Microelectronic yield, reliability, and advanced packaging: 28-30 November 2000, Singapore
Saved in:
| Format: | Book |
|---|---|
| Language: | English |
| Published: |
Bellingham, Wash.
SPIE
2000
|
| Series: | Proceedings of SPIE / Society of Photo-Optical Instrumentation Engineers
4229 |
| Subjects: | |
| Item Description: | Includes bibliographical references and index |
| Physical Description: | XVII, 222 S. Ill., graph. Darst. |
| ISBN: | 0819439010 |
Staff View
MARC
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Record in the Search Index
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| id | DE-604.BV014386140 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T19:02:15Z |
| institution | BVB |
| institution_GND | (DE-588)5065244-8 |
| isbn | 0819439010 |
| language | English |
| lccn | 2001277635 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009848270 |
| oclc_num | 46342003 |
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| owner | DE-83 |
| owner_facet | DE-83 |
| physical | XVII, 222 S. Ill., graph. Darst. |
| publishDate | 2000 |
| publishDateSearch | 2000 |
| publishDateSort | 2000 |
| publisher | SPIE |
| record_format | marc |
| series2 | Proceedings of SPIE / Society of Photo-Optical Instrumentation Engineers |
| spelling | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore Cher Ming Tan ... chairs/editors ; sponsored by Nanyang Technological University (Singapore) ... Bellingham, Wash. SPIE 2000 XVII, 222 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Proceedings of SPIE / Society of Photo-Optical Instrumentation Engineers 4229 Includes bibliographical references and index Microelectromechanical systems Reliability Congresses Microelectronic packaging Congresses (DE-588)1071861417 Konferenzschrift gnd-content Tan, Cher Ming Sonstige oth Nanyang Technological University Sonstige (DE-588)5065244-8 oth Society of Photo-Optical Instrumentation Engineers Proceedings of SPIE 4229 (DE-604)BV000010887 4229 |
| spellingShingle | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore Microelectromechanical systems Reliability Congresses Microelectronic packaging Congresses |
| subject_GND | (DE-588)1071861417 |
| title | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore |
| title_auth | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore |
| title_exact_search | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore |
| title_full | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore Cher Ming Tan ... chairs/editors ; sponsored by Nanyang Technological University (Singapore) ... |
| title_fullStr | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore Cher Ming Tan ... chairs/editors ; sponsored by Nanyang Technological University (Singapore) ... |
| title_full_unstemmed | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore Cher Ming Tan ... chairs/editors ; sponsored by Nanyang Technological University (Singapore) ... |
| title_short | Microelectronic yield, reliability, and advanced packaging |
| title_sort | microelectronic yield reliability and advanced packaging 28 30 november 2000 singapore |
| title_sub | 28-30 November 2000, Singapore |
| topic | Microelectromechanical systems Reliability Congresses Microelectronic packaging Congresses |
| topic_facet | Microelectromechanical systems Reliability Congresses Microelectronic packaging Congresses Konferenzschrift |
| volume_link | (DE-604)BV000010887 |
| work_keys_str_mv | AT tancherming microelectronicyieldreliabilityandadvancedpackaging2830november2000singapore AT nanyangtechnologicaluniversity microelectronicyieldreliabilityandadvancedpackaging2830november2000singapore |