Silicon wafer bonding technology for VLSI and MEMS applications:
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Stevenage
Institution of Electrical Engineers
2002
|
| Schriftenreihe: | EMIS processing series
1 |
| Schlagworte: | |
| Beschreibung: | XXV, 149 S. Ill., graph. Darst. |
| ISBN: | 0852960395 |
Internformat
MARC
| LEADER | 00000nam a2200000 cb4500 | ||
|---|---|---|---|
| 001 | BV014262527 | ||
| 003 | DE-604 | ||
| 005 | 20111004 | ||
| 007 | t | ||
| 008 | 020424s2002 ad|| |||| 00||| eng d | ||
| 020 | |a 0852960395 |9 0-85296-039-5 | ||
| 035 | |a (OCoLC)632794577 | ||
| 035 | |a (DE-599)BVBBV014262527 | ||
| 040 | |a DE-604 |b ger |e rakwb | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-91 |a DE-91G |a DE-703 |a DE-83 | ||
| 084 | |a UP 7570 |0 (DE-625)146436: |2 rvk | ||
| 084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
| 084 | |a FER 792f |2 stub | ||
| 084 | |a ELT 216f |2 stub | ||
| 245 | 1 | 0 | |a Silicon wafer bonding technology for VLSI and MEMS applications |c ed. by Subramanian S. Iyer and Andre J. Auberton-Hervé |
| 264 | 1 | |a Stevenage |b Institution of Electrical Engineers |c 2002 | |
| 300 | |a XXV, 149 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a EMIS processing series |v 1 | |
| 650 | 0 | 7 | |a Silicium |0 (DE-588)4077445-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Mikromechanik |0 (DE-588)4205811-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Bonden |0 (DE-588)4232594-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a VLSI |0 (DE-588)4117388-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Wafer |0 (DE-588)4294605-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Satellitenfunk |0 (DE-588)4138349-7 |2 gnd |9 rswk-swf |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 689 | 0 | 0 | |a Silicium |0 (DE-588)4077445-4 |D s |
| 689 | 0 | 1 | |a Wafer |0 (DE-588)4294605-0 |D s |
| 689 | 0 | 2 | |a Bonden |0 (DE-588)4232594-8 |D s |
| 689 | 0 | 3 | |a Mikromechanik |0 (DE-588)4205811-9 |D s |
| 689 | 0 | |5 DE-604 | |
| 689 | 1 | 0 | |a Silicium |0 (DE-588)4077445-4 |D s |
| 689 | 1 | 1 | |a Wafer |0 (DE-588)4294605-0 |D s |
| 689 | 1 | 2 | |a Bonden |0 (DE-588)4232594-8 |D s |
| 689 | 1 | 3 | |a VLSI |0 (DE-588)4117388-0 |D s |
| 689 | 1 | |5 DE-604 | |
| 689 | 2 | 0 | |a Satellitenfunk |0 (DE-588)4138349-7 |D s |
| 689 | 2 | |5 DE-604 | |
| 700 | 1 | |a Iyer, Subramanian S. |e Sonstige |4 oth | |
| 830 | 0 | |a EMIS processing series |v 1 |w (DE-604)BV014262489 |9 1 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-009781477 | ||
Datensatz im Suchindex
| _version_ | 1804129154015166464 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV014262527 |
| classification_rvk | UP 7570 ZN 4192 |
| classification_tum | FER 792f ELT 216f |
| ctrlnum | (OCoLC)632794577 (DE-599)BVBBV014262527 |
| discipline | Physik Elektrotechnik Fertigungstechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02003nam a2200553 cb4500</leader><controlfield tag="001">BV014262527</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20111004 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">020424s2002 ad|| |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0852960395</subfield><subfield code="9">0-85296-039-5</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)632794577</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV014262527</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-91</subfield><subfield code="a">DE-91G</subfield><subfield code="a">DE-703</subfield><subfield code="a">DE-83</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">UP 7570</subfield><subfield code="0">(DE-625)146436:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4192</subfield><subfield code="0">(DE-625)157372:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">FER 792f</subfield><subfield code="2">stub</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 216f</subfield><subfield code="2">stub</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Silicon wafer bonding technology for VLSI and MEMS applications</subfield><subfield code="c">ed. by Subramanian S. Iyer and Andre J. Auberton-Hervé</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Stevenage</subfield><subfield code="b">Institution of Electrical Engineers</subfield><subfield code="c">2002</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">XXV, 149 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">EMIS processing series</subfield><subfield code="v">1</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Silicium</subfield><subfield code="0">(DE-588)4077445-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikromechanik</subfield><subfield code="0">(DE-588)4205811-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">VLSI</subfield><subfield code="0">(DE-588)4117388-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Wafer</subfield><subfield code="0">(DE-588)4294605-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Satellitenfunk</subfield><subfield code="0">(DE-588)4138349-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Silicium</subfield><subfield code="0">(DE-588)4077445-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Wafer</subfield><subfield code="0">(DE-588)4294605-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Mikromechanik</subfield><subfield code="0">(DE-588)4205811-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Silicium</subfield><subfield code="0">(DE-588)4077445-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="1"><subfield code="a">Wafer</subfield><subfield code="0">(DE-588)4294605-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="2"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="3"><subfield code="a">VLSI</subfield><subfield code="0">(DE-588)4117388-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="2" ind2="0"><subfield code="a">Satellitenfunk</subfield><subfield code="0">(DE-588)4138349-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="2" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Iyer, Subramanian S.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">EMIS processing series</subfield><subfield code="v">1</subfield><subfield code="w">(DE-604)BV014262489</subfield><subfield code="9">1</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-009781477</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV014262527 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T19:00:37Z |
| institution | BVB |
| isbn | 0852960395 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009781477 |
| oclc_num | 632794577 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM DE-91G DE-BY-TUM DE-703 DE-83 |
| owner_facet | DE-91 DE-BY-TUM DE-91G DE-BY-TUM DE-703 DE-83 |
| physical | XXV, 149 S. Ill., graph. Darst. |
| publishDate | 2002 |
| publishDateSearch | 2002 |
| publishDateSort | 2002 |
| publisher | Institution of Electrical Engineers |
| record_format | marc |
| series | EMIS processing series |
| series2 | EMIS processing series |
| spelling | Silicon wafer bonding technology for VLSI and MEMS applications ed. by Subramanian S. Iyer and Andre J. Auberton-Hervé Stevenage Institution of Electrical Engineers 2002 XXV, 149 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier EMIS processing series 1 Silicium (DE-588)4077445-4 gnd rswk-swf Mikromechanik (DE-588)4205811-9 gnd rswk-swf Bonden (DE-588)4232594-8 gnd rswk-swf VLSI (DE-588)4117388-0 gnd rswk-swf Wafer (DE-588)4294605-0 gnd rswk-swf Satellitenfunk (DE-588)4138349-7 gnd rswk-swf (DE-588)1071861417 Konferenzschrift gnd-content Silicium (DE-588)4077445-4 s Wafer (DE-588)4294605-0 s Bonden (DE-588)4232594-8 s Mikromechanik (DE-588)4205811-9 s DE-604 VLSI (DE-588)4117388-0 s Satellitenfunk (DE-588)4138349-7 s Iyer, Subramanian S. Sonstige oth EMIS processing series 1 (DE-604)BV014262489 1 |
| spellingShingle | Silicon wafer bonding technology for VLSI and MEMS applications EMIS processing series Silicium (DE-588)4077445-4 gnd Mikromechanik (DE-588)4205811-9 gnd Bonden (DE-588)4232594-8 gnd VLSI (DE-588)4117388-0 gnd Wafer (DE-588)4294605-0 gnd Satellitenfunk (DE-588)4138349-7 gnd |
| subject_GND | (DE-588)4077445-4 (DE-588)4205811-9 (DE-588)4232594-8 (DE-588)4117388-0 (DE-588)4294605-0 (DE-588)4138349-7 (DE-588)1071861417 |
| title | Silicon wafer bonding technology for VLSI and MEMS applications |
| title_auth | Silicon wafer bonding technology for VLSI and MEMS applications |
| title_exact_search | Silicon wafer bonding technology for VLSI and MEMS applications |
| title_full | Silicon wafer bonding technology for VLSI and MEMS applications ed. by Subramanian S. Iyer and Andre J. Auberton-Hervé |
| title_fullStr | Silicon wafer bonding technology for VLSI and MEMS applications ed. by Subramanian S. Iyer and Andre J. Auberton-Hervé |
| title_full_unstemmed | Silicon wafer bonding technology for VLSI and MEMS applications ed. by Subramanian S. Iyer and Andre J. Auberton-Hervé |
| title_short | Silicon wafer bonding technology for VLSI and MEMS applications |
| title_sort | silicon wafer bonding technology for vlsi and mems applications |
| topic | Silicium (DE-588)4077445-4 gnd Mikromechanik (DE-588)4205811-9 gnd Bonden (DE-588)4232594-8 gnd VLSI (DE-588)4117388-0 gnd Wafer (DE-588)4294605-0 gnd Satellitenfunk (DE-588)4138349-7 gnd |
| topic_facet | Silicium Mikromechanik Bonden VLSI Wafer Satellitenfunk Konferenzschrift |
| volume_link | (DE-604)BV014262489 |
| work_keys_str_mv | AT iyersubramanians siliconwaferbondingtechnologyforvlsiandmemsapplications |