Encapsulated micromachined resonant force sensor:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Düsseldorf
VDI-Verl.
2001
|
| Ausgabe: | Als Ms. gedr. |
| Schriftenreihe: | Fortschritt-Berichte VDI
Reihe 9, Elektrotechnik, Elektronik ; 338 |
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Zugl.: Zürich, Eidgenössische Techn. Hochsch., Diss. |
| Beschreibung: | XVI, 145 S. Ill., graph. Darst. |
| ISBN: | 3183338092 |
Internformat
MARC
| LEADER | 00000nam a2200000 cb4500 | ||
|---|---|---|---|
| 001 | BV013811304 | ||
| 003 | DE-604 | ||
| 005 | 20020104 | ||
| 007 | t | ||
| 008 | 010703s2001 gw ad|| mm|| 00||| eng d | ||
| 016 | 7 | |a 961764104 |2 DE-101 | |
| 020 | |a 3183338092 |9 3-18-333809-2 | ||
| 035 | |a (OCoLC)48406030 | ||
| 035 | |a (DE-599)BVBBV013811304 | ||
| 040 | |a DE-604 |b ger |e rakddb | ||
| 041 | 0 | |a eng | |
| 044 | |a gw |c DE | ||
| 049 | |a DE-210 |a DE-83 | ||
| 084 | |a ZQ 3700 |0 (DE-625)158072: |2 rvk | ||
| 100 | 1 | |a Haueis, Martin |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Encapsulated micromachined resonant force sensor |c Martin Haueis |
| 250 | |a Als Ms. gedr. | ||
| 264 | 1 | |a Düsseldorf |b VDI-Verl. |c 2001 | |
| 300 | |a XVI, 145 S. |b Ill., graph. Darst. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a Fortschritt-Berichte VDI : Reihe 9, Elektrotechnik, Elektronik |v 338 | |
| 500 | |a Zugl.: Zürich, Eidgenössische Techn. Hochsch., Diss. | ||
| 650 | 0 | 7 | |a Mikrosystemtechnik |0 (DE-588)4221617-5 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Silicium |0 (DE-588)4077445-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Einkristall |0 (DE-588)4013901-3 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Resonator |0 (DE-588)4131574-1 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Kraftsensor |0 (DE-588)4165452-3 |2 gnd |9 rswk-swf |
| 655 | 7 | |0 (DE-588)4113937-9 |a Hochschulschrift |2 gnd-content | |
| 689 | 0 | 0 | |a Kraftsensor |0 (DE-588)4165452-3 |D s |
| 689 | 0 | 1 | |a Resonator |0 (DE-588)4131574-1 |D s |
| 689 | 0 | 2 | |a Gehäuse |0 (DE-588)4156307-4 |D s |
| 689 | 0 | 3 | |a Silicium |0 (DE-588)4077445-4 |D s |
| 689 | 0 | 4 | |a Einkristall |0 (DE-588)4013901-3 |D s |
| 689 | 0 | 5 | |a Mikrosystemtechnik |0 (DE-588)4221617-5 |D s |
| 689 | 0 | |5 DE-604 | |
| 830 | 0 | |a Fortschritt-Berichte VDI |v Reihe 9, Elektrotechnik, Elektronik ; 338 |w (DE-604)BV047505631 |9 338 | |
| 856 | 4 | 2 | |m DNB Datenaustausch |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009443020&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
Datensatz im Suchindex
| _version_ | 1805068668539764736 |
|---|---|
| adam_text |
V
TABLE
OF
CONTENTS
ACKNOWLEDGMENTS
III
TABLE
OF
CONTENTS
V
LIST
OF
NOTATIONS VIII
ABBREVIATIONS
XII
ABSTRACT
XIII
ZUSANUNENFASSUNG
XV
1
INTRODUCTION
1
1.1
MOTIVATION
AND
OBJECTIVES
.
1
1.2
STATE
OF
THE
ART
-
COMMERCIAL
RESONANT
PRESSURE
GAUGES
.
2
1.3
CONTENTS
OF
THIS
THESIS
.
3
2
THEORY
OF
RESONANT
FORCE
SENSORS
5
2.1
A
RESONANT
STRUCTURE
FOR
FORCE
SENSING
.
5
2.2
LOAD
SENSITIVITY
.
7
2.3
RESONATOR
LAYOUT
.
10
2.4
SUMMARY
.
16
3
DETECTION
OF
RESONANCE
17
3.1
PRINCIPLES
FOR
THE
EXCITATION
OF
A
VIBRATION
.
17
3.2
ELECTROSTATIC
EXCITATION
.
18
3.3
DETECTION
OF
THE
VIBRATION
.
21
3.4
ELECTROSTATIC
DETECTION
.
22
3.4.1
COUPLING
BETWEEN
MECHANICAL
AND
ELECTRICAL
EFFECTS
.
22
3.4.2
ELECTRICAL
TRANSFER
FUNCTION
.
24
3.4.3
CAPACITIVE
READ-OUT
.
29
3.5
FIBRE
OPTICAL
DETECTION
.
31
3.6
SUMMARY
.
35
4
MATERIAL
OF
THE
LOAD
CELL
36
4.1
RANGE
OF
MATERIALS
.
36
VI
4.2
WHY
SILICON?
.
37
5
ENERGY
DISSIPATION
IN
MICRORESONATORS
39
5.1
INTRODUCTION
.
39
5.2
MOLECULAR
DAMPING
.
41
5.2.1
MOLECULAR
DAMPING
OF
MICRORESONATORS
.
41
5.2.2
MOLECULAR
DAMPING
MODELS
.
42
5.2.3
MOLECULE
PRESSURE
ON
A
WALL
.
44
5.2.4
THE
MAXWELLIAN
STREAM
MODEL
.
46
5.2.5
EXPERIMENT
.
48
5.3
SUMMARY
.
50
6
INTRINSIC
LOSS
MECHANISMS
51
6.1
INTRODUCTION
.
51
6.2
CLAMP
LIMITED
Q-FACTOR
.
52
6.3
DISCUSSION
OF
THE
"
WEISBORD
MASS
"
.
53
6.3.1
WEISBORD
'S
IDEA
.
53
6.3.2
THE
ANALYTICAL
WEISBORD
MODEL
.
54
6.3.3
THE
FE
SOLUTION
OF
THE
WEISBORD
MODEL
.
59
6.4
A
BLOCKING
MASS
FOR
RESONATOR
DECOUPLING
.
61
6.4.1
A
RESONANT
STRUCTURE
WITH
BLOCKING
MASSES:
THE
MODEL
.
61
6.4.2
ATTENUATION
OF
A
SINGLE
BLOCKING
MASS
.
63
6.4.3
A
BEAM
CLAMPED
BY
BLOCKING
MASSES:
EQUATIONS
.
65
6.4.4
ANALYTICAL
SOLUTION:
MODE-MAP
AND
CLAMP
REACTIONS
.
66
6.4.5
VERIFICATION
OF
THE
RESULTS
BY
A
FE
MODEL
.
70
6.5
SUMMARY
.
73
7
DESIGN
CONSIDERATIONS
74
7.1
DESIGN
OF
THE
HOUSING:
STATE
OF
THE
ART
.
75
7.2
PACKAGE
DESIGN
.
77
7.2.1
FIRST-LEVEL
PACKAGE
.
77
7.2.2
SENSITIVITY
TO
TEMPERATURE
.
81
7.2.3
SECOND-LEVEL
PACKAGE
.
83
7.2.4
LIFE-TIME
ISSUES
.
84
7.3
SUMMARY
.
84
VII
8
FABRICATION
85
8.1
FABRICATION
OF
SENSOR
ELEMENTS
.
85
8.2
PACKAGING
.
87
8.3
DRIE-ETCHING
.
94
8.4
SUMMARY
.
101
9
MEASUREMENTS
102
9.1
CAPACITIVE
RESONANCE
DETECTION
.
102
9.2
FIBRE
OPTICAL
RESONANCE
DETECTION
.
104
9.3
LOAD
SENSITIVITY
.
108
9.4
IMPACTS
ON
STABILITY
AND
ACCURACY
.
118
9.5
SUMMARY
.
120
10
SUMMARY
AND
CONCLUSION
122
APPENDIX
I
LOAD SENSITIVITY
OF
A
RESONANT
BEAM
125
APPENDIX
II
TEMPERATURE
COEFFICIENT
128
APPENDIX
III
HOUSING
MODES
129
APPENDIX
IV
WEISBORD
MODEL
130
APPENDIX
V
BOUNDARY
CONDITIONS
FOR
A
MASS-BEAM
MODEL
132
PUBLICATIONS
134
PRESENTATIONS
134
REFERENCES
135 |
| any_adam_object | 1 |
| author | Haueis, Martin |
| author_facet | Haueis, Martin |
| author_role | aut |
| author_sort | Haueis, Martin |
| author_variant | m h mh |
| building | Verbundindex |
| bvnumber | BV013811304 |
| classification_rvk | ZQ 3700 |
| ctrlnum | (OCoLC)48406030 (DE-599)BVBBV013811304 |
| discipline | Mess-/Steuerungs-/Regelungs-/Automatisierungstechnik / Mechatronik |
| edition | Als Ms. gedr. |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>00000nam a2200000 cb4500</leader><controlfield tag="001">BV013811304</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20020104</controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">010703s2001 gw ad|| mm|| 00||| eng d</controlfield><datafield tag="016" ind1="7" ind2=" "><subfield code="a">961764104</subfield><subfield code="2">DE-101</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3183338092</subfield><subfield code="9">3-18-333809-2</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)48406030</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV013811304</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rakddb</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">gw</subfield><subfield code="c">DE</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-210</subfield><subfield code="a">DE-83</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZQ 3700</subfield><subfield code="0">(DE-625)158072:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Haueis, Martin</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Encapsulated micromachined resonant force sensor</subfield><subfield code="c">Martin Haueis</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">Als Ms. gedr.</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Düsseldorf</subfield><subfield code="b">VDI-Verl.</subfield><subfield code="c">2001</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">XVI, 145 S.</subfield><subfield code="b">Ill., graph. Darst.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Fortschritt-Berichte VDI : Reihe 9, Elektrotechnik, Elektronik</subfield><subfield code="v">338</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Zugl.: Zürich, Eidgenössische Techn. Hochsch., Diss.</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikrosystemtechnik</subfield><subfield code="0">(DE-588)4221617-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Silicium</subfield><subfield code="0">(DE-588)4077445-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Einkristall</subfield><subfield code="0">(DE-588)4013901-3</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Resonator</subfield><subfield code="0">(DE-588)4131574-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Kraftsensor</subfield><subfield code="0">(DE-588)4165452-3</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)4113937-9</subfield><subfield code="a">Hochschulschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Kraftsensor</subfield><subfield code="0">(DE-588)4165452-3</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Resonator</subfield><subfield code="0">(DE-588)4131574-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Silicium</subfield><subfield code="0">(DE-588)4077445-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="4"><subfield code="a">Einkristall</subfield><subfield code="0">(DE-588)4013901-3</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="5"><subfield code="a">Mikrosystemtechnik</subfield><subfield code="0">(DE-588)4221617-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Fortschritt-Berichte VDI</subfield><subfield code="v">Reihe 9, Elektrotechnik, Elektronik ; 338</subfield><subfield code="w">(DE-604)BV047505631</subfield><subfield code="9">338</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">DNB Datenaustausch</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009443020&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield></record></collection> |
| genre | (DE-588)4113937-9 Hochschulschrift gnd-content |
| genre_facet | Hochschulschrift |
| id | DE-604.BV013811304 |
| illustrated | Illustrated |
| indexdate | 2024-07-20T03:53:47Z |
| institution | BVB |
| isbn | 3183338092 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-009443020 |
| oclc_num | 48406030 |
| open_access_boolean | |
| owner | DE-210 DE-83 |
| owner_facet | DE-210 DE-83 |
| physical | XVI, 145 S. Ill., graph. Darst. |
| publishDate | 2001 |
| publishDateSearch | 2001 |
| publishDateSort | 2001 |
| publisher | VDI-Verl. |
| record_format | marc |
| series | Fortschritt-Berichte VDI |
| series2 | Fortschritt-Berichte VDI : Reihe 9, Elektrotechnik, Elektronik |
| spelling | Haueis, Martin Verfasser aut Encapsulated micromachined resonant force sensor Martin Haueis Als Ms. gedr. Düsseldorf VDI-Verl. 2001 XVI, 145 S. Ill., graph. Darst. txt rdacontent n rdamedia nc rdacarrier Fortschritt-Berichte VDI : Reihe 9, Elektrotechnik, Elektronik 338 Zugl.: Zürich, Eidgenössische Techn. Hochsch., Diss. Mikrosystemtechnik (DE-588)4221617-5 gnd rswk-swf Silicium (DE-588)4077445-4 gnd rswk-swf Einkristall (DE-588)4013901-3 gnd rswk-swf Resonator (DE-588)4131574-1 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf Kraftsensor (DE-588)4165452-3 gnd rswk-swf (DE-588)4113937-9 Hochschulschrift gnd-content Kraftsensor (DE-588)4165452-3 s Resonator (DE-588)4131574-1 s Gehäuse (DE-588)4156307-4 s Silicium (DE-588)4077445-4 s Einkristall (DE-588)4013901-3 s Mikrosystemtechnik (DE-588)4221617-5 s DE-604 Fortschritt-Berichte VDI Reihe 9, Elektrotechnik, Elektronik ; 338 (DE-604)BV047505631 338 DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009443020&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Haueis, Martin Encapsulated micromachined resonant force sensor Fortschritt-Berichte VDI Mikrosystemtechnik (DE-588)4221617-5 gnd Silicium (DE-588)4077445-4 gnd Einkristall (DE-588)4013901-3 gnd Resonator (DE-588)4131574-1 gnd Gehäuse (DE-588)4156307-4 gnd Kraftsensor (DE-588)4165452-3 gnd |
| subject_GND | (DE-588)4221617-5 (DE-588)4077445-4 (DE-588)4013901-3 (DE-588)4131574-1 (DE-588)4156307-4 (DE-588)4165452-3 (DE-588)4113937-9 |
| title | Encapsulated micromachined resonant force sensor |
| title_auth | Encapsulated micromachined resonant force sensor |
| title_exact_search | Encapsulated micromachined resonant force sensor |
| title_full | Encapsulated micromachined resonant force sensor Martin Haueis |
| title_fullStr | Encapsulated micromachined resonant force sensor Martin Haueis |
| title_full_unstemmed | Encapsulated micromachined resonant force sensor Martin Haueis |
| title_short | Encapsulated micromachined resonant force sensor |
| title_sort | encapsulated micromachined resonant force sensor |
| topic | Mikrosystemtechnik (DE-588)4221617-5 gnd Silicium (DE-588)4077445-4 gnd Einkristall (DE-588)4013901-3 gnd Resonator (DE-588)4131574-1 gnd Gehäuse (DE-588)4156307-4 gnd Kraftsensor (DE-588)4165452-3 gnd |
| topic_facet | Mikrosystemtechnik Silicium Einkristall Resonator Gehäuse Kraftsensor Hochschulschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=009443020&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| volume_link | (DE-604)BV047505631 |
| work_keys_str_mv | AT haueismartin encapsulatedmicromachinedresonantforcesensor |