Low cost flip chip technologies: for DCA, WLCSP, and PBGA assemblies
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
New York [u.a.]
McGraw-Hill
2000
|
| Schriftenreihe: | McGraw-Hill professional engineering
|
| Schlagworte: | |
| Beschreibung: | XXII, 585 S. Ill., graph. Darst. |
| ISBN: | 0071351418 |
Internformat
MARC
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| 264 | 1 | |a New York [u.a.] |b McGraw-Hill |c 2000 | |
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Datensatz im Suchindex
| _version_ | 1804128743093960704 |
|---|---|
| any_adam_object | |
| author | Lau, John H. |
| author_facet | Lau, John H. |
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| author_sort | Lau, John H. |
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| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
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| id | DE-604.BV013899143 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:54:05Z |
| institution | BVB |
| isbn | 0071351418 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009511617 |
| oclc_num | 43036843 |
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| physical | XXII, 585 S. Ill., graph. Darst. |
| publishDate | 2000 |
| publishDateSearch | 2000 |
| publishDateSort | 2000 |
| publisher | McGraw-Hill |
| record_format | marc |
| series2 | McGraw-Hill professional engineering |
| spelling | Lau, John H. Verfasser aut Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies John H. Lau New York [u.a.] McGraw-Hill 2000 XXII, 585 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier McGraw-Hill professional engineering Flip chip technology Multichip modules (Microelectronics) Design and construction Flip-Chip-Technologie (DE-588)4427284-4 gnd rswk-swf Flip-Chip-Technologie (DE-588)4427284-4 s DE-604 |
| spellingShingle | Lau, John H. Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies Flip chip technology Multichip modules (Microelectronics) Design and construction Flip-Chip-Technologie (DE-588)4427284-4 gnd |
| subject_GND | (DE-588)4427284-4 |
| title | Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies |
| title_auth | Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies |
| title_exact_search | Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies |
| title_full | Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies John H. Lau |
| title_fullStr | Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies John H. Lau |
| title_full_unstemmed | Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies John H. Lau |
| title_short | Low cost flip chip technologies |
| title_sort | low cost flip chip technologies for dca wlcsp and pbga assemblies |
| title_sub | for DCA, WLCSP, and PBGA assemblies |
| topic | Flip chip technology Multichip modules (Microelectronics) Design and construction Flip-Chip-Technologie (DE-588)4427284-4 gnd |
| topic_facet | Flip chip technology Multichip modules (Microelectronics) Design and construction Flip-Chip-Technologie |
| work_keys_str_mv | AT laujohnh lowcostflipchiptechnologiesfordcawlcspandpbgaassemblies |