Encapsulated micromachined resonant force sensor:
Saved in:
| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
Düsseldorf
VDI-Verl.
2001
|
| Edition: | Als Ms. gedr. |
| Series: | Fortschritt-Berichte VDI
Reihe 9, Elektrotechnik, Elektronik ; 338 |
| Subjects: | |
| Online Access: | Inhaltsverzeichnis |
| Item Description: | Zugl.: Zürich, Eidgenössische Techn. Hochsch., Diss. |
| Physical Description: | XVI, 145 S. Ill., graph. Darst. |
| ISBN: | 3183338092 |
Staff View
MARC
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| 100 | 1 | |a Haueis, Martin |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Encapsulated micromachined resonant force sensor |c Martin Haueis |
| 250 | |a Als Ms. gedr. | ||
| 264 | 1 | |a Düsseldorf |b VDI-Verl. |c 2001 | |
| 300 | |a XVI, 145 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a Fortschritt-Berichte VDI : Reihe 9, Elektrotechnik, Elektronik |v 338 | |
| 500 | |a Zugl.: Zürich, Eidgenössische Techn. Hochsch., Diss. | ||
| 650 | 0 | 7 | |a Mikrosystemtechnik |0 (DE-588)4221617-5 |2 gnd |9 rswk-swf |
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| 650 | 0 | 7 | |a Einkristall |0 (DE-588)4013901-3 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Resonator |0 (DE-588)4131574-1 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Kraftsensor |0 (DE-588)4165452-3 |2 gnd |9 rswk-swf |
| 655 | 7 | |0 (DE-588)4113937-9 |a Hochschulschrift |2 gnd-content | |
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Record in the Search Index
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|---|---|
| adam_text |
V
TABLE
OF
CONTENTS
ACKNOWLEDGMENTS
III
TABLE
OF
CONTENTS
V
LIST
OF
NOTATIONS VIII
ABBREVIATIONS
XII
ABSTRACT
XIII
ZUSANUNENFASSUNG
XV
1
INTRODUCTION
1
1.1
MOTIVATION
AND
OBJECTIVES
.
1
1.2
STATE
OF
THE
ART
-
COMMERCIAL
RESONANT
PRESSURE
GAUGES
.
2
1.3
CONTENTS
OF
THIS
THESIS
.
3
2
THEORY
OF
RESONANT
FORCE
SENSORS
5
2.1
A
RESONANT
STRUCTURE
FOR
FORCE
SENSING
.
5
2.2
LOAD
SENSITIVITY
.
7
2.3
RESONATOR
LAYOUT
.
10
2.4
SUMMARY
.
16
3
DETECTION
OF
RESONANCE
17
3.1
PRINCIPLES
FOR
THE
EXCITATION
OF
A
VIBRATION
.
17
3.2
ELECTROSTATIC
EXCITATION
.
18
3.3
DETECTION
OF
THE
VIBRATION
.
21
3.4
ELECTROSTATIC
DETECTION
.
22
3.4.1
COUPLING
BETWEEN
MECHANICAL
AND
ELECTRICAL
EFFECTS
.
22
3.4.2
ELECTRICAL
TRANSFER
FUNCTION
.
24
3.4.3
CAPACITIVE
READ-OUT
.
29
3.5
FIBRE
OPTICAL
DETECTION
.
31
3.6
SUMMARY
.
35
4
MATERIAL
OF
THE
LOAD
CELL
36
4.1
RANGE
OF
MATERIALS
.
36
VI
4.2
WHY
SILICON?
.
37
5
ENERGY
DISSIPATION
IN
MICRORESONATORS
39
5.1
INTRODUCTION
.
39
5.2
MOLECULAR
DAMPING
.
41
5.2.1
MOLECULAR
DAMPING
OF
MICRORESONATORS
.
41
5.2.2
MOLECULAR
DAMPING
MODELS
.
42
5.2.3
MOLECULE
PRESSURE
ON
A
WALL
.
44
5.2.4
THE
MAXWELLIAN
STREAM
MODEL
.
46
5.2.5
EXPERIMENT
.
48
5.3
SUMMARY
.
50
6
INTRINSIC
LOSS
MECHANISMS
51
6.1
INTRODUCTION
.
51
6.2
CLAMP
LIMITED
Q-FACTOR
.
52
6.3
DISCUSSION
OF
THE
"
WEISBORD
MASS
"
.
53
6.3.1
WEISBORD
'S
IDEA
.
53
6.3.2
THE
ANALYTICAL
WEISBORD
MODEL
.
54
6.3.3
THE
FE
SOLUTION
OF
THE
WEISBORD
MODEL
.
59
6.4
A
BLOCKING
MASS
FOR
RESONATOR
DECOUPLING
.
61
6.4.1
A
RESONANT
STRUCTURE
WITH
BLOCKING
MASSES:
THE
MODEL
.
61
6.4.2
ATTENUATION
OF
A
SINGLE
BLOCKING
MASS
.
63
6.4.3
A
BEAM
CLAMPED
BY
BLOCKING
MASSES:
EQUATIONS
.
65
6.4.4
ANALYTICAL
SOLUTION:
MODE-MAP
AND
CLAMP
REACTIONS
.
66
6.4.5
VERIFICATION
OF
THE
RESULTS
BY
A
FE
MODEL
.
70
6.5
SUMMARY
.
73
7
DESIGN
CONSIDERATIONS
74
7.1
DESIGN
OF
THE
HOUSING:
STATE
OF
THE
ART
.
75
7.2
PACKAGE
DESIGN
.
77
7.2.1
FIRST-LEVEL
PACKAGE
.
77
7.2.2
SENSITIVITY
TO
TEMPERATURE
.
81
7.2.3
SECOND-LEVEL
PACKAGE
.
83
7.2.4
LIFE-TIME
ISSUES
.
84
7.3
SUMMARY
.
84
VII
8
FABRICATION
85
8.1
FABRICATION
OF
SENSOR
ELEMENTS
.
85
8.2
PACKAGING
.
87
8.3
DRIE-ETCHING
.
94
8.4
SUMMARY
.
101
9
MEASUREMENTS
102
9.1
CAPACITIVE
RESONANCE
DETECTION
.
102
9.2
FIBRE
OPTICAL
RESONANCE
DETECTION
.
104
9.3
LOAD
SENSITIVITY
.
108
9.4
IMPACTS
ON
STABILITY
AND
ACCURACY
.
118
9.5
SUMMARY
.
120
10
SUMMARY
AND
CONCLUSION
122
APPENDIX
I
LOAD SENSITIVITY
OF
A
RESONANT
BEAM
125
APPENDIX
II
TEMPERATURE
COEFFICIENT
128
APPENDIX
III
HOUSING
MODES
129
APPENDIX
IV
WEISBORD
MODEL
130
APPENDIX
V
BOUNDARY
CONDITIONS
FOR
A
MASS-BEAM
MODEL
132
PUBLICATIONS
134
PRESENTATIONS
134
REFERENCES
135 |
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| author_facet | Haueis, Martin |
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| author_sort | Haueis, Martin |
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| edition | Als Ms. gedr. |
| format | Book |
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| genre_facet | Hochschulschrift |
| id | DE-604.BV013811304 |
| illustrated | Illustrated |
| indexdate | 2024-07-20T03:53:47Z |
| institution | BVB |
| isbn | 3183338092 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009443020 |
| oclc_num | 48406030 |
| open_access_boolean | |
| owner | DE-210 DE-83 |
| owner_facet | DE-210 DE-83 |
| physical | XVI, 145 S. Ill., graph. Darst. |
| publishDate | 2001 |
| publishDateSearch | 2001 |
| publishDateSort | 2001 |
| publisher | VDI-Verl. |
| record_format | marc |
| series | Fortschritt-Berichte VDI |
| series2 | Fortschritt-Berichte VDI : Reihe 9, Elektrotechnik, Elektronik |
| spelling | Haueis, Martin Verfasser aut Encapsulated micromachined resonant force sensor Martin Haueis Als Ms. gedr. Düsseldorf VDI-Verl. 2001 XVI, 145 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Fortschritt-Berichte VDI : Reihe 9, Elektrotechnik, Elektronik 338 Zugl.: Zürich, Eidgenössische Techn. Hochsch., Diss. Mikrosystemtechnik (DE-588)4221617-5 gnd rswk-swf Silicium (DE-588)4077445-4 gnd rswk-swf Einkristall (DE-588)4013901-3 gnd rswk-swf Resonator (DE-588)4131574-1 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf Kraftsensor (DE-588)4165452-3 gnd rswk-swf (DE-588)4113937-9 Hochschulschrift gnd-content Kraftsensor (DE-588)4165452-3 s Resonator (DE-588)4131574-1 s Gehäuse (DE-588)4156307-4 s Silicium (DE-588)4077445-4 s Einkristall (DE-588)4013901-3 s Mikrosystemtechnik (DE-588)4221617-5 s DE-604 Fortschritt-Berichte VDI Reihe 9, Elektrotechnik, Elektronik ; 338 (DE-604)BV047505631 338 DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009443020&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Haueis, Martin Encapsulated micromachined resonant force sensor Fortschritt-Berichte VDI Mikrosystemtechnik (DE-588)4221617-5 gnd Silicium (DE-588)4077445-4 gnd Einkristall (DE-588)4013901-3 gnd Resonator (DE-588)4131574-1 gnd Gehäuse (DE-588)4156307-4 gnd Kraftsensor (DE-588)4165452-3 gnd |
| subject_GND | (DE-588)4221617-5 (DE-588)4077445-4 (DE-588)4013901-3 (DE-588)4131574-1 (DE-588)4156307-4 (DE-588)4165452-3 (DE-588)4113937-9 |
| title | Encapsulated micromachined resonant force sensor |
| title_auth | Encapsulated micromachined resonant force sensor |
| title_exact_search | Encapsulated micromachined resonant force sensor |
| title_full | Encapsulated micromachined resonant force sensor Martin Haueis |
| title_fullStr | Encapsulated micromachined resonant force sensor Martin Haueis |
| title_full_unstemmed | Encapsulated micromachined resonant force sensor Martin Haueis |
| title_short | Encapsulated micromachined resonant force sensor |
| title_sort | encapsulated micromachined resonant force sensor |
| topic | Mikrosystemtechnik (DE-588)4221617-5 gnd Silicium (DE-588)4077445-4 gnd Einkristall (DE-588)4013901-3 gnd Resonator (DE-588)4131574-1 gnd Gehäuse (DE-588)4156307-4 gnd Kraftsensor (DE-588)4165452-3 gnd |
| topic_facet | Mikrosystemtechnik Silicium Einkristall Resonator Gehäuse Kraftsensor Hochschulschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009443020&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| volume_link | (DE-604)BV047505631 |
| work_keys_str_mv | AT haueismartin encapsulatedmicromachinedresonantforcesensor |