(2000). Microelectronic yield, reliability, and advanced packaging: 28-30 November 2000, Singapore. SPIE.
Chicago Style (17th ed.) CitationMicroelectronic Yield, Reliability, and Advanced Packaging: 28-30 November 2000, Singapore. Bellingham, Wash: SPIE, 2000.
MLA (9th ed.) CitationMicroelectronic Yield, Reliability, and Advanced Packaging: 28-30 November 2000, Singapore. SPIE, 2000.
Warning: These citations may not always be 100% accurate.