Silicon wafer bonding technology for VLSI and MEMS applications:
Saved in:
| Format: | Book |
|---|---|
| Language: | English |
| Published: |
Stevenage
Institution of Electrical Engineers
2002
|
| Series: | EMIS processing series
1 |
| Subjects: | |
| Physical Description: | XXV, 149 S. Ill., graph. Darst. |
| ISBN: | 0852960395 |
Staff View
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Record in the Search Index
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| genre_facet | Konferenzschrift |
| id | DE-604.BV014262527 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T19:00:37Z |
| institution | BVB |
| isbn | 0852960395 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009781477 |
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| owner_facet | DE-91 DE-BY-TUM DE-91G DE-BY-TUM DE-703 DE-83 |
| physical | XXV, 149 S. Ill., graph. Darst. |
| publishDate | 2002 |
| publishDateSearch | 2002 |
| publishDateSort | 2002 |
| publisher | Institution of Electrical Engineers |
| record_format | marc |
| series | EMIS processing series |
| series2 | EMIS processing series |
| spelling | Silicon wafer bonding technology for VLSI and MEMS applications ed. by Subramanian S. Iyer and Andre J. Auberton-Hervé Stevenage Institution of Electrical Engineers 2002 XXV, 149 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier EMIS processing series 1 Silicium (DE-588)4077445-4 gnd rswk-swf Mikromechanik (DE-588)4205811-9 gnd rswk-swf Bonden (DE-588)4232594-8 gnd rswk-swf VLSI (DE-588)4117388-0 gnd rswk-swf Wafer (DE-588)4294605-0 gnd rswk-swf Satellitenfunk (DE-588)4138349-7 gnd rswk-swf (DE-588)1071861417 Konferenzschrift gnd-content Silicium (DE-588)4077445-4 s Wafer (DE-588)4294605-0 s Bonden (DE-588)4232594-8 s Mikromechanik (DE-588)4205811-9 s DE-604 VLSI (DE-588)4117388-0 s Satellitenfunk (DE-588)4138349-7 s Iyer, Subramanian S. Sonstige oth EMIS processing series 1 (DE-604)BV014262489 1 |
| spellingShingle | Silicon wafer bonding technology for VLSI and MEMS applications EMIS processing series Silicium (DE-588)4077445-4 gnd Mikromechanik (DE-588)4205811-9 gnd Bonden (DE-588)4232594-8 gnd VLSI (DE-588)4117388-0 gnd Wafer (DE-588)4294605-0 gnd Satellitenfunk (DE-588)4138349-7 gnd |
| subject_GND | (DE-588)4077445-4 (DE-588)4205811-9 (DE-588)4232594-8 (DE-588)4117388-0 (DE-588)4294605-0 (DE-588)4138349-7 (DE-588)1071861417 |
| title | Silicon wafer bonding technology for VLSI and MEMS applications |
| title_auth | Silicon wafer bonding technology for VLSI and MEMS applications |
| title_exact_search | Silicon wafer bonding technology for VLSI and MEMS applications |
| title_full | Silicon wafer bonding technology for VLSI and MEMS applications ed. by Subramanian S. Iyer and Andre J. Auberton-Hervé |
| title_fullStr | Silicon wafer bonding technology for VLSI and MEMS applications ed. by Subramanian S. Iyer and Andre J. Auberton-Hervé |
| title_full_unstemmed | Silicon wafer bonding technology for VLSI and MEMS applications ed. by Subramanian S. Iyer and Andre J. Auberton-Hervé |
| title_short | Silicon wafer bonding technology for VLSI and MEMS applications |
| title_sort | silicon wafer bonding technology for vlsi and mems applications |
| topic | Silicium (DE-588)4077445-4 gnd Mikromechanik (DE-588)4205811-9 gnd Bonden (DE-588)4232594-8 gnd VLSI (DE-588)4117388-0 gnd Wafer (DE-588)4294605-0 gnd Satellitenfunk (DE-588)4138349-7 gnd |
| topic_facet | Silicium Mikromechanik Bonden VLSI Wafer Satellitenfunk Konferenzschrift |
| volume_link | (DE-604)BV014262489 |
| work_keys_str_mv | AT iyersubramanians siliconwaferbondingtechnologyforvlsiandmemsapplications |