Microelectronic yield, reliability, and advanced packaging: 28-30 November 2000, Singapore
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Bellingham, Wash.
SPIE
2000
|
| Schriftenreihe: | Proceedings of SPIE / Society of Photo-Optical Instrumentation Engineers
4229 |
| Schlagworte: | |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | XVII, 222 S. Ill., graph. Darst. |
| ISBN: | 0819439010 |
Internformat
MARC
| LEADER | 00000nam a2200000zcb4500 | ||
|---|---|---|---|
| 001 | BV014386140 | ||
| 003 | DE-604 | ||
| 005 | 20100504 | ||
| 007 | t | ||
| 008 | 020603s2000 xxuad|| |||| 10||| eng d | ||
| 010 | |a 2001277635 | ||
| 020 | |a 0819439010 |9 0-8194-3901-0 | ||
| 035 | |a (OCoLC)46342003 | ||
| 035 | |a (DE-599)BVBBV014386140 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 044 | |a xxu |c US | ||
| 049 | |a DE-83 | ||
| 050 | 0 | |a TK7875 | |
| 050 | 0 | |a TS510 | |
| 082 | 0 | |a 621.381 |2 21 | |
| 084 | |a ZN 4040 |0 (DE-625)157343: |2 rvk | ||
| 245 | 1 | 0 | |a Microelectronic yield, reliability, and advanced packaging |b 28-30 November 2000, Singapore |c Cher Ming Tan ... chairs/editors ; sponsored by Nanyang Technological University (Singapore) ... |
| 264 | 1 | |a Bellingham, Wash. |b SPIE |c 2000 | |
| 300 | |a XVII, 222 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a Proceedings of SPIE / Society of Photo-Optical Instrumentation Engineers |v 4229 | |
| 500 | |a Includes bibliographical references and index | ||
| 650 | 4 | |a Microelectromechanical systems |x Reliability |v Congresses | |
| 650 | 4 | |a Microelectronic packaging |v Congresses | |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 700 | 1 | |a Tan, Cher Ming |e Sonstige |4 oth | |
| 710 | 2 | |a Nanyang Technological University |e Sonstige |0 (DE-588)5065244-8 |4 oth | |
| 810 | 2 | |a Society of Photo-Optical Instrumentation Engineers |t Proceedings of SPIE |v 4229 |w (DE-604)BV000010887 |9 4229 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-009848270 | ||
Datensatz im Suchindex
| _version_ | 1804129256123400192 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV014386140 |
| callnumber-first | T - Technology |
| callnumber-label | TK7875 |
| callnumber-raw | TK7875 TS510 |
| callnumber-search | TK7875 TS510 |
| callnumber-sort | TK 47875 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4040 |
| ctrlnum | (OCoLC)46342003 (DE-599)BVBBV014386140 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01568nam a2200409zcb4500</leader><controlfield tag="001">BV014386140</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20100504 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">020603s2000 xxuad|| |||| 10||| eng d</controlfield><datafield tag="010" ind1=" " ind2=" "><subfield code="a">2001277635</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0819439010</subfield><subfield code="9">0-8194-3901-0</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)46342003</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV014386140</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">xxu</subfield><subfield code="c">US</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-83</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7875</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TS510</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">21</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4040</subfield><subfield code="0">(DE-625)157343:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Microelectronic yield, reliability, and advanced packaging</subfield><subfield code="b">28-30 November 2000, Singapore</subfield><subfield code="c">Cher Ming Tan ... chairs/editors ; sponsored by Nanyang Technological University (Singapore) ...</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Bellingham, Wash.</subfield><subfield code="b">SPIE</subfield><subfield code="c">2000</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">XVII, 222 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Proceedings of SPIE / Society of Photo-Optical Instrumentation Engineers</subfield><subfield code="v">4229</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectromechanical systems</subfield><subfield code="x">Reliability</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronic packaging</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Tan, Cher Ming</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">Nanyang Technological University</subfield><subfield code="e">Sonstige</subfield><subfield code="0">(DE-588)5065244-8</subfield><subfield code="4">oth</subfield></datafield><datafield tag="810" ind1="2" ind2=" "><subfield code="a">Society of Photo-Optical Instrumentation Engineers</subfield><subfield code="t">Proceedings of SPIE</subfield><subfield code="v">4229</subfield><subfield code="w">(DE-604)BV000010887</subfield><subfield code="9">4229</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-009848270</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV014386140 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T19:02:15Z |
| institution | BVB |
| institution_GND | (DE-588)5065244-8 |
| isbn | 0819439010 |
| language | English |
| lccn | 2001277635 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009848270 |
| oclc_num | 46342003 |
| open_access_boolean | |
| owner | DE-83 |
| owner_facet | DE-83 |
| physical | XVII, 222 S. Ill., graph. Darst. |
| publishDate | 2000 |
| publishDateSearch | 2000 |
| publishDateSort | 2000 |
| publisher | SPIE |
| record_format | marc |
| series2 | Proceedings of SPIE / Society of Photo-Optical Instrumentation Engineers |
| spelling | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore Cher Ming Tan ... chairs/editors ; sponsored by Nanyang Technological University (Singapore) ... Bellingham, Wash. SPIE 2000 XVII, 222 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Proceedings of SPIE / Society of Photo-Optical Instrumentation Engineers 4229 Includes bibliographical references and index Microelectromechanical systems Reliability Congresses Microelectronic packaging Congresses (DE-588)1071861417 Konferenzschrift gnd-content Tan, Cher Ming Sonstige oth Nanyang Technological University Sonstige (DE-588)5065244-8 oth Society of Photo-Optical Instrumentation Engineers Proceedings of SPIE 4229 (DE-604)BV000010887 4229 |
| spellingShingle | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore Microelectromechanical systems Reliability Congresses Microelectronic packaging Congresses |
| subject_GND | (DE-588)1071861417 |
| title | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore |
| title_auth | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore |
| title_exact_search | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore |
| title_full | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore Cher Ming Tan ... chairs/editors ; sponsored by Nanyang Technological University (Singapore) ... |
| title_fullStr | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore Cher Ming Tan ... chairs/editors ; sponsored by Nanyang Technological University (Singapore) ... |
| title_full_unstemmed | Microelectronic yield, reliability, and advanced packaging 28-30 November 2000, Singapore Cher Ming Tan ... chairs/editors ; sponsored by Nanyang Technological University (Singapore) ... |
| title_short | Microelectronic yield, reliability, and advanced packaging |
| title_sort | microelectronic yield reliability and advanced packaging 28 30 november 2000 singapore |
| title_sub | 28-30 November 2000, Singapore |
| topic | Microelectromechanical systems Reliability Congresses Microelectronic packaging Congresses |
| topic_facet | Microelectromechanical systems Reliability Congresses Microelectronic packaging Congresses Konferenzschrift |
| volume_link | (DE-604)BV000010887 |
| work_keys_str_mv | AT tancherming microelectronicyieldreliabilityandadvancedpackaging2830november2000singapore AT nanyangtechnologicaluniversity microelectronicyieldreliabilityandadvancedpackaging2830november2000singapore |