Thermal stress and strain in microelectronics packaging:
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
New York
Van Nostrand Reinhold
1993
|
| Schlagworte: | |
| Beschreibung: | XXII, 883 S. Ill., graph. Darst. |
| ISBN: | 0442010583 |
Internformat
MARC
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| 245 | 1 | 0 | |a Thermal stress and strain in microelectronics packaging |c ed. by John H. Lau |
| 264 | 1 | |a New York |b Van Nostrand Reinhold |c 1993 | |
| 300 | |a XXII, 883 S. |b Ill., graph. Darst. | ||
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| 700 | 1 | |a Lau, John H. |e Sonstige |4 oth | |
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Datensatz im Suchindex
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
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| id | DE-604.BV014156564 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:58:41Z |
| institution | BVB |
| isbn | 0442010583 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009702536 |
| oclc_num | 27107879 |
| open_access_boolean | |
| owner | DE-29T |
| owner_facet | DE-29T |
| physical | XXII, 883 S. Ill., graph. Darst. |
| publishDate | 1993 |
| publishDateSearch | 1993 |
| publishDateSort | 1993 |
| publisher | Van Nostrand Reinhold |
| record_format | marc |
| spelling | Thermal stress and strain in microelectronics packaging ed. by John H. Lau New York Van Nostrand Reinhold 1993 XXII, 883 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electronic packaging Microelectronic packaging Thermal stresses Thermomechanische Eigenschaft (DE-588)4194417-3 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 s Thermomechanische Eigenschaft (DE-588)4194417-3 s DE-604 Lau, John H. Sonstige oth |
| spellingShingle | Thermal stress and strain in microelectronics packaging Electronic packaging Microelectronic packaging Thermal stresses Thermomechanische Eigenschaft (DE-588)4194417-3 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| subject_GND | (DE-588)4194417-3 (DE-588)4039207-7 |
| title | Thermal stress and strain in microelectronics packaging |
| title_auth | Thermal stress and strain in microelectronics packaging |
| title_exact_search | Thermal stress and strain in microelectronics packaging |
| title_full | Thermal stress and strain in microelectronics packaging ed. by John H. Lau |
| title_fullStr | Thermal stress and strain in microelectronics packaging ed. by John H. Lau |
| title_full_unstemmed | Thermal stress and strain in microelectronics packaging ed. by John H. Lau |
| title_short | Thermal stress and strain in microelectronics packaging |
| title_sort | thermal stress and strain in microelectronics packaging |
| topic | Electronic packaging Microelectronic packaging Thermal stresses Thermomechanische Eigenschaft (DE-588)4194417-3 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| topic_facet | Electronic packaging Microelectronic packaging Thermal stresses Thermomechanische Eigenschaft Mikroelektronik |
| work_keys_str_mv | AT laujohnh thermalstressandstraininmicroelectronicspackaging |