LIA handbook of laser materials processing:
Gespeichert in:
| Körperschaft: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Orlando, FL
Laser Inst. of America [u.a.]
2001
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| Ausgabe: | 1. ed. |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | XXV, 715 S. Ill., graph. Darst. |
| ISBN: | 0912035153 0941463028 |
Internformat
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| 245 | 1 | 0 | |a LIA handbook of laser materials processing |c ed. in chief: John F. Ready |
| 246 | 1 | 3 | |a Handbook of laser materials processing |
| 250 | |a 1. ed. | ||
| 264 | 1 | |a Orlando, FL |b Laser Inst. of America [u.a.] |c 2001 | |
| 300 | |a XXV, 715 S. |b Ill., graph. Darst. | ||
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| 650 | 4 | |a Fabrication - Guides, manuels, etc | |
| 650 | 4 | |a Lasers - Applications industrielles - Guides, manuels, etc | |
| 650 | 4 | |a Lasers |x Industrial applications |v Handbooks, manuals, etc | |
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Datensatz im Suchindex
| _version_ | 1804128693307572224 |
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| adam_text | J.F. READY, D.F. FARSON, T. FEELEY (EDS.): LIA HANDBOOK OF LASER
MATERIALS PROCESSING ISBN 3-540-41770-2 SPRINGER-VERLAG BERLIN
HEIDELBERG NEW YORK CONTENTS CHAPTER 1 OVERVIEW OF LASER MATERIALS
PROCESSING 1.0 INTRODUCTION 1.1 LASER PARAMETERS 1.1.1 LASER BEAM
PARAMETERS 1.1.2 POLARIZATION 1.2 ABSORPTION OF LASER ENERGY 1.2.1
REFLECTION 1.2.2 ABSORPTION 1.2.3 FOCUSING OF LASER LIGHT 1.2.4 LASER
DAMAGE 1.3 LASER CONFIGURATIONS 1.3.1 MODAL CHARACTERISTICS 1.3.2
TEMPORAL BEHAVIOR 1.3.3 SURVEY OF ACTIVE MEDIA 1.3.4 COMMERCIAL LASERS
FOR MATERIALS PROCESSING 1.4 LASER SYSTEMS 1.4.0 INTRODUCTION 1.4.1
SUBSYSTEMS 1.4.2 ILLUSTRATIONS OF COMPLETE MATERIALS PROCESSING SYSTEMS
1.4.3 ILLUSTRATIONS OF TIME- ENERGY-SHARING SYSTEMS CHAPTER 2 LASERS FOR
MATERIALS PROCESSING 2.0 INTRODUCTION 2.1 CARBON DIOXIDE LASERS 2.1.1
BASIC PRINCIPLES 2.1.2 LASER CONFIGURATIONS 2.1.3 OPTICS 2.1.4 POWER
SOURCES, ACCESSORIES AND CONTROLS 2.1.5 LIFETIME, CARE AND MAINTENANCE
2.1.6 LASER GASES FOR CO2 LASER RESONATORS 2.2 ND:YAG LASERS 2.2.1 BASIC
PRINCIPLES 2.2.2 LASER CONFIGURATIONS 2.2.3 PUMP SOURCES 2.2.4 POWER
CONTROL 2.2.5 LIFETIME, CARE AND MAINTENANCE 2.2.6 OUTPUT BEAM QUALITY
2.3 OTHER SOLID-STATE LASERS 2.4 EXCIMER LASERS 2.4.1 BASIC PRINCIPLES
2.4.2 WAVELENGTHS 2.4.3 RESONATOR CONFIGURATIONS 2.4.4 OPTICAL
CONFIGURATIONS 2.4 5 POWER SOURCES 2.4.6 LIFETIME, CARE AND MAINTENANCE
2.4.7 GAS FOR EXCIMER LASERS 2.5 OTHER LASERS 2.5.0 INTRODUCTION 2.5.1
CO LASERS 2.5.2 METAL VAPOR LASERS 2.5.3 ION LASERS 2.5.4 DIODE LASERS
INTRODUCTION TO DIODE LASERS HIGH-POWER DIODE LASERS FOR MATERIALS
PROCESSING 2.5.5 IODINE LASERS THE CHEMICAL OXYGEN IODINE LASER (COIL)
PHOTOLYTIC IODINE LASER 2.5.6 NONLINEAR OPTICAL EFFECTS IN CRYSTALS
2.5.7 FREE-ELECTRON LASERS 2.5.8 X-RAY LASERS 2.5.9 ULTRAFAST LASERS FOR
MATERIALS PROCESSING 2.6 WATER CHILLER CONSIDERATIONS FOR LASER-COOLING
APPLICATIONS 2.6.0 INTRODUCTION 2.6.1 CAPACITY OF COOLING SYSTEM 2.6.2
POWER REQUIREMENTS 2.6.3 CHILLER SYSTEM COMPONENTS 2.6.4 WATER ISSUES
CHAPTER 3 OPTICS AND OPTICAL SYSTEMS 3.0 INTRODUCTION 3.1 PROPERTIES OF
LASER BEAMS 3.1.1 MONOCHROMATICITY 3.1.2 DIRECTIONALITY 3.1.3 COHERENCE
3.1.4 BRIGHTNESS 3.1.5 STABLE RESONATOR MODES 3.1.6 POLARIZATION 3.2
BEAM DELIVERY BEFORE FOCUSING 3.2.0 INTRODUCTION 3.2.1 CONVENTIONAL BEAM
DELIVERY 3.2.2 FIBER OPTIC BEAM DELIVERY: DIODE LASERS 3.2.3 FIBER OPTIC
BEAM DELIVERY: ND:YAG LASERS 3.2.4 ROBOTIC APPLICATIONS 3.3 FOCUSING AND
DEPTH OF FOCUS 3.3.1 FOCUSING 3.3.2 DEPTH OF FOCUS 3.4 MODE QUALITY
CHAPTER 4 COMPONENTS FOR LASER MATERIALS PROCESSING SYSTEMS 4.0
INTRODUCTION 4.1 COMPONENTS FOR BEAM DELIVERY SYSTEMS 4.1.1 GENERAL
REMARKS ON BEAM DELIVERY SYSTEMS AND DESIGN CRITERIA 4.1.2 COMPONENTS
FOR BEAM DELIVERY 4.1.3 ADJUSTMENT/ALIGNMENT OF BEAM DELIVERY SYSTEMS
4.2 FOCUSING OPTICS 4.2.0 INTRODUCTION 4.2.1 LENSES 4.2.2 MIRRORS 4.2.3
DIFFRACTIVE OPTICS 4.2.4 FOCUSING HEAD AND INTEGRATED ACTUATORS 4.3
OTHER OPTICAL COMPONENTS 4.3.1 BEAM SHAPING OPTICS 4.3.2 SCANNERS 4.3.3
BEAM SPLITTERS 4.3.4 POLARIZERS 4.3.5 ISOLATORS 4.3.6 INFRARED AND
ULTRAVIOLET TRANSMITTING MATERIALS 4.4 PHOTODETECTORS 4.4.1 BASICS OF
PHOTODETECTORS 4.4.2 COMMONLY USED DETECTORS 4.5 BEAM MONITORING AND
MEASUREMENT 4.5.1 BEAM SAMPLERS 4.5.2 ENERGY METERS 4.5.3 POWER METERS
4.5.4 OPTIMIZING METERS 4.5.5 POSITIONING OF POWER MONITORS 4.5.6 BEAM
PROFILERS 4.6 COMPONENTS FOR MOTION SYSTEMS 4.6.1 BASIC CONSIDERATIONS
4.6.2 GUIDING METHODS 4.6.3 DRIVE UNITS 4.7 CONTROLLERS 4.7.1 LASER AND
MOTION CONTROL 4.7.2 LASER SYSTEM CONTROL 4.7.3 PROGRAMMING 4.7.4
CAD/CAM AND OFF-LINE PROGRAMMING 4.8 PROCESS GAS NOZZLES 4.8.0
INTRODUCTION 4.8.1 NOZZLE CONFIGURATIONS 4.8.2 NOZZLE SELECTION 4.8.3
PROCESS GAS NOZZLES FOR CUTTING 4.9 PROCESS MONITORING SYSTEMS 4.9.1
OPTICAL PENETRATION SENSING 4.9.2 OPTICAL PLASMA INTENSITY MONITORING
4.9.3 ACOUSTIC SENSING 4.9.4 NEURAL NETWORKS 4.9.5 SEAM TRACKING BASIC
CONSIDERATIONS EVALUATION OF SEAM TRACKING METHODS 4.9.6 MEASUREMENT
OF KEYHOLE DEPTH 4.9.7 INFRARED MONITORING CHAPTER 5 LASER -MATERIAL
INTERACTIONS 5.0 INTRODUCTION 5.1 MATERIALS CHARACTERISTICS 5.1.1
OPTICAL PROPERTIES 5.1.2 THERMAL PROPERTIES 5.2 LASER CHARACTERISTICS
5.2.1 IMPORTANT LASER PROPERTIES 5.2.2 PULSED VERSUS CW CHARACTERISTICS
5.2.3 FOCUSING CHARACTERISTICS 5.2.4 IRRADIANCE 5.2.5 IMPORTANT LASERS
FOR MATERIALS PROCESSING APPLICATIONS 5.3 REFLECTIVITY AND ABSORPTIVITY
OF OPAQUE SURFACES 5.3.1 DEFINITIONS 5.3.2 PREDICTIONS FROM
ELECTROMAGNETIC WAVE THEORY 5.3.3 REFLECTIVITIES OF METALS 5.3.4
REFLECTIVITIES IN NONCONDUCTORS 5.3.5 POLARIZATION EFFECTS 5.3.6 EFFECTS
OF SURFACE CONDITIONS 5.3.7 SUMMARY 5.4 ABSORPTION OF LASER RADIATION
5.4.1 ABSORPTION COEFFICIENTS 5.4.2 SEMITRANSPARENT SHEETS 5.4.3
VARIATION DURING IRRADIATION 5.5 ENERGY TRANSPORT IN LASER-IRRADIATED
MATERIALS 5.5.0 INTRODUCTION 5.5.1 PARAMETERS 5.5.2 HEAT BALANCE 5.5.3
CONDUCTION 5.5.4 CONVECTION 5.5.5 VAPORIZATION 5.5.6 MASS DIFFUSION
5.5.7 SPECIFIC EXAMPLES 5.6 PHASE CHANGES 5.7 PLASMA SHIELDING 5.7.0
INTRODUCTION 5.7.1 ATMOSPHERIC BREAKDOWN 5.7.2 LASER-SUPPORTED
ABSORPTION WAVES 5.7.3 CONSEQUENCES OF PLASMA SHIELDING 5.8 REGIMES OF
IRRADIANCE AND INTERACTION TIME CHAPTER 6 HAZARDS AND SAFETY
CONSIDERATIONS 6.0 INTRODUCTION 6.1 HEALTH HAZARDS AND PERSONNEL SAFETY
6.1.1 SPECIFIC BIOLOGICAL EFFECTS 6.1.2 HAZARD CLASSIFICATION: CLASSES
OF LASERS 6.1.3 SAFETY MEASURES 6.2 SAFETY WITH INDUSTRIAL LASERS 6.2.1
INDUSTRIAL LASER SYSTEMS 6.2.2 WORKPLACE SURVEILLANCE 6.3 SPECIFIC
SYSTEMS AND APPLICATIONS 6.3.1 PORTABLE LASER WELDERS - AN EXAMPLE 6.3.2
BEAM ALIGNMENT HAZARDS 6.4 NONBEAM HAZARDS 6.4.1 TYPES OF NONBEAM
HAZARDS 6.4.2 LASER GENERATED CHEMICAL HAZARDS 6.4.3 PHYSICAL HAZARDS
6.4.4 PERSONNEL PROTECTIVE EQUIPMENT 6.4.5 BIOLOGICAL/MEDICAL HAZARDS
6.5 LASER SAFETY STANDARDS 6.5.1 TERMS AND ABBREVIATIONS 6.5.2 UNITED
STATES STANDARDS 6.5.3 INTERNATIONAL STANDARDS 6.5.4 EUROPEAN AND OTHER
NATIONS* STANDARDS AND DIRECTIVES 6.5.5 SOURCES CHAPTER 7 SURFACE
TREATMENT: HEAT TREATMENT 7.0 INTRODUCTION 7.1 PRINCIPLES OF
TRANSFORMATION HARDENING 7.2 LASER AND OPTICS FOR HEAT TREATING 7.2.1
LASERS 7.2.2 OPTICS 7.2.3 OPTICS FOR UNIFORM BEAM PROFILES 7.3 RESULTS
OF LASER HEAT TREATMENT 7.3.0 INTRODUCTION 7.3.1 IRRADIANCE VERSUS
INTERACTION TIME 7.3.2 SUMMARY OF LASER HEAT TREATMENT DATA 7.3.3 EFFECT
OF PROCESS VARIABLES 7.3.4 RESIDUAL STRESSES IN LASER HEAT TREATMENT
7.3.5 LASER HEAT TREATMENT HARDNESS DATA 7.3.6 SURFACE HARDENING WITH
DIODE LASERS 7.4 MATERIALS AND TESTING 7.4.1 ALLOY EFFECTS 7.4.2 SURFACE
CONDITION 7.5 SURFACE PROPERTIES 7.5.0 INTRODUCTION 7.5.1 CHEMICAL
COMPOSITION 7.5.2 HARDNESS AND ITS DISTRIBUTION ALONG THE SURFACE 7.5.3
RESIDUAL STRESSES 7.5.4 RESIDUAL DEFORMATION 7.5.5 MECHANICAL
CHARACTERISTICS 7.5.6 HEAT RESISTANCE 7.5.7 CORROSION RESISTANCE 7.5.8
WEAR RESISTANCE 7.6 APPLICATIONS OF HEAT TREATING 7.6.1 STEERING GEAR
ASSEMBLIES 7.6.2 DIESEL ENGINE CYLINDER LINERS 7.6.3 TURBINE BLADE
HARDENING 7.7 COMPARISON WITH OTHER TECHNOLOGIES 7.7.1
ADVANTAGES/DISADVANTAGES 7.7.2 ECONOMIC CONSIDERATIONS CHAPTER 8 SURFACE
TREATMENT: GLAZING, REMELTING, ALLOYING, CLADDING, AND CLEANING 8.0
INTRODUCTION 8.1 RAPID MELTING 8.1.1 MELTING KINETICS 8.1.2 ABSORPTION
MECHANISM 8.1.3 EFFECTS OF CONVECTION 8.1.4 TEMPERATURE DISTRIBUTION IN
THE MELT 8.2 RAPID SOLIDIFICATION AND MICROSTRUCTURE 8.2.1
SOLIDIFICATION 8.2.2 TEMPERATURE DISTRIBUTION DURING COOLING 8.2.3
DENDRITE SPACING 8.3 APPROPRIATE LASERS AND OPTICS 8.3.1 ND:YAG LASERS
8.3.2 CO2 LASERS 8.4 LASER GLAZING 8.4.1 THE GLAZING PROCESS 8.4.2 RAPID
COOLING 8.5 SURFACE REMELTING 8.5.1 SURFACE REMELTING OF BEARINGS 8.5.2
MELTING CAST-IRON SURFACES 8.6 SURFACE ALLOYING 8.6.1 BASICS OF LASER
ALLOYING 8.6.2 MATERIALS DEPOSITION TECHNIQUES 8.6.3 MIXING
CHARACTERISTICS 8.6.4 ENHANCED SURFACE PROPERTIES 8.7 SURFACE CLADDING
8.7. 0 INTRODUCTION 8.7.1 CLADDING TECHNIQUES 8.7. 2 FEEDING PRINCIPLES
8.7. 3 PROCESS CHARACTERISTICS 8.7. 4 CLADDING CHARACTERISTICS 8.7. 5
CLADDING MATERIALS 8.7. 6 PROCESS BENEFITS 8.7. 7 PROCESS DRAWBACKS 8.7.
8 APPLICATIONS 8.7. 9 SPECIAL APPLICATIONS 8.8 CLEANING 8.8.0
INTRODUCTION 8.8.1 SURFACE CLEANINGS 8.8.2 CONTAMINANT REMOVAL 8.8.3
REMOVAL OF PAINT, DIELECTRIC AND OTHER COATINGS 8.9 DISK TEXTURING
CHAPTER 9 BRAZING/SOLDERING 9.1 PROCESS DEFINITION 9.2 APPROPRIATE
LASERS 9.3 BEAM MANIPULATION TECHNIQUES 9.4 APPLICATIONS AND RESULTS
9.4.1 BRAZING OF STEEL 9.4.2 BRAZING OF TITANIUM 9.4.3 JOINING OF
DISSIMILAR MATERIALS 9.4.4 SOLDERING APPLICATIONS WITH DIODE LASERS
CHAPTER 10 CONDUCTION WELDING 10.0 INTRODUCTION 10.1 BASIC DESCRIPTION
OF LASER WELDING 10.1.1 USE OF LASER WELDING 10.1.2 METAL REFLECTIVITY
10.1.3 THERMAL PROPERTIES OF METALS 10.1.4 FUSION FRONT PENETRATION
10.1.5 THERMAL CONDUCTION LIMITATIONS 10.2 WELDING PROCEDURES 10.2.1
LASER CHARACTERISTICS 10.2.2 OPTICS 10.2.3 FOCUS POSITION 10.2.4 SURFACE
CONDITIONS 10.2.5 JOINT DESIGN: CONFIGURATIONS AND TOLERANCES 10.2.6
JOINT DESIGN: CHOICE 10.2.7 ELEMENTS OF QUALITY 10.2.8 PROCESSING GASES
10.2.9 GUIDELINES 10.3 LASER WELDING RESULTS 10.3.1 ND:YAG LASER WELDING
10.3.2 ND:YAG LASER WELDING GUIDELINES 10.3.3 ND:YAG LASER CW SEAM
WELDING OF COMMON MATERIALS 10.3.4 ND:YAG PULSED-SEAM WELDING 10.3.5
SPOT WELDING WITH PULSED ND:YAG LASERS 10.3.6 MICROJOINING WITH ND:YAG
LASERS 10.3.7 CONDUCTION WELDING WITH CO2 LASERS 10.3.8 WELDING WITH LOW
POWER CO2 LASERS 10.3.9 WELDING WITH DIODE LASERS 10.3.10 WELDING WITH
PHOTOLYTIC IODINE LASERS (PILS) 10.4 MATERIALS ISSUES 10.4.1 TABULATION
OF MATERIALS AND WELDABILITY 10.4.2 WELDING OF DISSIMILAR MATERIALS 10.5
COMPARISON OF LASER WELDING WITH OTHER TECHNOLOGIES 10.5.1
ADVANTAGES/LIMITATIONS 10.5.2 ECONOMIC CONSIDERATIONS 10.5.3 COMPARISON
OF WELDING RESULTS CHAPTER 11 - PENETRATION WELDING 11.0 INTRODUCTION
11.1 DESCRIPTION OF PENETRATION WELDING 11.1.1 THE DEEP PENETRATION
PROCESS 11.1.2 MOTION OF THE KEYHOLE 11.1.3 PENETRATION 11.1 4 LASERS
FOR PENETRATION WELDING 11.1.5 MELTING EFFICIENCY 11.2 WELDING
PROCEDURES 11.2.1 LASER CHOICE 11.2.2 OPTICS 11.2.3 FOCUS POSITION
11.2.4 SURFACE CONDITIONS 11.2.5 JOINT DESIGN 11.2.6 EDGE PREPARATION
11.2.7 FIXTURING 11.2.8 SHIELDING AND PLASMA CONTROL 11.2.9 PREHEATING
11.2.10 SPATTER CONTROL 11.2.11 PROCESS MONITORING SYSTEMS 11.2.12 POST
TREATMENT 11.2.13 FILLER MATERIAL CONSIDERATIONS 11.3 WELDING DATA
SUMMARY 11.3.1 HIGH-POWER LASER WELDING OF COMMON MATERIALS 11.3.2 CO2
LASER CW SEAM WELDING OF COMMON MATERIALS; CONDITIONS FOR PENETRATION
WELDING 11.3.3 CW CO2 LASER WELDING OF COMMON MATERIALS 11.3.4 PULSED
CO2 LASER WELDING OF COMMON METALS 11.3.5 ND:YAG CW WELDING OF COMMON
MATERIALS 11.3.6 ND:YAG LASER-PULSED WELDING OF COMMON MATERIALS 11.3.7
COMPARISON OF PENETRATION WELDING WITH ND:YAG AND CO2 LASERS 11.3.8
LASER WELDING WITH FILLER WIRE 11.3.9 WELDING WITH OTHER LASERS 11.3.10
OPERATING COSTS FOR PENETRATION WELDING 11.4 INDUSTRIAL APPLICATIONS OF
HIGH-POWER LASER WELDING 11.4.1 INTRODUCTION 11.4.2 KEY ASPECTS 11.4.3
WELDING THIN SHEET MATERIAL ( 0.5 MM) 11.4.4 SHEET MATERIAL (1 * 3 MM)
11.4.5 WELDING PLATE MATERIAL (4 * 12 MM) 11.4.6 WELD TOLERANCES 11.4.7
HYBRID WELDING 11.4.8 WELD TESTING 11.4.9 PLASTIC WELDING 11.4.10
MATERIAL WELDING SUMMARY 11.4.11 LASER-WELDED TAILORED BLANKS 11.4.12
AUTOMOTIVE APPLICATIONS 11.5 COMPARISON OF LASER WELDING TO OTHER
WELDING TECHNOLOGIES 11.5.1 ALTERNATE WELDING TECHNOLOGIES 11.5.2 KEY
ASPECTS OF COMPARISON 11.5.3 LASER WELDING COMPARISONS 11.5.4 COMPARISON
OF WELDING TECHNOLOGY RESULTS CHAPTER 12 LASER CUTTING 12.1 BASIC
DESCRIPTION OF LASER CUTTING 12.1.1 CUTTING PROCESSES 12.1.2 POWER
BALANCE 12.1.3 APPROPRIATE LASERS 12.1.4 GAS ASSIST TECHNIQUES 12.1.5
CUTTING OF COMPLEX SHAPES 12.1.6 POST-CUTTING OPERATIONS 12.1.7
POLARIZATION EFFECTS IN LASER CUTTING: BASICS 12.1.8 CONTROL OF BEAM
POLARIZATION EFFECTS IN CUTTING 12.2 LASER CUTTING OF METALS 12.2.1 THE
METAL CUTTING PROCESS 12.2.2 CHARACTERISTICS OF LASER-CUT EDGES 12.2.3
LASER CUTTING OF SPECIFIC METALS 12.2.4 CO2 LASER CUTTING OF METALS
12.2.5 ND:YAG LASER CUTTING THICKNESS VERSUS CUTTING SPEED 12.2.6
MICROCUTTING OF METALS WITH PULSED ND:YAG LASERS 12.2.7 CUTTING OF
METALS WITH OTHER LASERS CUTTING WITH A CO LASER CUTTING WITH A CHEMICAL
OXYGEN-IODINE LASER CUTTING WITH PHOTOLYTIC IODINE LASERS 12.3 LASER
CUTTING OF NONMETALS 12.3.1 CUTTING MECHANISMS AND CUT QUALITY 12.3.2
CO2 LASER CUTTING 12.3.3 CUTTING OF NONMETALS WITH ND:YAG LASERS ND:YAG
LASER CUTTING DATA 12.3.4 CUTTING JEWELRY MATERIALS 12.4 COSTS OF LASER
CUTTING 12.4.1 CONVENTIONAL CO2 LASER CUTTING SYSTEM 12.4.2 CONVENTIONAL
ND:YAG LASER CUTTING SYSTEM 12.5 COMPARISON OF LASER CUTTING WITH OTHER
TECHNOLOGIES 12.5.1 ADVANTAGES AND DRAWBACKS OF LASER CUTTING 12.5.2
COMPARISON OF CO2 LASER CUTTING WITH OTHER PROFILING TECHNIQUES 12.5.3
ADVANTAGES AND LIMITATIONS OF LASER CUTTING OF NONMETALS CHAPTER 13 HOLE
DRILLING 13.1 BASIC DESCRIPTION OF LASER DRILLING 13.1.1 SURFACE
REFLECTIVITY 13.1.2 THERMAL PROPERTIES 13.1.3 PHYSICAL PROCESSES:
MELTING, VAPORIZATION, FLUSHING, PERCUSSION 13.1.4 APPROPRIATE LASERS:
POWER/IRRADIANCE, PULSE DURATION 13.1.5 PERCUSSION DRILLING AND
TREPANNING 13.2 DRILLING OF METALS 13.2.0 INTRODUCTION 13.2.1 ND:YAG
LASER DRILLING 13.2.2 CO2 LASERS FOR METAL DRILING 13.2.3 CO2 LASER
DRILLING 13.2.4 DRILLING WITH COPPER VAPOR LASERS 13.2.5 APPLICATIONS OF
COPPER VAPOR LASER DRILLING 13.3 DRILLING OF NONMETALS 13.3.1 GENERAL
CONSIDERATIONS 13.3.2 ND:YAG LASER DRILLING 13.3.3 CO2 LASER DRILLING
13.3.4 EXCIMER LASER DRILLING 13.3.5 COPPER VAPOR LASER DRILLING 13.4
AEROSPACE APPLICATIONS 13.4.1 HOLE REQUIREMENTS 13.4.2 LASER TYPE 13.4.3
TYPICAL FOCUS-HEAD ARRANGEMENT 13.4.4 PERCUSSION DRILLING 13.4.5 TREPAN
DRILLING 13.5 ULTRASHORT-PULSE LASER MACHINING 13.5.0 INTRODUCTION
13.5.1 DIELECTRICS 13.5.2 METALS 13.6 COMPARISON WITH OTHER TECHNOLOGIES
13.6.1 CONSIDERATION OF QUANTITY OF HOLES DRILLED 13.6.2 LARGE DIAMETER
HOLES, 0.025MM (0.001 IN) 13.6.3 SMALL DIAMETER HOLES, 0.025MM
(0.001 IN) 13.6.4 LASER COSTS AND OTHER FACTORS 13.6.5 SUMMARY CHAPTER
14 BALANCING 14.1 BASICS OF BALANCING 14.1.0 INTRODUCTION 14.1.1
CONDITIONS FOR BALANCING 14.1.2 BALANCING PROCEDURES 14.1.3 BALANCING
PROCESS 14.1.4 EXAMPLE: A TYPICAL BALANCING TASK 14.2 LASER BALANCING
PROCEDURES 14.2.0 INTRODUCTION 14.2.1 ADVANTAGES/LIMITATIONS OF LASER
BALANCING 14.2.2 BALANCING SYSTEMS 14.3 SOME APPLICATIONS OF LASER
BALANCING 14.3.1 TIMING WHEEL BALANCING 14.3.2 CLUTCH DISK BALANCING
14.3.3 FREQUENCY SPINDLE BALANCING 14.3.4 OTHER APPLICATIONS CHAPTER 15
MARKING 15.1 BASIC PRINCIPLES 15.2 MATERIALS 15.3 APPROPRIATE LASERS
15.3.1 CO2 LASERS 15.3.2 NDYAG LASERS 15.3.3 EXCIMER LASERS FOR MARKING
15.4 DOT MATRIX MARKING 15.4.1 TECHNIQUES 15.4.2 RESULTS 15.5 ENGRAVING
15.5.1 TECHNIQUES 15.5.2 LASERS 15.5.3 SURFACE EFFECTS 15.5.4 BEAM
MOTION SYSTEMS 15.5.5 MASKING 15.5.6 ENGRAVING RECOMMENDATIONS 15.6
IMAGE MICROMACHINING 15.6.1 TECHNIQUES 15.6.2 RESULTS 15.7 APPLICATIONS
15.7.1 CO2 LASERS 15.7.2 ND:YAG LASERS 15.7.3 EXCIMER LASERS 15.8
COMPARISON WITH OTHER TECHNIQUES CHAPTER 16 RAPID PROTOTYPING 16.0
INTRODUCTION AND GLOSSARY 16.1 BASICS OF LASER BASED RAPID PROTOTYPING
16.1.1 RAPID PROTOTYPING: AN OVERVIEW 16.1.2 LASERS PARAMETERS FOR RP
16.1.3 SCANNING EXPOSURE FACTORS 16.1.4 SMALL SPOT SYSTEMS 16.2
STEREOLITHOGRAPHY 16.2.1 THE STEREOLITHOGRAPHY PROCESS 16.2.2 MATERIALS
FOR STEREOLITHOGRAPHY 16.2.3 LASERS FOR STEREOLITHOGRAPHY 16.2.4
STEREOLITHOGRAPHY IN PRODUCT DEVELOPMENT 16.3 SELECTIVE LASER SINTERING
16.3.1 THE SELECTIVE LASER SINTERING PROCESS 16.3.2 MATERIALS FOR SLS
16.3.3 LASERS FOR SELECTIVE LASER SINTERING 16.3.4 DIRECTED LIGHT
FABRICATION 16.3.5 THE LASER ENGINEERED NET SHAPING PROCESS 16.3.6
RESULTS 16.4 LAMINATED OBJECT MANUFACTURING 16.4.1 THE LOM PROCESS
16.4.2 APPLICATIONS 16.4.3 LASER CUTTING-BASED RAPID PROTOTYPING OPTIONS
FOR METAL AND CERAMIC COMPONENTS 16.5 CAM - LEM PROCESSING OF CERAMIC
AND METAL PARTS 16.5.0 INTRODUCTION 16.5.1 MATERIAL PROPERTIES 16.5.2
MACHINE VARIABLES 16.6 COATING OF RAPID TOOLS BY PULSED LASER DEPOSITION
16.7 ADAPTION OF RP TECHNOLOGY TO THE MANUFACTURE OF DIE CASTING TOOLS
16.8 TABLE: COMPARISON OF RAPID PROTOTYPING SYSTEMS CHAPTER 17 TRIMMING
17.0 INTRODUCTION 17.1 BASICS OF LASER TRIMMING 17.1.1 PHYSICAL
PROCESSES 17.1.2 OVERVIEW OF A LASER TRIMMING SYSTEM 17.1.3 TYPES OF
LASER TRIMS 17.1.4 APPROPRIATE LASERS 17.2 TRIMMING TECHNIQUES 17.2.1
THICK-FILM TRIMMING 17.2.2 THIN FILM ON CERAMIC LASER TRIMMING 17.2.3
CHIP RESISTOR LASER TRIMMING 17.2.4 THIN FILM ON SILICON RESISTOR
TRIMMING 17.2.5 INTERFERENCE EFFECTS CHAPTER 18 LASER MARKING/BRANDING
18.0 INTRODUCTION 18.1 PACKAGE MARKING AND BRANDING 18.1.1 LASER MARKING
IN PRODUCTION 18.1.2 THE MARKING PROCESS 18.1.3 MARK QUALITY CRITERIA
18.2 WAFER SERIALIZATION 18.2.1 TECHNIQUES 18.2.2 RESULTS 18.3 MARKING
OF ELECTRONIC COMPONENTS CHAPTER 19 LINK CUTTING/MAKING 19.1 BASICS OF
LINK PROCESSING WITH LASERS 19.1.0 INTRODUCTION 19.1.1 BASICS OF LINK
CUTTING 19.1.2 MEMORY REPAIR GOALS 19.1.3 PROCESSING CONCERNS 19.1.4
LASERS FOR LINK CUTTING 19.1.5 POSITIONING SYSTEMS 19.1.6 OPTICS 19.1.7
PULSE CONTROL 19.1.8 ENERGY COUPLING 19.1.9 LINK MATERIALS 19.1.10 LINK
DESIGN 19.1.11 LINK GROUPS 19.1.12 ACCURACY 19.1.13 ALIGNMENT STRATEGY
19.2 REDUNDANCY FOR MEMORY YIELD ENHANCEMENT 19.2.0 INTRODUCTION 19.2.1
DEVELOPMENT OF REDUNDANCY 19.2.2 LASER CHOICE 19.2.3 HARDWARE
DESCRIPTION 19.2.4 ABSORPTIVITY CONSIDERATIONS 19.2.5 SPOT SIZE
CONSIDERATION 19.3 LINK MAKING 19.3.0 INTRODUCTION 19.3.1 EARLIER WORK
19.3.2 PRINCIPLES 19.3.3 RELIABILITY 19.3.4 IMPLEMENTATION 19.3.5 LASER
ENERGY 19.3.6 SUMMARY 19.4 PERSONALIZATION 19.4.1 DEFINITIONS AND BASIC
TERMS 19.4.2 PERSONALIZATION BY LINK CUTTING - CHOICE OF LASER 19.4.3
THE PERSONALIZATION PROCESS CHAPTER 20 REPAIR 20.1 REPAIR NEEDS 20.2
SUBSTRATE REPAIR 20.2.1 REPAIR OF SHORTS 20.2.2 REPAIR OF OPENS 20.3
LASER-BASED PHOTOMASK REPAIR CHAPTER 21 APPLICATIONS TO PHOTOLITHOGRAPHY
21.1 OVERVIEW 21.2 LASER SOURCES FOR MICROLITHOGRAPHY EXPOSURE TOOLS
21.2.1 EXCIMER LASERS 21.2.2 DIODE PUMPED HARMONIC ND:YAG LASERS 21.3
ADVANTAGES OF LASER MICROLITHOGRAPHY COMPARED TO OTHER SOURCES 21.4
LASER BASED PHOTOLITHOGRAPHY SYSTEM ISSUES 21.5 DEEP ULTRAVIOLET LASER
PHOTOLITHOGRAPHY 21.5.1 OVERVIEW 21.5.2 HIGH RESOLUTION LITHOGRAPHY
21.5.3 DEEP ULTRAVIOLET LITHOGRAPHY ISSUES CHAPTER 22 FLAT PANEL DISPLAY
22.0 INTRODUCTION 22.1 REPAIR 22.1.1 SHORT REMOVAL 22.1.2 OPEN REPAIR
22.2 MARKING 22.3 LASER PATTERNING INDIUM TIN OXIDE COATED FLAT PANEL
DISPLAYS 22.3.1 NATURE OF INDIUM TIN OXIDE 22.3.2 MASKLESS PATTERN
GENERATION 22.3.3 LASER CHOICES 22.3.4 LASER CUTTING 22.4 ANNEALING OF
THIN-FILM TRANSISTORS CHAPTER 23 HIGH-TEMPERATURE SUPERCONDUCTORS 23.0
INTRODUCTION 23.1 PROCEDURES 23.1.1 TARGETS AND ABLATION 23.1.2
APPROPRIATE LASERS AND SYSTEMS 23.1.3 FILM GROWTH 23.2 RESULTS OF HTSC
DEPOSITION 23.2.1 CHARACTERIZATION 23.2.2 COMPARISON WITH OTHER
TECHNIQUES 23.3 LASER TREATMENT OF HTSC FILMS 23.3.1 MODIFICATION 23.3.2
POLISHING OF THIN HTSC FILMS CHAPTER 24 LASER PRODUCED MICROSTRUCTURES
24.1 BASIC LASER MICROSTRUCTURING PROCEDURES 24.1.0 INTRODUCTION 24.1.1
MICROSTRUCTURING BY LASER DIRECT ABLATION 24.1.2 MICROSTRUCTURING BY
LASER ETCHING 24.2 OTHER METHODS OF LASER MICROSTRUCTURING 24.2.1
LASER-LIGA PROCESSING 24.2.2 LASER MICROSTRUCTURING OF GLASS 24.2.3
LASER MICROSTRUCTURING OF SEMICONDUCTORS CHAPTER 25 ELECTRONIC
PACKAGING: ELECTRICAL INTERCONNECTS 25.0 INTRODUCTION 25.1 VIA DRILLING
25.1.1 LASERS FOR VIA DRILLING 25.1.2 OPTICAL CONFIGURATIONS 25.1.3
APPLICATIONS AND RESULTS 25.2 BONDING/SOLDERING 25.2.1 LASER TAPE
AUTOMATED BONDING (TAB) 25.2.2 LASER REFLOW SOLDERING 25.3 WIRESTRIPPING
25.3.0 INTRODUCTION 25.3.1 IMPORTANT PARAMETERS IN LASER WIRESTRIPPING
25.3.2 LASERS FOR WIRESTRIPPING 25.3.3 WIRESTRIPPING PROCEDURES CHAPTER
26 ELECTRONIC PACKAGING: PACKAGE SEALING AND CERAMIC PROCESSING 26.0
INTRODUCTION 26.1 PACKAGE WELDING 26.1.1 GENERAL CONSIDERATIONS 26.1.2
WELD SCHEDULE DEVELOPMENT 26.1.3 PROCESS MONITORING 26.2 CUTTING AND
SCRIBING OF SUBSTRATES 26.2.0 INTRODUCTION 26.2.1 LASER SELECTION 26.2.2
PROCESS PARAMETERS 26.2.3 PULSE PARAMETERS 26.2.4 OPTICAL CONSIDERATIONS
26.2.5 ASSIST GAS AND NOZZLE CONFIGURATION 26.2.6 HARDWARE
CONSIDERATIONS 26.2.7 COMPARISON OF SCRIBING AND CUTTING 26.2.8 LASER
SCRIBING RESULTS 26.3 HOLE DRILLING IN CERAMICS 26.3.0 INTRODUCTION
26.3.1 ADVANTAGES AND LASER CHOICE 26.3.2 PROCEDURES AND RESULTS CHAPTER
27 FILM DEPOSITION AND DOPING 27.1 THIN FILM DEPOSITION 27.1.1 LASER
CHEMICAL VAPOR DEPOSITION 27.1.2 COATINGS MADE BY LCVD 27.1.3 DIRECT
WRITE PROCESSING USING LCVD 27.1.4 PULSED LASER DEPOSITION 27.2
DEPOSITION OF THICK FILMS OF ELECTRONIC CERAMICS 27.3 GAS IMMERSION
LASER DOPING (GILD) 27.3.1 THEORY OF OPERATION 27.3.2 GILD EQUIPMENT AND
SAMPLE PREPARATION 27.3.3 LASER SOURCES 27.3.4 GAS SOURCES 27.3.5
PROCESS MONITORING AND CALIBRATION 27.3.6 DOPING PROFILES 27.3.7 WAFER
THROUGHPUT
|
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| id | DE-604.BV013859828 |
| illustrated | Illustrated |
| indexdate | 2024-07-09T18:53:18Z |
| institution | BVB |
| institution_GND | (DE-588)305257-6 |
| isbn | 0912035153 0941463028 |
| language | English |
| lccn | 2001088071 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009479299 |
| oclc_num | 47104869 |
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| owner_facet | DE-29T DE-91G DE-BY-TUM DE-1046 DE-1043 DE-522 DE-92 DE-11 |
| physical | XXV, 715 S. Ill., graph. Darst. |
| publishDate | 2001 |
| publishDateSearch | 2001 |
| publishDateSort | 2001 |
| publisher | Laser Inst. of America [u.a.] |
| record_format | marc |
| spelling | Laser Institute of America Verfasser (DE-588)305257-6 aut LIA handbook of laser materials processing ed. in chief: John F. Ready Handbook of laser materials processing 1. ed. Orlando, FL Laser Inst. of America [u.a.] 2001 XXV, 715 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Fabrication - Guides, manuels, etc Lasers - Applications industrielles - Guides, manuels, etc Lasers Industrial applications Handbooks, manuals, etc Fertigung (DE-588)4016899-2 gnd rswk-swf Laserbearbeitung (DE-588)4139080-5 gnd rswk-swf Fertigung (DE-588)4016899-2 s Laserbearbeitung (DE-588)4139080-5 s DE-604 Ready, John F. Sonstige oth SWB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009479299&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | LIA handbook of laser materials processing Fabrication - Guides, manuels, etc Lasers - Applications industrielles - Guides, manuels, etc Lasers Industrial applications Handbooks, manuals, etc Fertigung (DE-588)4016899-2 gnd Laserbearbeitung (DE-588)4139080-5 gnd |
| subject_GND | (DE-588)4016899-2 (DE-588)4139080-5 |
| title | LIA handbook of laser materials processing |
| title_alt | Handbook of laser materials processing |
| title_auth | LIA handbook of laser materials processing |
| title_exact_search | LIA handbook of laser materials processing |
| title_full | LIA handbook of laser materials processing ed. in chief: John F. Ready |
| title_fullStr | LIA handbook of laser materials processing ed. in chief: John F. Ready |
| title_full_unstemmed | LIA handbook of laser materials processing ed. in chief: John F. Ready |
| title_short | LIA handbook of laser materials processing |
| title_sort | lia handbook of laser materials processing |
| topic | Fabrication - Guides, manuels, etc Lasers - Applications industrielles - Guides, manuels, etc Lasers Industrial applications Handbooks, manuals, etc Fertigung (DE-588)4016899-2 gnd Laserbearbeitung (DE-588)4139080-5 gnd |
| topic_facet | Fabrication - Guides, manuels, etc Lasers - Applications industrielles - Guides, manuels, etc Lasers Industrial applications Handbooks, manuals, etc Fertigung Laserbearbeitung |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009479299&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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