESIME 2001 proceedings of the conference EuroSimE 2001, Paris, France, April 2001 |
| title_exact_search | ESIME 2001 proceedings of the conference EuroSimE 2001, Paris, France, April 2001 |
| title_full | ESIME 2001 proceedings of the conference EuroSimE 2001, Paris, France, April 2001 |
| title_fullStr | ESIME 2001 proceedings of the conference EuroSimE 2001, Paris, France, April 2001 |
| title_full_unstemmed | ESIME 2001 proceedings of the conference EuroSimE 2001, Paris, France, April 2001 |
| title_short | ESIME 2001 |
| title_sort | esime 2001 proceedings of the conference eurosime 2001 paris france april 2001 |
| title_sub | proceedings of the conference EuroSimE 2001, Paris, France, April 2001 |
| topic | Simulation (DE-588)4055072-2 gnd Mechanische Beanspruchung (DE-588)4196812-8 gnd Thermische Belastung (DE-588)4059816-0 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| topic_facet | Simulation Mechanische Beanspruchung Thermische Belastung Mikroelektronik Konferenzschrift 2001 Paris |
| work_keys_str_mv | AT eurosimeparis esime2001proceedingsoftheconferenceeurosime2001parisfranceapril2001 AT eurosimeparis eurosime2001 AT eurosimeparis benefitingfromthermalandmechanicalsimulationinmicroelectronics |